PRODUCT SPECIFICATION DATE: 03/08/2005 cosmo H.P LED : NO. 61L70009 KLH00AXX4 ELECTRONICS CORPORATION REV. 1 SHEET 1 OF 6 1. Features Cosmo’s high power LED packages can handle up to 350-500mA DC current, and available in 590nm wavelength in mono or multiple colors. These packages are formed by bonding 4 pcs of 40 mil LED chips on a 20mmx20mm metal PCB. A heat sink is mechanically screwed to the board to cool down metal surface temperature below 70 oC. The main features of these packages are as follows： l Very high flux output per LED. l Flat PCB package. On each PCB, the quantity of LED being adjustable from 1 to 4 to meet user’s need. These LEDs being connected in series. l Very long operation life time up to 100k hours attainable, by using a proper heat sink. l 130±10o cool beam in most packages. 2. Applications l l l l l l l l l Outdoor and indoor architectural lighting Reading light (car/bus/aircraft) Decorative/entertainment lighting Bollards/Security/Garden lighting Traffic signal Portable lighting (flashlight/bicycle) Edge-lit signs (exit sign/point of sales) LCD backlights Light guide 3. Operation and Storage Temperature Parameter Operation temperature Storage temperature Symbol Topr Tstg Value (Data to be ready, -30~+85) (Data to be ready, -40~+110) Unit o C o C PRODUCT SPECIFICATION DATE: 03/08/2005 H.P LED : cosmo NO. 61L70009 KLH00AXX4 ELECTRONICS CORPORATION SHEET 2 OF 6 REV. 1 4. Dimensions l 35(L)x35(W)x12(H)mm 35 20 Heat Sink LIGHT SOURCE 3.0 35 20 LIGHT SOURCE 2.0 0.7 1.7 Metal PCB Metal PCB LIGHT SOURCE 6 LIGHT SOURCE Screw hole 3 Heat Sink 10 Screw hole 1 5 A1 1 4 2 3 1 2 A4 A2 A4 A1 5 A3 4 A2 3 A1 2 3 A3 A2 A3 4 4 3 2 A4 5 5. Flux Characteristics Flux characteristics of mono color LED at 350mA, junction temperature, Ta = 25 oC Chip quantity：4 LEDs/PCB Part Number Color/Wavelength Forward (λd) Voltage (Vf) Luminous Flux (lm) Wattage Max. (W) View angle ( 2θ 1 ) 2 KLH00AXX4 Amber/590nm Typ. Max Min Typ. 9.2 10.4 54 62 3.6 130±10 o PRODUCT SPECIFICATION DATE: 03/08/2005 H.P LED : cosmo NO. 61L70009 KLH00AXX4 ELECTRONICS CORPORATION SHEET 3 OF 6 6. Wavelength Characteristics l Relative spectral power intensity vs. wavelength (Ta=25 oC) Relative spectral power intensity Relative spectral power intensity vs. Wavelength 1.2 A (597.0 nm) 1 0.8 0.6 0.4 0.2 0 350 450 550 650 750 Wavelength [λp, nm] 7. Light Output Characteristics l Relative light output vs. junction temperature Relative Luminous Flux [a.u] Ambient Temperature vs. Relative Luminous Flux 10.00 1.00 0.10 -40 -20 0 20 40 60 o Ambient Temperature Ta ( C) 80 100 REV. 1 PRODUCT SPECIFICATION DATE: 03/08/2005 H.P LED : cosmo NO. 61L70009 KLH00AXX4 ELECTRONICS CORPORATION REV. 1 SHEET 4 OF 6 8. Forward Current Characteristics l Forward current vs. relative luminous flux (Ta=25 oC) Forward Current vs. Relative Luminous Flux Relative Luminous Flux [a.u.] 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 200 400 600 800 1000 Forward Current IF (mA) l Forward voltage vs. forward current (4 LEDs/PCB, Ta=25 oC) Forward Voltage vs. Forward Current [4 chip] Forward Current IF (mA) 10000 1000 100 10 1 6 5.0 7 5.5 8 6.0 9 6.5 10 7.0 11 7.5 Forward Voltage VF (V) 12 8.0 13 8.5 14 9.0 PRODUCT SPECIFICATION DATE: 03/08/2005 cosmo H.P LED : NO. 61L70009 REV. 1 SHEET 5 OF 6 KLH00AXX4 ELECTRONICS CORPORATION l Forward voltage vs. ambient temperature (4 LEDs/PCB, IF=350mA) Forward Voltage VF (V) Ambient Temperature vs. Forward Voltage 11 10.8 10.6 10.4 10.2 10 9.8 9.6 9.4 9.2 9 8.8 8.6 8.4 -40 -20 0 20 40 60 o Ambient Temperature Ta[ C] 9. Spatial Radiation Pattern l 4 Chip/PCB 80 100 PRODUCT SPECIFICATION DATE: 03/08/2005 H.P LED : cosmo KLH00AXX4 ELECTRONICS CORPORATION NO. 61L70009 REV. 1 SHEET 6 OF 6 10. Reliability Test Stress Test 1.High temperature Stress Conditions 1,000 hrs 0/12 -40 oC at 350 mA 1,000 hrs 0/12 85 oC / 60% RH at 350 mA 1,000 hrs 0/12 200 cycles 0/12 200 cycles 0/12 110 oC 1,000 hrs 0/12 -40 oC 1,000 hrs 0/12 60 oC / 90% RH 1,000 hrs 0/12 200 cycles 0/12 operation life o 5.Powered temperature (1.)-45 C/18min at 350 mA cycle (1)Iv< 50% degradation 25 oC at 350 mA operation life 4. Wet high temperature Failure rate 1,000 hrs operation life 3. Low temperature Failure Criteria 85 oC at 350mA operation life 2.Room temperature Stress Duration (2.)Transform /42min (2)Vf max=110% initial 0/12 (3.)85 oC /18min at 350 mA (1.)-45 oC /30 min 6.Temperature Cycle (2.)25 oC /5 min o (3.)120 C /30 min (4.)25 oC /5 min 7.High temperature storage 8. Low temperature storage 9.High temperature humidity storage (1.)-40 oC /20min 10.Thermal shock (2.)Transform /20sec (3.)110 oC /20min