80C

Nomenclature Guide
80C, 82CXXX Types
M
D
TEMPERATURE RANGE
C: 0°C to +70°C
I: -40°C to +85°C
M: -55°C to +125°C
PACKAGE DESIGNATOR
P: Dual-In-Line Plastic (PDIP)
D: Ceramic Dual-In-Line Frit-Seal (CERDIP)
or Ceramic Dual-In-Line Metal Seal (SBDIP)
G: Ceramic Pin Grid Array (CPGA)
R: Ceramic Leadless Chip Carrier (CLCC)
S: Plastic Leaded Chip Carrier (PLCC)
M: Small Outline Plastic (SOIC)
MS: OKI Pin for Pin Cross (PLCC)
MQ: OKI Pin for Pin Cross (MQFP)
PART NUMBER
80CXXX: CMOS Microprocessors
82CXXX: CMOS Peripherals
1
80C86 - 2
/B
Z
PB-FREE OPTION
Z: Pb-Free Product
ZA: Pb-Free with Anneal
SUFFIX
/B: -55°C to +125°C with Burn-In
/883: Current Rev Compliant
/7: Thin EPI, Current Rev 883 Compliant
SPEED DESIGNATION
Peripherals
-5: 5MHz
Blank: 8MHz
-10: 10MHz
-12: 12MHz
µProcessors
Blank: 5MHz
-2: 8MHz
-10: 10MHz
-12: 12MHz
-20: 20MHz
-25: 25MHz
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