FUJITSU SEMICONDUCTOR CM71-00416-1E CONTROLLER MANUAL DSU-FR EMULATOR MEMORY UNIT FOR MB2198-100 MB2198-90 HARDWARE MANUAL DSU-FR EMULATOR MEMORY UNIT FOR MB2198-100 MB2198-90 HARDWARE MANUAL FUJITSU LIMITED PREFACE ■ Using the product safely This manual provides important information on using this product safely. Read it before using the product and observe all instructions. Be sure to read "Safety Precautions" at the beginning of this manual to ensure safe use of the product. After reading this manual, keep it handy for reference. ■ Purpose of this document and intended reader The MB2198-90 is used in combination with MB2198-01, MB2198-100 and MB2198-101 and is a development support tool for developing and assessing applications using the MB91308 series, etc. This manual describes MB2198-90 (hereinafter called memory unit) handling and setup procedures for engineers developing applications using the MB91301 series, etc. based on the MB2198-90. ■ Trademarks FR is the abbreviation of FUJITSU RISC Controller. Other system and product names in this manual are trademarks of respective companies or organizations. The symbols TM and (R) are sometimes omitted in the text. ■ Operating environment of the product The operating temperature for the product ranges from 5 °C to 35 °C and the operating relative humidity from 20% to 80%. Do not place it where it is hot and humid. Do not allow condensation to form on the product. The product, which consists of a PC board, is not enclosed in a cabinet, thereby exposing all components on the PC board. Therefore, do not place any objects on the product, or do not let your body or an electrically charged object contact any metal part of the product. After the product is turned on, keep any object or substance that could cause a short-circuit and any inflammable objects or substances away from the product. Use it on a flat surface and avoid places exposed to strong vibration, dust or explosive gas. Using the product in an environment different from the one described above may result in injury to the user and bystanders and in property damage. Keep the packaging materials the product was delivered in as they may be required if the product breaks down and has to be sent in for repair. ■ Safety precautions The following tables contain descriptions of important warnings in this manual and indicate the pages on which they appear. Before using the product, read these pages so that you fully understand the requirements for safe use of the product. i CAUTION Indication CAUTION ii The product and accessories connected to the product may be damaged if not used correctly. Type of warning page Memory Unit is connected to the external bus of the evaluation MCU directly. Thus to use the memory unit, the user system must be designed to enable memory unit connection. 2 The device might be damaged when transported again. Use the package used at the delivery, and peak them as it was packed. 3 Do not put anything on the adapter. 5 Make sure that power to the product is turned off before connecting or disconnecting connectors. 5 To prevent electrostatic discharge, do not touch, and do not let any object contact, any metal part of the product, such as connector pins. 5 The adapter has many exposed parts sharp-pointed and edged such as monitor pins. Handle the adapter with meticulous care not to get injured. 5 Please follow this book about setting and use. 5 Do not put anything on the adapter. When stored, the adapter should be kept in the packing box as it has no housing. 5 Do not apply shock to the adapter. 5 Do not expose the product to direct sunlight, and do not place it where it is hot and humid. Do not allow condensation to form on the product. 5 Do not store the product where it is exposed for a long time to relatively strong electric or magnetic fields. 5 Using the product outside the scope specified may result in device problems. Always use the product within its specifications. 10 The connection of headers to the user system must ensure "Structural design" and "Improvements in dimensional accuracy" to provide reliable connection. As a result, it is delicately made and the its strength is comparitively weak. When connecting the memory unit and adapter to the header, hold the header to ensure it is not exposed to excessive pressure. 18 ■ Organization of this document This manual consists of the following three chapters. Be sure to read them thoroughly before using the product. Overview and Handling of the Product This chapter explains the product, its components and features, and how this product is used. Explanation of the Product This chapter explains the system configuration, part names, and general specifications of this product. Functional description The function of the memory unit is explained. iii • • • • • • The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party' s intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. ©2003 FUJITSU LIMITED Printed in Japan iv CONTENTS CHAPTER 1 1.1 1.2 1.3 1.4 CHAPTER 2 2.1 2.2 2.3 2 3 4 5 Description ................................................................................................. 7 System configuration .......................................................................................................................... 8 Appearance and Part Names ............................................................................................................. 9 General Specification ........................................................................................................................ 10 CHAPTER 3 3.1 3.2 3.3 3.4 3.5 3.6 Overview and Handling of the Product .................................................... 1 Overview ............................................................................................................................................. Confirmation of packing parts ............................................................................................................. Option ................................................................................................................................................. Handling Notes on Memory Unit ......................................................................................................... Functional description ............................................................................. 11 Specification of Function ................................................................................................................... Block diagram ................................................................................................................................... AC Characteristics ............................................................................................................................ Switch for Memory Units Setting ....................................................................................................... Connections ...................................................................................................................................... Restrictions ....................................................................................................................................... 12 13 14 16 18 19 v vi CHAPTER 1 Overview and Handling of the Product This manual describes the MB2198-90 memory unit and how to handle it. 1.1 Overview 1.2 Confirmation of packing parts 1.3 Option 1.4 Handling Notes on Memory Unit 1 CHAPTER 1 Overview and Handling of the Product 1.1 Overview Memory units are tools for developing and assessing hardware and software that are used with MB2198-100 and MB2198-101 and that used MCUs such as MB91301 series, etc. ■ OVERVIEW The memory unit can be used as alternate memory for external memory on user system. Use of a memory unit instead of the external ROM of the user system makes it possible to write data to ROM and efficiently debug data when emulators that do not support DSU-FR emulator (MB219801) emulation memory are used. Memory units are connected to the FR-DSU emulator PGA-176P adapter (MB2198-100, hereinafter called adapter) and FR-DSU emulator LQFP-144P header (MB2198-101, hereinafter called header). A main feature of the memory unit is as follows. • The memory unit can be connected between adaptor and header. • Size 16/32bit of the data bus is changeable. • Memory capacity: Max 4 MB at 32-bit bus width, Max 2 MB at 16-bit bus width • Access time = 21.2 ns • The user power supply input corresponds to 3.3V + /-10%. CAUTION CAUTION 2 Memory Unit is connected to the external bus of the evaluation MCU directly. Thus to use the memory unit, the user system must be designed to enable memory unit connection. CHAPTER 1 Overview and Handling of the Product 1.2 Confirmation of packing parts Before using the memory unit, make sure that the following packed components have been delivered. ■ Confirmation of packing material Before using the memory unit, make sure that the following packed components have been delivered: • Memory unit: 1 • Hardware Manual (Japanese version): 1 • Hardware Manual (English version, this manual): 1 CAUTION CAUTION The device might be damaged when transported again. Keep the packaging materials used for shipment and use them when re-transporting the adapter. 3 CHAPTER 1 Overview and Handling of the Product 1.3 Option Table 1.3-1 "Optional Items" lists the items available as options to this product. ■ Option Table 1.3-1 Optional Items Name Model DSU-FR emulator * MB2198-01 DSU-FR cable MB2198-10 PGA-176P adaptor for DSU-FR emulator MB2198-100 LQFP-144P rivet and bolt header for DSU-FR emulator MB2198-101 *:To use the emulator, Softune Workbench or other debugger and a communication cable must be provided. For details, consult the Fujitsu sales representative. 4 CHAPTER 1 Overview and Handling of the Product 1.4 Handling Notes on Memory Unit Take the following precautions on handling the memory unit. ■ Handling Notes on Memory Unit Take the following precautions on handling the memory unit. CAUTION CAUTION • Do not put anything on the adapter. • Make sure that power to the product is turned off before connecting or disconnecting connectors. • To prevent electrostatic discharge, do not touch, and do not let any object contact, any metal part of the product, such as connector pins. • The adapter has many exposed parts sharp-pointed and edged such as monitor pins. Handle the adapter with meticulous care not to get injured. • Please follow this book about setting and use. ■ Storage Take the following precautions on keeping the memory unit. CAUTION CAUTION • Do not put anything on the adapter. When stored, the adapter should be kept in the packing box as it has no housing. • Do not apply shock to the adapter. • Do not expose the product to direct sunlight, and do not place it where it is hot and humid. Do not allow condensation to form on the product. • Do not store the product where it is exposed for a long time to relatively strong electric or magnetic fields. Table 1.4-1 lists the temperature and humidity to be maintained operation and those to be maintained during storage Table 1.4-1 Operating/storing environment State temperature Humidity at operation 5 °C to 35 °C 20% to 80% (No condensation) During storage 0 °C to 70 °C 20% to 80% (No condensation) 5 CHAPTER 1 Overview and Handling of the Product 6 CHAPTER 2 Description This chapter explains the hardware configuration, part names, and general specifications of this product. 2.1 System configuration 2.2 Appearance and Part Names 2.3 General Specification 7 CHAPTER 2 Description 2.1 System configuration This products have built-in evaluation MCU, and are used by connecting the emulator. ■ System configuration Figure 2.1-1 shows system configuration. Figure 2.1-1 System configuration Evaluation MCU Personal Computer USB or LAN or RS-232C Emulator Header DSU cable Adapter Memory Unit User System supplied IC Socket ( NQPACK144SE) For details on adapter and emulator connection, refer to the adapter manual and the emulator hardware manual. For details on header and user system connection, refer to the header instruction manual. To use the emulator, you need the host computer and emulator debugger software separately from this product. Please refer to the emulator manual for emulator specifications. The adapter can be directly connected to header. For details, refer to the instruction manual of adapter and header. 8 CHAPTER 2 Description 2.2 Appearance and Part Names Figure 2.2-1 shows appearance and part names. ■ Appearance and Part Names Figure 2.2-1 shows appearance and part names. Figure 2.2-1 Appearance Adapter I/F Connector Header I/F Connector (mounted on the other side) Switch for Setting Memory Unit Header I/F Connector (mounted on the other side) 9 CHAPTER 2 Description 2.3 General Specification Table 2.3-1 shows general specification of memory unit. ■ General Specification Table 2.3-1 shows general specification of memory unit. Table 2.3-1 General Specification Item Description Remark part number memory unit for MB2198-100 Model MB2198-90 Power supply Voltage: 3.3 V ± 0.3 V * Operating temperature/storage temperature 5 °C to 35 °C / 0 °C to 70 °C No do be dewy. Operating humidity/storage humidity 20% to 80% / 20% to 80% No do be dewy. Package Dimension W 66mm × D 84mm × H 13mm None Weight 32g None *:Supply by user system CAUTION CAUTION 10 Using the product outside the scope specified (see Table 2.3-1) may result in device problems. Always use the product within its specifications. CHAPTER 3 Functional description This chapter explains the function of the memory unit. 3.1 Specification of Function 3.2 Block diagram 3.3 AC Characteristics 3.4 Switch for Memory Units Setting 3.5 Connections 3.6 Restrictions 11 CHAPTER 3 Functional description 3.1 Specification of Function Table 3.1-1 shows memory unit functional specification. ■ Memory unit functional specification list Table 3.1-1 shows memory unit functional specification. Table 3.1-1 Memory unit functional specification Item Specification Adapter’s Functions The adapter interface connector and header interface connector enable connection of adapters and headers. Emulation Emulating the external memory Memory capacity : Max 4M bytes at 32-bit bus width : Max 2M bytes at 16-bit bus width Access time = 21.2 ns Switch of data bus size Switch of width of bus (32 bits/16 bits) For details, see “Section 1.4". Memory capacity specification function ÅEThe capacity of the memory is specifiable. For details, see “Section 1.4". 12 CHAPTER 3 Functional description 3.2 Block diagram Figure 3.2-1 shows the block diagram. ■ Block diagram of memory unit Figure 3.2-1 shows the block diagram. Figure 3.2-1 Block diagram Adapter I/F Connector D15 - D0 D31 - D16 D31 - D16 A15 - A2 Buffer SRAM1 MA14 - MA1 MA19 - MA15 MA0 A21 to Adapter A1 LB0 A20 - A16 UB0 WE EWR0 OE0 EWR1 CE0 PLD (Bus Control) D15 - D0 SRAM2 MA14 - MA1 MA19 - MA15 MA0 EWR2 LB1 EWR3 UB1 WE RD OE ECS CE1 VCC EMRAM SRAM1+SRAM2=4M bytes Switch for Setting Memory Unit Other Direct connetion without load connetion Header I/F Connector to Header Note: - The switch for setting the memory unit is used to set the external memory emulation function. - The CS signal specified by the Softune Workbench as the ECS output is not supplied to the user system. For details on how to set the ECS, refer to Softune Workbench and other debugging software manuals. - ECS,EWR3 to EWR0, and EXRAM are dedicated pins for the evaluation MCU. These are not connected to the user system. 13 CHAPTER 3 Functional description 3.3 AC Characteristics The AC characteristic of the memory unit is shown. Set up Evaluation MCU external bus interface based on these specifications when a memory unit is used. ■ AC characteristic of memory unit Figure 3.4-1 and Table 3.4-1 show AC spec verification. The value below is calculated from device AC characteristics in the memory unit and required by adapter interface connectors on the memory unit side. Figure 3.3-1 Cycle trc A21 - A0 tacc toh tco ECS tcod toe RD todo toee D31 - D0 (data out) Symble trc tacc tco toe toh tcoe toee tcod todo 14 OUTPUT DATA VALID tcoe Item read cycle address access time ECS access time RD access time output data hold time ECS output enable time RD output enable time ECS output disable time RD output disable time min 21.2 3 7.6 5.6 - max 16.6 16.6 10.6 11.6 11.6 unit ns CHAPTER 3 Functional description Figure 3.3-2 Write Cycle twc A21 - A0 taw tas twp twr EWE3 - EWE0 tcw ECS todw D31 - D0 (data out) toew High Impedance tds D31 - D0 (data in) Symble twc twp tcw taw tas twr tds tdh toew todw tdh DATA IN STABLE Item write cycle time write pulse width from chip selection to write end address fixed time for EWE3 - EWE0 address setup time write recovery time data setup time data hold time output enable time for EWE3 - EWE0 output disable time for EWE3 - EWE0 min 21.2 8.0 13.6 13.6 4.6 0 7 0 5.6 - max 11.6 unit ns 15 CHAPTER 3 Functional description 3.4 Switch for Memory Units Setting The memory unit contains a bus size switch and memory setup switch. ■ Specification of switch for memory unit setting Figure 3.3-1 shows the switch for setting memory unit. Table 3.3-1 shows how to set the switch. Figure 3.4-1 The switch for setting memory unit Table 3.4-1 How to switch the data bus size of the external memory emulation function Item DSEL ROM Size Switch of width of bus ON 32 bit bus (Memory capacity:4MB or less) OFF 16 bit bus (Memory capacity:2MB or less) Table 3.4-2 How to set memory capacity of external memory function Item Size ASEL3 ASEL1 ROM Size At 32 bits in the width of the bus At 16 bits in the width of the bus OFF OFF OFF * * OFF OFF ON 4M Byte * OFF ON OFF 2M Byte 2M Byte OFF ON ON 1M Byte 1M Byte ON OFF OFF 512K Byte 512K Byte ON OFF ON 256K Byte 256K Byte ON ON OFF 128K Byte 128K Byte ON ON ON 64K Byte 64K Byte *: Setting prohibited 16 ASEL2 CHAPTER 3 Functional description ■ Handling of Address Pin During Using External Memory Emulation Function Table 3.4-3 shows SRAM connection address terminal for external memory emulation function from evaluation MCU during using external memory emulation function. Note that the required address terminal depends on the capacity of used memory and size of data bus used for accessing SRAM for the external memory emulation. Note that these terminals cannot be used as ports when the external memory emulation is running. For checking non-using address pin used as general port, See evaluation MCU data sheet. Table 3.4-3 SRAM connection address pin for external memory emulation function Item ASEL3 ASEL2 ASEL1 SRAM connection address pin for external memory emulation function * At 32 bits in the width of the bus SRAM connection address pin for external memory emulation function At 16 bits in the width of the bus OFF OFF OFF * * OFF OFF ON A21 to A2 * OFF ON OFF A20 to A2 A20 to A1 OFF ON ON A19 to A2 A19 to A1 ON OFF OFF A18 to A2 A18 to A1 ON OFF ON A17 to A2 A17 to A1 ON ON OFF A16 to A2 A16 to A1 ON ON ON A15 to A2 A15 to A1 *: Address terminals not connected to SRAM used as external memory emulation at each setting can be used as ports. For setup details during using port, see evaluation MCU data sheet. ■ Handling of Data Pin During Using External Memory Emulation Function Table 3.4-3 shows SRAM connection data terminal for external memory emulation function from evaluation MCU during using external memory emulation function. Note that the required data terminal depends on the size of the data bus accessing external emulation SRAM. Note that these terminals cannot be used as ports when the external memory emulation is running. For checking non-using data pin used as general port, See evaluation MCU data sheet. Table 3.4-4 SRAM connection data pin for external memory emulation function Item DSEL External bus width SRAM connection data pin for external memory emulation function * SRAM connection data pin for external memory emulation function ON 32-bit bus width D31 to D0 OFF 16-bit bus width D31 to D16 *: Data terminals not connected to SRAM used as external memory emulation at each setting can be used as ports. For setup details during using port, see evaluation MCU data sheet. 17 CHAPTER 3 Functional description 3.5 Connections This chapter explains how to connect to adaptor and header. ■ Connections The header that is connected to user system is connected to memory unit and adaptor. For connecting method between user system and header, see the “Header Instruction Manual”. Figure 3.5-1 shows how to connect to adaptor and header. Figure 3.5-1 Connection of memory unit Adapter Header I/F Connector x 2 Adapter I/F Connector x 2 Memory Unit Header I/F Connector x 2 Adapter I/F Connector x 2 Header User System (1) Connect the header to the user system (2) Connect the memory unit to the header (3) Connect the adapter to the memory unit CAUTION CAUTION 18 The connection of headers to the user system must ensure "Structural design" and "Improvements in dimensional accuracy" to provide reliable connection. As a result, it is delicately made and the its strength is comparitively weak. When connecting the memory unit and adapter to the header, hold the header to ensure it is not exposed to excessive pressure. CHAPTER 3 Functional description 3.6 Restrictions The limitations the memory unit is used are explained. ■ Restrictions • Do not operate any switch during power-ON. • Do not cut-OFF the product from adaptor and header drilling power-ON. • The external emulation SRAM data may become corrupted when the power is turned off or a reset input during a write access to the external emulation SRAM (either input from the user system, by powering down the user system, issuing a reset command from the emulator or otherwise) is performed. • The external memory emulation function can not be used at 8-bit bus width of evaluation MCU. • The memory device of this product is SRAM. Thus, this product is not supported for the emulation of Flash memory/SDRAM. • D31 to D0, RD and A21 to A1 cannot be used as ports since they must be used by external memory emulation SRAM. However, D15 to D0 can be used as ports for accessing external emulation SRAM via a 16-bit wide bus.A15 to A2 can not be used as port. A21 to A16 and A1 can be used as ports depending on the capacity of external emulation SRAM memory and width of bus used for access. See “Section 1.4 “. • ECS provided with external memory emulation SRAM is selected using CS0 or other CS signal. The selected CS0 signal do not supply to user system. For details on how to select CS signals for selecting ECS assignment, refer to Softune Workbench and other debugging software manuals. • Refer to "3.3 AC Characteristics" and the evaluation MCU data sheet to set up an external bus interface of the evaluation MCU when memory units are used. 19 CHAPTER 3 Functional description 20 CM71-00416-1E FUJITSU SEMICONDUCTOR • CONTROLLER MANUAL DSU-FR EMULATOR MEMORY UNIT FOR MB2198-100 MB2198-90 HARDWARE MANUAL November 2003 the first edition Published FUJITSU LIMITED Edited Business Promotion Dept. Electronic Devices