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I NTERSIL N OMENCLATURE GUIDE
Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
X Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ZL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ZL Power Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ZL Evaluation Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
KAD Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
QLx Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
QL Evaluation Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
QHx Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
D2 Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
RKP Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
TW Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Intersil Legacy Nomenclatures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5962 SMD/DSCC - QML Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
80C, 82CXXX Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
ACS, ACTS, HCS, HCTS Radiation Hardened Types . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AD Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
CA Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
CD22XXX Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
CD4000 Radiation Hardened Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
CDP Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
CDP68HC68 Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CDP65C51 Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CD74HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DG Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
HX Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
HX, HXX Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
HCS, HCTS, ACS, ACTS, Radiation Hardened Types . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
HIN Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
HIP Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
HMP Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
HMU/HMA Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
HS/IS Radiation Hardened Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
HSP Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ICL, ICM Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ICL Types (Interface Circuits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
JM JAN-QML Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1
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1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2013 All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
Nomenclature Guide
Intersil Nomenclatures
ISL Types
ISL
X XXXX X I XX X XXX
PREFIX
FAMILY DESIGNATOR
1: DSL, RTC, Clocks, ATE,
Energy LED Lighting
2: Reference, DCPs, Buffers,
Sensors, Precision Op Amp,
Precision ADC & DAC
3: Interface, Data Communication
4: Analog Component Solutions
5: High Speed Amps, Switch/MUX,
ADCs, DACs, Optical, Video,
Telecom VoIP, DSP Function
Specific
6: Desktop Power
7: Space, Auto
8: Analog Switches, General
Purpose Power
9: Notebook, Handheld
A: High Speed ADCs
PART NUMBER
3 to 5 Digits
OPTION
E: 15kV ESD Protected
DCP Resistance Options
W: 10k
U: 50k
T: 100k
TEMPERATURE RANGE
C: 0°C to +70°C (Commercial)
D: 0°C to +85°C
H: -10°C to +100°C (Hi-Temp Comm.)
E: -20°C to +85°C (Extended Comm.)
I: -40°C to +85°C (Industrial)
A: -40°C to +105°C (Automotive)
F: -40°C to +125°C (Full-range Industrial)
P: -40°C to +130°C (Power Supply)
M: -55°C to +125°C (Military)
RHV: QML Class V (Radiation Hardened)
RHQ: QML Class Q (Radiation Hardened)
RHT: QML Class T (Radiation Hardened)
EHV: QML Class V (Radiation Hardened)
EHQ: QML Class Q (Radiation Hardened)
EHT: QML Class T (Radiation Hardened)
2
Z
-T
SUFFIX/ POST PROCESSING/
PB-FREE OPTION
SPECIAL SERVICES
Z: ROHS and IEC61249-2-21 Halogen Free
-T: Tape and Reel
-T1: Tape and Reel
SPECIAL SELECTIONS
-T2: Tape and Reel
Optional Characters to Denote Operating Conditions or
w/Vacuum Pack
Package Options:
-T7: 7” Reel
18: 1.8V
-TS: 7” Reel, 100 pc.
33: 3.3V
-T7A: 7” Reel, 250pc.
EP: Enhanced Product
-T13: 13” Reel
(DSCC Vendor Item Drawing)
-T5: 500pc Tape and Reel
EPZ: Enhanced Product w/100% Matte Tin Lead Finish
A, B etc.: Firmware revision. This will not appear on part
-TK: 1,000pc Tape and Reel
marking
-T5K: 5,000pc Tape and Reel
-EV: Evaluation Board
OPTIONAL ELECTRICAL GRADE
-EVZ: Evaluation Board
To Denote Speed or Precision Grading as Defined in Datasheet
ROHS Compliant
-DM: Demo Board
PACKAGE DESIGNATOR
-DMZ: Demo Board ROHS
A: Shrink Small Outline Plastic (SSOP/QSOP)
Compliant
B: Small Outline Plastic (SOIC)
-RF: Ref Design Eval Board
BE: Exposed Pad SOIC (EPSOIC)
-RFZ: Ref Design Eval Board
C: Available
ROHS Compliant
D: Ceramic Dual-In-Line Metal Seal (SBDIP)
-EC: Enhanced Commercial
E: Small Outline Transistor Plastic (SC-70)
(Enhanced EOL,
F: Ceramic Flatpack
MIL-PRF-38535
FE: Ceramic Flatpack w/Heatsink
Change Notice,
G: Single In-line Plastic (SIP) TO-220
Traceable to Wafer Lot)
GS: Single In-line Plastic, Surface Mount (SIP) TO-263
H: Small Outline Transistor Plastic (SOT-23)
HT: Thin Small Outline Transistor Plastic (TSOT)
I: Chip Scale Package (CSP)
J: Ceramic Dual-In-Line Frit Seal (CERDIP)
K: Ball Grid Array (FBGA/PBGA/LGA)
KE: Heat Sink Ball Grid Array (HBGA)
KV: Very Thin Fine Pitch BGA (VFBGA)
L: Ceramic Leadless Chip Carrier (CLCC, SMD 0.5)
M: Plastic Leaded Chip Carrier (PLCC)
N: Thin Plastic Quad Flatpack (TQFP/LQFP)
NE: Thin Plastic Quad Flatpack (TQFP/LQFP w/Exposed Pad)
O: Do Not Use
P: Dual-In-Line Plastic (PDIP)
Q: Metric Plastic Quad Flatpack (MQFP/PQFP)
R: Quad/Dual Flat No Lead (QFN/DFN)/HDA (High Density Array)
RA: Array Flat No Lead (AFN)
RO: Optical Quad/Dual Flat No Lead (OQFN/ODFN)
ROM: Optical Quad/Dual Flat No Lead Module
RT: Thin Quad/Dual Flat No Lead (TQFN/TDFN)
RU: Ultra Thin Quad/Dual Flat No Lead (UTQFN/UTDFN/ePad UTQFN)
RS: Top Exposed Pad QFN (TEPQFN)
RX: Extreme Thin Flat No Lead (X2DFN/X2QFN)
S: Header (TO-257)
T: Metal Can (TO-39)
U: Mini Small Outline Package (MSOP)
UE: Thermally Enhanced Mini Small Outline Package (HMSOP)
UO: Optical Mini Small Outline Package (OSOP)
V: THIN Shrink Small Outline Plastic (TSSOP)
VE: Thermally Enhanced Thin Shrink Small Outline Plastic (HTSSOP/EPTSSOP)
W: Wafer Sale
WMB: Wafer Sale With Solderable Metal Backing Layer
XM: Die Sale , Military Visual (Condition B)
XC: Die Sale, Commercial Visual
XB: Die Sale, Bumped Die (FCP)
Y: Available
Z: Do Not Use
www.intersil.com
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
EL Types
EL
1503
A
I
R
PREFIX
Z
-T
PB-FREE OPTION
Z: Pb-Free Product
PART
NUMBER
SUFFIX/POST
PROCESSING/
SPECIAL SERVICES
-T: Tape and Reel
-T7: 7” Reel
-T7A: 7” Reel (250 pcs)
-T13: 13” Reel
PACKAGE FAMILY
OPTIONAL SUFFIX
OR PART VARIATION
PACKAGE TYPE
TEMPERATURE RANGE
C: (Commercial) 0°C to +70°C
I: (Industrial) -40°C to +85°C
M: (Military) -55°C to +125°C
A: (Automotive) -40°C to +105°C
D: 0°C to +85°C
E: (Extended Comm) -20°C to +85°C
3
PACKAGE
DESIGNATOR
Bare Die
D
CerDip
J
QFN/DFN
(Saw Singulate)
L
SO (0.300”) and HSOP
M
PDIP
N
TSSOP (4.4 mm)
R
HTSSOP (4.4 mm)
RE
SO (0.150”)
S
TO-220
T
QSOP
U
SOT-23
W
MSOP
Y
HMSOP
YE
TSOT
WT
SC-70
C
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1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
X Types
System Management Products (SMP)
X
5
32
3
S8
I
Z-
4.5A
T1
TAPE AND REEL
T1: Tape and Reel
T2: Dry Pack
PREFIX
All Xicor Products
INTERFACE
4: 2-Wire Interface
5: SPI Interface
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
EEPROM MEMORY SIZE
00: 0kb
02: 2kb
04: 4kb
RESET POLARITY
08: 8kb
0: Active High
16: 16kb
1: Active Low
32: 32kb
3: Active Low
4: Active High
64: 64kb
5: Active High
28: 128kb
7: Active High
56: 256kb
8: Active Low
9: Active High
EXCEPTIONS TO RESET POLARITY
X40015
X40231
X40233
X40035
VOLTAGE TRIP POINT
2.7: 2.62V
2.7A: 2.85V or 2.92V
4.5A: 4.63V
(Blank): 4.38V or Other
A: Other
B: Other
C: Other
TEMPERATURE RANGE
(blank): Commercial 0°C to +70°C
I: Industrial -45°C to +85°C
PACKAGE DESIGNATOR
P:
S:
V:
M:
Q:
#:
PDIP
SOIC
TSSOP
MSOP
QFN
Number of Pins
EXCEPTIONS TO EEPROM MEMORY SIZE
X40626
X40030
X40031
X40034
X40035
X4C105
Real Time Clocks (RTC)
X
XXXX
S
X
I-
4.5A
T1
PREFIX
PART NUMBER
TAPE AND REEL
T1: Tape and Reel
T2: Dry Pack
PACKAGE DESIGNATOR
S: SOIC
V: TSSOP
# PINS
8: 8 Ld
14: 14 Ld
16: 16 Ld
4
SPECIAL VOLTAGE SECTION
Signifies Different V Trip Point
2.7
2.7A
4.5
4.5A
TEMPERATURE RANGE
(blank): Commercial 0°C to +70°C
I: Industrial -40°C to +85°C
www.intersil.com
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
Voltage References (VREFs)
X
6
XXXX
X
I-
X
-XX
T1
TAPE AND REEL
T1: Tape and Reel
T2: Dry Pack
PREFIX
FAMILY DESIGNATOR
Voltage References
OUTPUT VOLTAGE
-12: 1.25V
-25: 2.50V
-41: 4.096V
-50: 5.00V
PART NUMBER
4 Digits
PERFORMANCE GRADE
Refer to Datasheet for Details
PACKAGE DESIGNATOR
G3: 3 Ld SOT23
S8: 8 Ld SOIC
TEMPERATURE RANGE
(blank): Commercial 0°C to +70°C
I: Industrial -40°C to +85°C
Digitally Controlled Potentiometers (DCPs)
X
9x
XXX
X
XX
X
Z
XX
XX
TAPE AND REEL
T1: Tape and Reel
T2: Tape and Reel and Dry Pack
PREFIX
FAMILY DESIGNATOR
90 to 96, also 9C
NOTE: Does not include X952x,
X9530, X9601x, and 90100
VOLTAGE IDENTIFIER
Blank: 5V ±10%
-3: 3V ±10%
-2.7: 2.7V to 5.5V
PB-FREE OPTION
Z: Pb-Free Product
PART NUMBER
2 to 3 digits
RESISTANCE OPTIONS
W: 10k
U: 50k
T: 100k
Y: 2k
M: 2/10/10/50
Z: 1k
5
TEMPERATURE RANGE
Blank: Commercial (0°C to +70°C)
I: Industrial (-45°C to +85°C)
PACKAGE DESIGNATOR (followed by lead count)
B: CSP
M: MSOP
P: PDIP
S: SOIC
U: T/DFN
V: TSSOP
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1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
Digitally Controlled Capacitors (DCCs)
X
90100
XX
X
Z
X
TAPE AND REEL
T1: Tape and Reel
T2: Tape and Reel and Dry Pack
PREFIX
PB-FREE OPTION
Z: Pb-Free Product
FAMILY DESIGNATOR
TEMPERATURE RANGE
Blank: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
PACKAGE DESIGNATOR (Followed by Lead Count)
M: MSOP
Bias and Control for Laser Diode with Integrated DCP
X
952
X
XX - X
Z
X
TAPE AND REEL
T1: Tape and Reel
T2: Tape and Reel and Dry Pack
PREFIX
PB-FREE OPTION
Z: Pb-Free Product
FAMILY DESIGNATOR
SUFFIX
See Datasheet for Specifications
MODEL NUMBER
0: 3 DCP with 2k Mem and V Monitor
1: 2 DCP with 2k Mem
2: 3 DCP with 2V Monitor
3: 2 DCP with 2V Monitor
4: 2 DCP with 2V Monitor
5: 2 DCP with 2V Monitor Addressable
PACKAGE DESIGNATOR (Followed by Lead Count)
B: CSP
V: TSSOP
Bias and Control for Laser Diode
X
9530
XX
Z
X
TAPE AND REEL
T1: Tape and Reel
T2: Tape and Reel and Dry Pack
PREFIX
PB-FREE OPTION
Z: Pb-Free Product
FAMILY DESIGNATOR
PACKAGE DESIGNATOR (Followed by Lead Count)
V: TSSOP
6
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1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
General Purpose Sensor Conditioners with Look-Up Table Memory
X
9601
X
XX
Z
X
TAPE AND REEL
T1: Tape and Reel
T2: Tape and Reel and Dry Pack
PREFIX
FAMILY DESIGNATOR
PB-FREE OPTION
Z: Pb-Free Product
SENSOR OPTION
1: Sensor Conditioner with Dual Look
Up Table Memory and DAC
2: Temperature Sensor with Look Up
Table Memory and DAC
3: Universal Sensor Conditioner with
Dual Look Up Table Memory and DACs
PACKAGE DESIGNATOR (Followed by Lead Count)
B: CSP
V: TSSOP
Parallel E2PROM
X
XXXX
X
XX
-XX
T1
TAPE AND REEL
T1: Tape and Reel
PREFIX
ACCESS TIME
Blank: 300ns
-25: 250ns
-20: 200ns
-15: 150ns
-90: 90ns
-70: 70ns
-55: 55ns
-45: 45ns
PART NUMBER
PACKAGE DESIGNATOR
D: Cerdip
E: Ceramic LCC
F: Flatpack
H: Ceramic SOIC
J: PLCC
K: Pin Grid Array
L: TQFP
N: Stretched Ceramic LCC
P: Plastic DIP
S: SOIC
T: TSOP
TEMPERATURE RANGE
Blank: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
M: Military = -55°C to +125°C
MB: MIL-STD-883
MHR: Military High Rel
Serial E2PROM
X
XXXX
PREFIX
XX
XX
-XX
T1
SPECIAL REQUIREMENT
TAPE AND REEL
T1: Tape and Reel
PART NUMBER
PACKAGE DESIGNATOR
A: 8 Ld SOIC (EIAJ)
D: CERDIP
P: Plastic DIP
S: SOIC
S8: 8 Ld SOIC
S14: 14 Ld SOIC
V: TSSOP
7
VCC RANGE
Blank: 4.5V to 5.5V
-3: 3V to 5.5V
-2.7: 2.7V to 5.5V
TEMPERATURE RANGE
Blank: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
M: Military = -55°C to +125°C
MB: MIL-STD-883
www.intersil.com
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
ZL Types
ZL BBBBB
P
T
S
L
F
-CC
CUSTOM CODE
Any alphanumeric character
ZL = ZILKER LABS DESIGNATOR
BASE PART NUMBER
5 Character Max.
SHIPPING OPTION
J: (Trays)
T1 or TK: (Tape and Reel - 1000 piece)
T3: (Tape and Reel - 3000 piece)
T4: (Tape and Reel - 4000 piece)
T5: (Tape and Reel - 5000 piece)
T6: (Tape and Reel - 6000 piece)
T: (Tape and Reel - 100 piece for
Zilker legacy products)
T: (Tape and Reel - Full reel Qty.
for Intersil Zilker products)
W: (Waffle pack)
PACKAGE DESIGNATOR
A: (QFN)
OPERATING TEMPERATURE RANGE
J: (0°C to +85°C)
K: (0 to +70°C)
L: (-40°C to +85°C)
Z: (-55°C to +125°C)
LEAD FINISH
F (Lead-free Matte Tin)
N (Lead-free NiPdAu)
FIRMWARE REVISION
Any alphanumeric character
ZL Power Modules
ZL
9XXXM*
I
R
Z
-T
ZL = ZILKER LABS DESIGNATOR
SHIPPING OPTION
No Suffix Trays
-T: Tape and Reel Full Reel Qty.
-TK: Tape and Reel 1000 pc.
BASE PART NUMBER
6 Character Max.
ZL90XXM* - Power Modules
ZL91XXM* - Power Modules
ZLS4XXX - Module Component
*An alpha character succeeding the “M”
represents a Firmware or Configuration change
and will not appear on part marking
ROHS
Z: ROHS Compliant
PACKAGE DESIGNATOR
R: QFN
OPERATING TEMPERATURE RANGE
I: -40°C to +85°C
ZL Evaluation Boards
ZL
BBBBB
ZL = ZILKER LABS DESIGNATOR
BASE PART NUMBER
5 Character Max.
EVALUATION BOARD DESIGNATOR
EV = Evaluation Board
8
EV
S
R
-CC
CUSTOM CODE
Any alphanumeric character
BOARD VARIATION
Any number
KIT OPTION
K = Kit containing collateral
Blank = Board only
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All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
KAD Types
KAD 55 1 0 P - 12 Q 48
LEAD COUNT
PREFIX
PACKAGE STYLE
Q: QFN
FAMILY SERIES
NUMBER OF CHANNELS
1: Single
2: Dual
4: Quad
SPEED
12: 125 MSPS
17: 170 MSPS
21: 210 MSPS
25: 250 MSPS
50: 500 MSPS
DESCRIPTOR
B: Buffered
P: Programmable
HP: High Performance
RESOLUTION
0: 10-Bit
2: 12-Bit
4: 14-Bit
QLx Types
Wired Signal Integrity Parts
QLx
XXXX
XXX
XX
PREFIX
TAPE & REEL
T7: 7” Production Tape & Reel, Quantity 1,000
SR: 7” Sample Tape & Reel, Quantity 100
PART NUMBER1
EXTENSION
RIQ: Generic Receive Side Equalizer
SIQ: Impedance Select Option
LIQ: LOS Option
IQ: Intersil-Quellan (introduced after Intersil acquisition of Quellan)
NOTE:
1. Usually Number of Channels + Data rate, e.g. 4600: Quad 6G; 411G: Quad 11G.
9
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Nomenclature Guide
Active Cables
QLx
XXXXX
XXX X
YYYY
PREFIX
LENGTH/GAUGE3
PART NUMBER1
FORM-FACTOR2
NOTES:
1. Data Rate followed by Special Designator, followed by Customer Designator (if applicable), followed by “C” for cable.
Special Designators:
0 for half-active (chip on RX side only)
1 for generic full-active (chips on both TX and RX ends)
2 for full-active Ethernet
Customer Designator:
0 for general market, other numbers for specific customers, e.g. 600C (6G half-active cable), 4000C (40G half-active cable), 4100C (40G full-active
cable)
2. For example, connector type or form-factor: SFP for SFP+, QSFP for QSFP, MSAS for Mini-SAS, SDP for mini DisplayPort, SDP for Standard
DisplayPort, SMDP for mini-to-standard DisplayPort.
3. For example, 1028 = 10m 28 AWG.
QL Evaluation Boards
EBL
XXXXX
-EVALZ
PREFIX
PART NUMBER1
NOTE:
1. Same as the part marking on the respective IC.
QHx Types
Wireless Noise Cancellation Parts
QHx
XXX
XX
XX
PREFIX
PART NUMBER
TAPE & REEL
T7: 7” Production Tape & Reel, Quantity 1,000
SR: 7” Sample Tape & Reel, Quantity 100
EXTENSION
IQ: Intersil-Quellan (introduced after Intersil acquisition of Quellan)
10
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Nomenclature Guide
D2 Types
D2-
aaaaa-
b
R
-TK
TAPE & REEL
-TK: Quantity 1,000
D2 = D2 AUDIO DESIGNATOR
ROHS COMPLIANT
5 DIGIT PART NAME
PACKAGE DESIGNATOR
L: LQFP
Q: QFN
M: HTSSOP
RKP Types
RKP
aaaa
-TK
TAPE & REEL
-TK: Quantity 1,000
RKP = ROCK DESIGNATOR
4 DIGIT PART NAME
11
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Nomenclature Guide
TW Types
TW aaaa bb - c
d
e
f
g# -
h
j
k
l
PREFIX
DEVICE NUMBER
AT: Auto Wafer
EP: Epi Wafer
l - OPTIONS
S = SLT
B = Burn-in
H = High Temp. Testing
I = Industrial
V = High Volt Testing
T = Tape & Reel Packing
c - PROCESS
This character is included in the
marking of legacy products only.
PROCESS
CODE
TSMC, 0.35µm, Polycide,
SPQM or SPTM Logic
A
TSMC, 0.25µm
B
X-FAB, 0.25µm
C
TSMC, 0.18µm
D
k - PACKAGE VARIANT
PACKAGE VARIANT
CODE
This is only used when one
product type is offered in 2
different sizes or lead counts
of the same package style.
The last FG# created will
include the lead count.
X-FAB, 0.18µm
E
TSMC, 0.18µm, EPI,
Ar Anneal, Hi
G
Goyatek/Vanguard, 0.25µm
H
TSMC 0.25µm EPI,
Ar Anneal, Hi
J
TSMC 0.18µm
Automotive Process
K
TSMC 0.13µm
M
Drop-in heat spreader
D
TSMC 90nm
N
Exposed heat spreader
E
Fujitsu 90nm
P
Q
Regular package without
heat spreader
R
TSMC 0.13µm 12” Wafer
TSMC 65nm
R
TSMC 45nm
S
128
(lead
count)
j - PACKAGE TYPE C
PACKAGE TYPE
CODE
h - PACKAGE TYPE B
d - ASSEMBLY VENDOR
This character is included in the marking of legacy products only.
ASSEMBLY VENDOR
ASEK
ASECL
GAPT
i2a/IPAC, Quick Pak
SPIL
ChipMOS
UTAC
Fujitsu
Amkor Korea
CODE
A
B
C
D
E
G
J
K
M
PACKAGE TYPE
Green (Halogen Free) and Lead
Free package
CODE
G
(Note)
Normal package
N
Green (Halogen Free) and Lead
Free package with Cu Bond Wires
C
Flip Chip
F
NOTE: The following FG’s also use Cu wire:
TW6815-LA1-GR
TW6816-LA1-GR
TW6817-LA1-GR
TW6818-LA1-GR
TW6932-LA1-GR
g# - DIE REVISION
It starts from A1. If full layers are changed, the die revision
changes like A1→B1→C1, etc.
If some layers are changed, the die revision changes like
A1→A2→A3, etc.
eQ: 12” Wafer
f - PACKAGE TYPE A
PACKAGE TYPE
CODE
BGA package
B
LQFP package
L
PQFP package
P
TQFP package
T
QFN package
N
PQFP package with Exposed Heat Spreader
E
12
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Nomenclature Guide
Intersil Legacy Nomenclatures
5962 SMD/DSCC - QML Types
5962
-
XXXXX
0X
X
X
X
SMD ID NUMBER
(Does Not Change) (ID Not Applicable in Earlier DSCC Items)
TOTAL DOSE DESIGNATOR
-: Non-Rad Hard
M: 3 krad (Si)
D: 10 krad (Si)
R: 100 krad (Si)
F: 300 krad (Si)
DRAWING NUMBER
(DSCC and SMD)
DEVICE TYPE
(Paragraph 1.2.1 Of SMD/DSCC Drawing)
DEVICE CLASS DESIGNATOR
(If Applicable)
Q: QML Class Q (MIL-PRF-38535)
M: QML Class B (MIL-STD-883)
V: QML Class V, (MIL-PRF-38535)
N: Non-Traditional Packages and Temp Ranges (i.e., Plastic Packages, -40°C to +85°C Temperature Range)
T: QML Class T, Star*Lite Flow
CASE OUTLINE
Case Outlines are Listed in the Specific SMD and Detailed in MIL-STD-1835, Section 4.
LEAD FINISH
A: Solder Dip
C: Gold
NOTE:
Nomenclature Per MIL-PRF-38535
80C, 82CXXX Types
M
D
TEMPERATURE RANGE
C: 0°C to +70°C
I: -40°C to +85°C
M: -55°C to +125°C
PACKAGE DESIGNATOR
P: Dual-In-Line Plastic (PDIP)
D: Ceramic Dual-In-Line Frit-Seal (CERDIP)
or Ceramic Dual-In-Line Metal Seal (SBDIP)
G: Ceramic Pin Grid Array (CPGA)
R: Ceramic Leadless Chip Carrier (CLCC)
S: Plastic Leaded Chip Carrier (PLCC)
M: Small Outline Plastic (SOIC)
MS: OKI Pin for Pin Cross (PLCC)
MQ: OKI Pin for Pin Cross (MQFP)
PART NUMBER
80CXXX: CMOS Microprocessors
82CXXX: CMOS Peripherals
13
80C86 - 2
/B
Z
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
SUFFIX
/B: -55°C to +125°C with Burn-In
/883: Current Rev Compliant
/7: Thin EPI, Current Rev 883 Compliant
SPEED DESIGNATION
Peripherals
-5: 5MHz
Blank: 8MHz
-10: 10MHz
-12: 12MHz
µProcessors
Blank: 5MHz
-2: 8MHz
-10: 10MHz
-12: 12MHz
-20: 20MHz
-25: 25MHz
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Nomenclature Guide
ACS, ACTS, HCS, HCTS Radiation Hardened Types
ACSXXX
D
MS
R
PART NUMBER
ACS, HCS: CMOS Compatible
ACTS, HCTS: TTL Compatible
HARDNESS ASSURANCE LEVEL
R: 200 krad(Si) HCS/HCTS
F: 300 krad(Si) ACS/ACTS
CLASS
MS: Class V (Note 1)
T: QML Class T, Star*Lite Flow
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
H: Die
K: Ceramic Flatpack
NOTE:
2. FLIGHT UNITS MUST BE ORDERED BY SMD#.
A cross reference table is available on the Intersil website at www.intersil.com
AD Types
ADC0803LC
PART NUMBER
Converters
AD, ADC
WM
-T
SUFFIX
-T: Tape and Reel
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Frit-Seal (CERDIP)
or Ceramic Dual-In-Line Metal Seal (SBDIP)
H: TO-52 Can
N: Dual-In-Line Plastic (PDIP)
WM: Small Outline Plastic (SOIC)
CA Types
CA3260
A
T
PART NUMBER
CAXXXX
ELECTRICAL OPTIONS
A, B, C, Blank
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
E: Dual-In-Line Plastic (PDIP)
F: Ceramic Dual-In-Line Frit-Seal (CERDIP)
J: Ceramic Leadless Chip Carrier (CLCC)
M: Small Outline Plastic (SOIC)
Q: Plastic Leaded Chip Carrier (PLCC)
S: DIL Formed TO-5
T: Can
Z: Single-In-Line Plastic (SIP)
Blank: Refer to Data Sheet for Package Type
NOTE:
Z
3
SUFFIX
3: -55°C to +125°C Modified
Class B
3W: Modified Class B
without High & Low
Temperature DC
96: Tape and Reel
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
If the part number contains three digits, add a leading zero when ordering. Example: CA555 becomes CA0555.
14
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All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
CD22XXX Types
CD22
PREFIX DESIGNATION
for Intersil Telecom IC’s
XXXXX
A
E
X
PART NUMBER
SCREENING OPTION
X: Enhanced Product Screening i.e., Burn-In
(Optional for D, E Package Types)
REVISION
A: 1st
B: 2nd etc.
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
E: Dual-In-Line Plastic (PDIP)
F: Ceramic Dual-In-Line Frit-Seal (CERDIP)
M: Small Outline Plastic (SOIC)
Q: Plastic Leaded Chip Carrier (PLCC)
H: Chip
X Suffix Product Flow
100% BURN-IN
160 HR.
AT +125°C OR
EQUIVALENT
STANDARD
PRODUCT
PRODUCTION STATE OR
PROCESS
SAMPLE
PARAMETRIC
AND FUNCTIONAL
TESTS AT +25°C
AQL = 0.025%
100% PARAMETRIC
AND FUNCTIONAL
TESTS AT +25°C
ENHANCED
PRODUCT
QUALITY ASSURANCE STEP
CD4000 Radiation Hardened Types
CD4000
PART NUMBER
CD4000
B
D
MS
R
HARDNESS ASSURANCE LEVEL
R: 100 krad(Si)
SERIES
B: Buffered
UB: Un-Buffered
CLASS
MS: Class V (Note 1)
NS: Class V with Neutron Irradiation (Note 1)
T: Class T, Star*Lite Flow
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
H: Die
K: Ceramic Flatpack
NOTE:
1. FLIGHT UNITS MUST BE ORDERED BY SMD#.
A cross reference table is available on the Intersil website at http://www.intersil.com
CDP Types
CDP1802
PART NUMBER (CMOS LSI)
CDP18XX
REVISION
A: 1st
B: 2nd
A
C
D
3
PRODUCT
ASSURANCE LEVEL
X: -40°C to +85°C with Burn-In
3: Non-Compliant with MIL-STD-883
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
E: Dual-In-Line Plastic (PDIP)
K: Ceramic Flatpack
Q or N: Plastic Leaded Chip Carrier (PLCC)
VOLTAGE
C: 5V Device
15
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Nomenclature Guide
CDP68HC68 Types
CDP68HC68
T1
M
PACKAGE DESIGNATOR
E: Dual-In-Line Plastic (PDIP)
M: Small Outline Plastic (SOIC)
H: Chip
PART NUMBER (Peripherals)
HC: Standard
FAMILY SERIES
A2, P1, R1, S1, T1, W1
CDP65C51 Types
CDP65C51
A
E
4
PART NUMBER (Peripherals)
SPEED OPTIONS
1: 1MHz Operation
2: 2MHz Operation
4: 4MHz Operation
FAMILY SERIES
A: Non-Standard Clear to Send (CTS) Operation
Blank: Standard Clear to Send (CTS) Operation
PACKAGE DESIGNATOR
E: Dual-In-Line Plastic (PDIP)
M: Small Outline Plastic (SOIC)
H: Chip
SM: Shrink Small Outline Plastic (SSOP)
CD74HC Types
CD74
HC22106
E
PREFIX DESIGNATION
PART NUMBER
PACKAGE DESIGNATOR
E: Dual-In-Line Plastic (PDIP)
DG Types
DG
DEVICE FAMILY PREFIX
Switches and MUXs
PART NUMBER
TEMPERATURE RANGE
A: -55°C to +125°C
B: -25°C to +85°C
C: 0°C to +70°C
D: -40°C to +85°C
16
XXXX
X
X
Z
/883
HIGH RELIABILITY DESIGNATOR
/883: Fully Compliant to MIL-STD-883
Class B/QML
/883B
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
PACKAGE DESIGNATOR
A: Can
J: Dual-In-Line Plastic (PDIP)
K: Ceramic Dual-In-Line Frit-Seal (CERDIP)
N: PLCC
P: Ceramic Dual-In-Line Metal Seal (SBDIP)
V: Thin Shrink Small Outline Plastic (TSSOP)
Y: Small Outline Plastic (SOIC)
Y-T: Tape and Reel
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Nomenclature Guide
HX Types
H
A
1 - 5134
A
-2
96
Z
PREFIX
PART NUMBER
FAMILY
A: Analog
C: Communications
D: Digital
I: Interface
M: Memory
V: Analog High Voltage
SUFFIX
96: Tape and Reel
Option for SOIC, PLCC
X96: Tape and Reel
Option for SOIC, PLCC
EVAL: Evaluation Platform
PERFORMANCE GRADE
A, B: High Performance
C: Relaxed Specification
S: Very High Speed
NOTE: Applies to HA, HD and
HM products only.
PACKAGE DESIGNATOR
1: Ceramic Dual-In-Line Frit-Seal (CERDIP)
1B: Ceramic Dual-In-Line Metal-Seal (SBDIP)
2: Can
3: Dual-In-Line Plastic (PDIP)
4: Ceramic Leadless Chip Carriers (CLCC)
4P: Plastic Leaded Chip Carrier (PLCC)
6: Narrow Dual-In-Line Plastic (PDIP) or
Ceramic Dual-In-Line Frit-Seal (CERDIP)
7: 8 Lead Ceramic Dual-In-Line Frit-Seal (CERDIP)
9P: Small Outline Plastic (SOIC)
0: Chip
NOTE: If the package designator is 2 characters
the hyphen is omitted from the part number.
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
TEMPERATURE RANGE
-2: -55°C to +125°C
-4: -25°C to +85°C
-5: 0°C to +75°C
-6: +25°C Chip Probe
-7: Dash-7 High Reliability
Commercial Product 0°C to +75°C,
Includes 96 hour Burn-In
-8: -55°C to +125°C Intersil Class B
Equivalent Devices for use in
Military and Flight Systems
-9: -40°C to +85°C
/883: Fully Compliant to MIL-STD-883,
Class B/QML
BXXXX: Customer Specific Screening
RXXXX: Customer Specific Screening
SXXXX: Customer Specific Screening
HX, HXX Types
H
A
PREFIX
4314B
PART NUMBER
FAMILY
A: Analog
C: Communications
FA: Ultra-High
Frequency Analog
I: Data Acquisition, DSP
Function-Specific
V: Analog High
Voltage
17
C
B
TEMPERATURE RANGE
C: 0°C to +70°C
I: -40°C to +85°C
M: -55°C to +125°C
PACKAGE DESIGNATOR
A: Shrink Small Outline Plastic (SSOP)
B: Small Outline Plastic (SOIC)
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
H: Plastic Small Outline Transistor (SOT)
J: Ceramic Dual-In-Line Frit-Seal (CERDIP)
L: Ceramic Leadless Chip Carrier (CLCC)
M: Plastic Leaded Chip Carrier (PLCC)
N: Thin Quad Flatpack (TQFP), or
Metric Quad Flatpack (MQFP)
Q: Metric Plastic Quad Flatpack (MQFP), or
Plastic Quad Flatpack (PQFP)
P: Dual-In-Line Plastic (PDIP)
T: Can
Y: Chip (Commercial Visual)
W: Wafer
Z
96
SUFFIX
/883: Fully Compliant to
MIL-STD-883
Class B/QML
96: Tape and Reel
-T: Tape and Reel
EVAL: Evaluation Platforms
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
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Nomenclature Guide
HCS, HCTS, ACS, ACTS, Radiation Hardened Types
HCSXXX
D
MS
R
PART NUMBER
ACS, HCS: CMOS Compatible
ACTS, HCTS: TTL Compatible
HARDNESS ASSURANCE LEVEL
R: 200 krad(Si) HCS/HCTS
F: 300 krad(Si) ACS/ACTS
CLASS
MS: Class V (Note 1)
T: Class T, Star*Lite Flow
PACKAGE DESIGNATOR
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
H: Die
K: Ceramic Flatpack
NOTE:
1. FLIGHT UNITS MUST BE ORDERED BY SMD#.
A Cross Reference Table is Available on the intersil Website at http://www.intersil.com/
HIN Types
HIN
XXX
X
X
- T
Z
X
TAPE AND REEL
DEVICE FAMILY PREFIX
Interface
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
PART NUMBER
A: High Speed
E: 15kV ESD Protected
PACKAGE DESIGNATOR
A: Shrink Small Outline (SSOP)
B: 300 mil Small Outline Plastic (SOIC)
BN: 150 mil Small Outline Plastic (SOIC)
P: Dual-In-Line Plastic (PDIP)
Y: Die
J: Dual-in-Line Ceramic (CDIP)
N: Metric Quad Flat Package (MQFP)
TEMPERATURE RANGE
C: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
HIP Types
H
I
P 4082
PREFIX
FAMILY
IP: Intelligent Power
V: High Voltage
FUNCTION CODE
00XX: Low Side Switches
10XX-XX: 00 to 29 Hot Plug
-XX: 30 to 99 High Side Switches
206X: Integrated MOSFETs
21XX-XX: 00 to 19 Half Bridges
40XX: Full or Three Phase Bridges
50XX: Integrated Controllers
60XX: PWM Controllers
62XX: ICs for Portable Applications
63XX: Multiphase Buck PWM Controllers
65XX: ACPI Controllers
66XX: Synchronous-Rectified Buck MOSFET Drivers
72XX: Automotive Communication (J1850)
9XXX: Special Function
(X: Sequential numbers assigned by design)
NOTE: Suffix EVAL: Evaluation Kit (Available for some products).
18
I
B
*
Z
T
PACKING DESIGNATOR
T: Tape and Reel (If Available)
(See Note)
PB-FREE OPTION
Z: Pb-Free Product
SPECIAL SELECTIONS
Optional characters to denote operating conditions,
voltage selections defined in datasheet
PACKAGE DESIGNATOR
B: Small Outline Plastic (SOIC)
D: Chip
K: SOT-23
M: Plastic Leaded Chip Carrier (PLCC)
P: Dual-In-Line Plastic (PDIP)
Q: Metric Plastic Quad Flatpack (MQFP)
S: Single-In-Line Plastic (SIP)
V: TSSOP
W: Wafer
Y: Die
RT: Thin Quad/Dual Flat No Lead (TQFN/TDFN
TEMPERATURE RANGE
A: Automotive (-40°C to +105°C)
C: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
M: Military (-55°C to +125°C)
D: EDP (0°C to +85°C)
F: Full-Range Industrial (-40°c to +125°C)
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Nomenclature Guide
HMP Types
H
8117
MP
A
C
N
PACKAGE DESIGNATOR
N: Metric Plastic Quad Flatpack (PQFP)
PREFIX
FAMILY
MP: Multimedia
Products
NOTE: PQFP is also known as QFP and MQFP.
PART NUMBER
TEMPERATURE RANGE
C: Commercial, 0°C to +70°C
REVISION
If Applicable
HMU/HMA Types
H
MU
16
J
C -
35
PREFIX
/883
HIGH RELIABILITY
DESIGNATOR
883: -55°C to +125°C Fully Compliant
to MIL-STD-883, Class B/QML
FAMILY
MU: Multiplier
MA: Multiplier/
Accumulator
PERFORMANCE GRADE
-35: 35ns
-60: 60ns
-45: 45ns
-65: 65ns
-55: 55ns
-75: 75ns
DEVICE TYPE
16, 17, 510
TEMPERATURE RANGE
C: Commercial, 0°C to +70°C
I: Industrial, -40°C to +85°C
M: Military, -55°C to +125°C
PACKAGE DESIGNATOR
J: Plastic Leaded Chip Carrier (PLCC)
G: Ceramic Pin Grid Array (CPGA)
HS/IS Radiation Hardened Types
H
S
PREFIX
H: Harris
I: Intersil
1
-
6664
PART
NUMBER
FAMILY
Rad Hard/High-Rel Products
PACKAGE DESIGNATOR
1: Ceramic Dual-In-Line Frit-Seal (CERDIP)
or Ceramic Dual-In-Line Metal-Seal (SBDIP)
2: Can
4: Ceramic Leadless Chip Carriers (CLCC)
7B: 8 Lead Ceramic Dual-In-Line Side-Brazed (SBDIP)
8: Ceramic Pin Grid Array (CPGA)
9: Ceramic Flatpack
0: Die
YE: SMD 0.5
9S: TO-257 Hermetic Surface Mount
RH
-8
CLASS
-8: -55°C to +125°C
QML SMD Class Q (Note 1)
-Q: -55°C to +125°C
QML SMD Class V (Note 1)
-T: -55°C to +125°C
QML SMD Class T (Note 1)
/PROTO: -55°C to +125°C Temperature
Tested
(Note 2)
HARDNESS
RH: Radiation Hardened (Note 3)
EH: Radiation Hardened (Note 3)
NOTES:
1. FLIGHT UNITS MUST BE ORDERED BY SMD#.
A cross reference table is available on the Intersil website at http://www.intersil.com/
2. /PROTO available for design-in/breadboarding - NOT FOR FLIGHT.
3. Refer to specific device type SMD for radiation hardness level.
19
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Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
HSP Types
H
SP XXXXX A
J
C - XX
PREFIX
HIGH-RELIABILITY
DESIGNATOR
/883: -55°C to +125°C Fully Compliant to
MIL-STD-883, Class B/QML
FAMILY
SP: Signal Processing,
DSP Function-Specific
SPEED GRADE IN MHz
DEVICE TYPE
43XXX: Digital Filters
45XXX: Signal Synthesis/Special Function
48XXX: Image Processing
95XX: Building Blocks
50XXX: Freq. Conversion and Modulation/
Demodulation
TEMPERATURE RANGE
C: Commercial, 0°C to +70°C
I: Industrial, -40°C to +85°C
M: Military, -55°C to +125°C
PACKAGE DESIGNATOR
D: Die
G: Ceramic Pin Grid Array (CPGA)
J: Plastic Leaded Chip Carrier (PLCC)
P: Dual-In-Line Plastic (PDIP)
S: Small Outline Plastic (SOIC)
V: Metric Quad Flatpack (MQFP)
W: Wafer
MASK REVISION
NOTE:
Suffix EV, EVAL:
/883
Evaluation Kit (Available for some products).
ICL, ICM Types
ICL 8069D C
B
A
Z
T
SUFFIX
/883B: Fully Compliant to MIL-STD-883
Class B/QML
T: Tape and Reel
DEVICE FAMILY
ICL
ICM
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
PART NUMBER
TEMPERATURE RANGE
C: Commercial, 0°C to +70°C
I: Industrial, -25°C to +85°C or -40°C to +85°C
(Specified on Data Sheet)
M: Military, -55°C to +125°C
PACKAGE DESIGNATOR
B: Small Outline Plastic (SOIC)
D: Ceramic Dual-In-Line Metal-Seal (SBDIP)
F: Ceramic Flatpack
H: Small Outline Transistor Plastic (SOT)
J: Ceramic Dual-In-Line Frit-Seal (CERDIP)
M: Metric Plastic Quad Flatpack (MQFP)
P: Plastic Dual-In-Line
S: TO-52 Can
T: Can (TO-99, TO-100)
Z: TO-92 (Plastic)
/W: Wafer
/D: Chip
20
PIN COUNT DESIGNATOR
SUFFIX PIN COUNT
A
DIAMETER
8
B
10
C
12
D
14
E
16
F
22
G
24
H
42
I
28
J
32
K
35
L
40
N
18
P
20
Q
2
R
3
V
8
0.200″ Pin Circle, Isolated Case
W
10
0.230″ Pin Circle, Isolated Case
X
10
0.230″ Pin Circle, Case to Pin 5
Y
8
0.200″ Pin Circle, Case to Pin 4
Z
8
0.230″ Pin Circle, Case to Pin 5
44
44
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1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
Nomenclature Guide
ICL Types (Interface Circuits)
ICL
3243
E
C
V -T
DEVICE FAMILY
ICL Interface
TAPE AND REEL
PART NUMBER
E: 15kV ESD Protected
TEMPERATURE RANGE
C: Commercial (0°C to +70°C)
I: Industrial (-40°C to +85°C)
PACKAGE DESIGNATOR
A: Shrink Small Outline (SSOP)
B: 300 mil Small Outline Plastic (SOIC)
BN: 150 mil Small Outline Plastic (SOIC)
P: Plastic Dual-In-Line (PDIP)
V: TSSOP
Y: Die
JM JAN-QML Types
JM38510/ 051
GENERAL SPECIFICATIONS
DEVICE FAMILY
SPECIFIC DEVICE
21
51
B
C
A
LEAD FINISH
A: Solder
C: Gold
PACKAGE DESIGNATOR
See Specific Data Sheets
DEVICE CLASS
B: Class B/QML
www.intersil.com
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners
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