Data Sheet

NX3L1G3157-Q100
Low-ohmic single-pole double-throw analog switch
Rev. 1 — 23 May 2013
Product data sheet
1. General description
The NX3L1G3157-Q100 is a low-ohmic single-pole double-throw analog switch suitable
for use as an analog or digital 2:1 multiplexer/demultiplexer. It has a digital select input
(S), two independent inputs/outputs (Y0 and Y1) and a common input/output (Z). Schmitt
trigger action at the digital input makes the circuit tolerant to slower input rise and fall
times.
The NX3L1G3157-Q100 allows signals with amplitude up to VCC to be transmitted from Z
to Y0 or Y1; or from Y0 or Y1 to Z. Its low ON resistance (0.5 ) and flatness (0.13 )
ensures minimal attenuation and distortion of transmitted signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Wide supply voltage range from 1.4 V to 4.3 V
 Very low ON resistance:
 1.6  (typical) at VCC = 1.4 V
 1.0  (typical) at VCC = 1.65 V
 0.55  (typical) at VCC = 2.3 V
 0.50  (typical) at VCC = 2.7 V
 0.50  (typical) at VCC = 4.3 V
 Break-before-make switching
 High noise immunity
 ESD protection:
 MIL-STD-883, method 3015 Class 3A exceeds 7500 V
 HBM JESD22-A114F Class 3A exceeds 7500 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 CDM AEC-Q100-011 revision B exceeds 1000 V
 IEC61000-4-2 contact discharge exceeds 8000 V for switch ports
 CMOS low-power consumption
 Latch-up performance exceeds 100 mA per JESD78 Class II Level A
 Direct interface with TTL levels at 3.0 V
 Control input accepts voltages above supply voltage
 High current handling capability (350 mA continuous current under 3.3 V supply)
NX3L1G3157-Q100
NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
3. Applications
 Cell phone
 PDA
 Portable media player
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
NX3L1G3157GW-Q100 40 C to +125 C
Name
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
5. Marking
Marking codes[1]
Table 2.
Type number
Marking code
NX3L1G3157GW-Q100
MJ
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
Y1
S
Z
S 6
1 Y1
Z 4
Y0
3 Y0
001aac355
001aac354
Fig 1.
Logic symbol
NX3L1G3157_Q100
Product data sheet
Fig 2.
Logic diagram
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Low-ohmic single-pole double-throw analog switch
7. Pinning information
7.1 Pinning
1;/*4
<
6
*1'
9&&
<
=
DDD
Fig 3.
Pin configuration SOT363 (SC-88)
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
Y1
1
independent input or output
GND
2
ground (0 V)
Y0
3
independent input or output
Z
4
common output or input
VCC
5
supply voltage
S
6
select input
8. Functional description
Table 4.
Function table[1]
Input S
Channel on
L
Y0
H
Y1
[1]
H = HIGH voltage level; L = LOW voltage level.
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
select input S
Min
Max
Unit
0.5
+4.6
V
[1]
0.5
+4.6
V
[2]
0.5
VCC + 0.5 V
VI
input voltage
VSW
switch voltage
IIK
input clamping current
VI < 0.5 V
50
-
mA
ISK
switch clamping current
VI < 0.5 V or VI > VCC + 0.5 V
-
50
mA
ISW
switch current
VSW > 0.5 V or VSW < VCC + 0.5 V;
source or sink current
-
350
mA
VSW > 0.5 V or VSW < VCC + 0.5 V;
pulsed at 1 ms duration, < 10 % duty cycle;
peak current
-
500
mA
65
+150
C
-
250
mW
storage temperature
Tstg
total power dissipation
Ptot
Tamb = 40 C to +125 C
[3]
[1]
The minimum input voltage rating may be exceeded if the input current rating is observed.
[2]
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not
exceed 4.6 V.
[3]
For SC-88 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol Parameter
VCC
supply voltage
VI
input voltage
VSW
Conditions
select input S
switch voltage
Tamb
ambient temperature
t/V
input transition rise and fall rate
VCC = 1.4 V to 4.3 V
Min
Max
Unit
1.4
4.3
V
0
4.3
V
[1]
0
VCC
V
40
+125
C
[2]
-
200
ns/V
[1]
To avoid sinking GND current from terminal Z when switch current flows in terminal Yn, the voltage drop across the bidirectional switch
must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current flows from terminal Yn. In this case, there is no limit for
the voltage drop across the switch.
[2]
Applies to control signal levels.
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
11. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
VIH
VIL
HIGH-level
input voltage
LOW-level
input voltage
Tamb = 25 C
Conditions
Tamb = 40 C to +125 C
Unit
Min
Typ
Max
Min
Max
Max
(85 C) (125 C)
VCC = 1.4 V to 1.95 V
0.65VCC
-
-
0.65VCC
-
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
2.0
-
-
V
VCC = 3.6 V to 4.3 V
0.7VCC
-
-
0.7VCC
-
-
V
VCC = 1.4 V to 1.95 V
-
-
0.35VCC
-
VCC = 2.3 V to 2.7 V
-
-
0.7
-
0.7
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
0.8
V
0.35VCC 0.35VCC V
VCC = 3.6 V to 4.3 V
-
-
0.3VCC
-
0.3VCC
II
input leakage
current
select input S;
VI = GND to 4.3 V;
VCC = 1.4 V to 4.3 V
-
-
-
-
0.5
1
A
IS(OFF)
OFF-state
leakage
current
Y0 and Y1 port;
see Figure 4
VCC = 1.4 V to 3.6 V
-
-
5
-
50
500
nA
VCC = 3.6 V to 4.3 V
-
-
10
-
50
500
nA
VCC = 1.4 V to 3.6 V
-
-
5
-
50
500
nA
VCC = 3.6 V to 4.3 V
-
-
10
-
50
500
nA
VCC = 3.6 V
-
-
100
-
690
6000
nA
VCC = 4.3 V
-
-
150
-
800
7000
nA
IS(ON)
ICC
ON-state
leakage
current
0.3VCC V
Z port; see Figure 5
supply current VI = VCC or GND;
VSW = GND or VCC
CI
input
capacitance
-
1.0
-
-
-
-
pF
CS(OFF)
OFF-state
capacitance
-
35
-
-
-
-
pF
CS(ON)
ON-state
capacitance
-
130
-
-
-
-
pF
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
11.1 Test circuits
VCC
VIL or VIH
S
Y0
1
Z
Y1
2
switch
switch
S
1
VIH
2
VIL
IS
VI
VO
GND
001aac358
VI = 0.3 V or VCC  0.3 V; VO = VCC  0.3 V or 0.3 V.
Fig 4.
Test circuit for measuring OFF-state leakage current
VCC
VIL or VIH
IS
S
Y0
1
Z
Y1
2
switch
S
1
VIH
2
VIL
switch
VI
VO
GND
001aac359
VI = 0.3 V or VCC  0.3 V; VO = VCC  0.3 V or 0.3 V.
Fig 5.
Test circuit for measuring ON-state leakage current
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
11.2 ON resistance
Table 8.
ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 7 to Figure 13.
Symbol
RON(peak)
Parameter
ON resistance (peak)
Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit
Conditions
ON resistance
(flatness)
Min
Max
-
1.6
3.7
-
4.1

-
1.0
1.6
-
1.7

VCC = 2.3 V
-
0.55
0.8
-
0.9

VCC = 2.7 V
-
0.5
0.75
-
0.9

-
0.5
0.75
-
0.9

VCC = 1.4 V
-
0.04
0.3
-
0.3

VCC = 1.65 V
-
0.04
0.2
-
0.3

VCC = 2.3 V
-
0.02
0.08
-
0.1

VCC = 2.7 V
-
0.02
0.075
-
0.1

-
0.02
0.075
-
0.1

VCC = 1.4 V
-
1.0
3.3
-
3.6

VCC = 1.65 V
-
0.5
1.2
-
1.3

VCC = 2.3 V
-
0.15
0.3
-
0.35

VCC = 2.7 V
-
0.13
0.3
-
0.35

VCC = 4.3 V
-
0.2
0.4
-
0.45

VI = GND to VCC;
ISW = 100 mA
[2]
VCC = 4.3 V
RON(flat)
Max
VCC = 1.65 V
VCC = 4.3 V
ON resistance
mismatch between
channels
Typ[1]
VI = GND to VCC;
ISW = 100 mA;
see Figure 6
VCC = 1.4 V
RON
Min
VI = GND to VCC;
ISW = 100 mA
[3]
[1]
Typical values are measured at Tamb = 25 C.
[2]
Measured at identical VCC, temperature and input voltage.
[3]
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and
temperature.
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
11.3 ON resistance test circuit and graphs
001aag564
1.6
RON
(Ω)
1.2
(1)
VSW
V
VCC
S
VIL or VIH
Z
Y0 1 switch
Y1 2
VI
0.8
switch
S
1
VIL
2
VIH
(2)
(3)
(4)
0.4
(5)
(6)
ISW
0
GND
0
1
2
RON = VSW / ISW.
3
4
5
VI (V)
001aag563
(1) VCC = 1.5 V.
(2) VCC = 1.8 V.
(3) VCC = 2.5 V.
(4) VCC = 2.7 V.
(5) VCC = 3.3 V.
(6) VCC = 4.3 V.
Measured at Tamb = 25 C.
Fig 6.
Test circuit for measuring ON resistance
NX3L1G3157_Q100
Product data sheet
Fig 7.
Typical ON resistance as a function of input
voltage
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Low-ohmic single-pole double-throw analog switch
001aag565
1.6
001aag566
1.0
RON
(Ω)
RON
(Ω)
0.8
1.2
(1)
(2)
(3)
(4)
0.6
(1)
(2)
(3)
(4)
0.8
0.4
0.4
0.2
0
0
0
1
2
3
0
1
2
VI (V)
(1) Tamb = 125 C.
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 8.
ON resistance as a function of input voltage;
VCC = 1.5 V
001aag567
1.0
3
VI (V)
Fig 9.
ON resistance as a function of input voltage;
VCC = 1.8 V
001aag568
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0.4
0.2
0.2
0
(1)
(2)
(3)
(4)
0
0
1
2
3
0
VI (V)
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 10. ON resistance as a function of input voltage;
VCC = 2.5 V
Product data sheet
2
3
VI (V)
(1) Tamb = 125 C.
NX3L1G3157_Q100
1
Fig 11. ON resistance as a function of input voltage;
VCC = 2.7 V
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Low-ohmic single-pole double-throw analog switch
001aag569
1.0
001aaj896
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
(1)
(2)
(3)
(4)
0.4
0.2
0.2
0
0
0
1
2
3
4
0
1
2
3
4
VI (V)
5
VI (V)
(1) Tamb = 125 C.
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 12. ON resistance as a function of input voltage;
VCC = 3.3 V
Fig 13. ON resistance as a function of input voltage;
VCC = 4.3 V
12. Dynamic characteristics
Table 9.
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 16.
Symbol Parameter
ten
tdis
enable time
disable time
Tamb = 25 C
Conditions
Product data sheet
Unit
Min
Max
VCC = 1.4 V to 1.6 V
-
28
43
-
48
52
ns
VCC = 1.65 V to 1.95 V
-
23
35
-
38
42
ns
VCC = 2.3 V to 2.7 V
-
17
27
-
29
32
ns
VCC = 2.7 V to 3.6 V
-
14
25
-
27
30
ns
VCC = 3.6 V to 4.3 V
-
14
25
-
27
30
ns
-
9
20
-
25
30
ns
Min
Max
(85 C)
Max
(125 C)
S to Z or Yn;
see Figure 14
S to Z or Yn;
see Figure 14
VCC = 1.4 V to 1.6 V
NX3L1G3157_Q100
Tamb = 40 C to +125 C
Typ[1]
VCC = 1.65 V to 1.95 V
-
6
15
-
20
23
ns
VCC = 2.3 V to 2.7 V
-
5
11
-
14
16
ns
VCC = 2.7 V to 3.6 V
-
4
10
-
12
14
ns
VCC = 3.6 V to 4.3 V
-
4
10
-
12
14
ns
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Low-ohmic single-pole double-throw analog switch
Table 9.
Dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 16.
Symbol Parameter
tb-m
Tamb = 25 C
Conditions
Tamb = 40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
(85 C)
Max
(125 C)
-
19
-
4
-
-
ns
VCC = 1.65 V to 1.95 V
-
17
-
4
-
-
ns
VCC = 2.3 V to 2.7 V
-
13
-
2
-
-
ns
VCC = 2.7 V to 3.6 V
-
10
-
2
-
-
ns
VCC = 3.6 V to 4.3 V
-
10
-
2
-
-
ns
break-before-make see Figure 15
time
VCC = 1.4 V to 1.6 V
[2]
[1]
Typical values are measured at Tamb = 25 C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.
[2]
Break-before-make guaranteed by design.
12.1 Waveform and test circuits
VI
VM
S input
GND
ten
VOH
Y1 connected to VEXT
tdis
VX
Z output
OFF to HIGH
HIGH to OFF
VX
GND
tdis
Y0 connected to VEXT
Z output
HIGH to OFF
OFF to HIGH
VOH
ten
VX
VX
001aag570
GND
Measurement points are given in Table 10.
Logic level: VOH is typical output voltage level that occurs with the output load.
Fig 14. Enable and disable times
Table 10.
Measurement points
Supply voltage
Input
Output
VCC
VM
VX
1.4 V to 4.3 V
0.5VCC
0.9VOH
NX3L1G3157_Q100
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Low-ohmic single-pole double-throw analog switch
VCC
S
Y0
Z
G
VI
V
VO
RL
Y1
VEXT = 1.5 V
CL
GND
001aag571
a. Test circuit
VI
0.5VI
0.9VO
0.9VO
VO
tb-m
001aag572
b. Input and output measurement points
Fig 15. Test circuit for measuring break-before-make timing
VCC
G
VI
V
VO
RL
S
Y0
1
Z
Y1
2
switch
VEXT = 1.5 V
CL
GND
001aag642
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 16. Load circuit for switching times
Table 11.
Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
1.4 V to 4.3 V
VCC
 2.5 ns
35 pF
50 
NX3L1G3157_Q100
Product data sheet
Load
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12.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf  2.5 ns; Tamb = 25 C.
Symbol Parameter
Conditions
THD
fi = 20 Hz to 20 kHz; RL = 32 ; see Figure 17
f(3dB)
iso
total harmonic
distortion
Min
Qinj
0.15
-
%
VCC = 1.65 V; VI = 1.2 V (p-p)
-
0.10
-
%
VCC = 2.3 V; VI = 1.5 V (p-p)
-
0.02
-
%
VCC = 2.7 V; VI = 2 V (p-p)
-
0.02
-
%
VCC = 4.3 V; VI = 2 V (p-p)
-
0.02
-
%
-
60
-
MHz
-
90
-
dB
VCC = 1.4 V to 3.6 V
-
0.2
-
V
VCC = 3.6 V to 4.3 V
-
0.3
-
V
VCC = 1.5 V
-
3
-
pC
VCC = 1.8 V
-
4
-
pC
VCC = 2.5 V
-
6
-
pC
VCC = 3.3 V
-
9
-
pC
VCC = 4.3 V
-
15
-
pC
RL = 50 ; see Figure 18
isolation (OFF-state)
fi = 100 kHz; RL = 50 ; see Figure 19
[1]
charge injection
Unit
-
3 dB frequency
response
crosstalk voltage
Max
VCC = 1.4 V; VI = 1 V (p-p)
[1]
VCC = 1.4 V to 4.3 V
[1]
VCC = 1.4 V to 4.3 V
Vct
Typ
[1]
between digital inputs and switch;
fi = 1 MHz; CL = 50 pF; RL = 50 ; see Figure 20
fi = 1 MHz; CL = 0.1 nF; RL = 1 M; Vgen = 0 V;
Rgen = 0 ; see Figure 21
fi is biased at 0.5VCC.
12.3 Test circuits
VCC
0.5VCC
RL
S
VIL or VIH
Z
Y0 1 switch
Y1 2
fi
switch
S
1
VIL
2
VIH
D
GND
001aag573
Fig 17. Test circuit for measuring total harmonic distortion
NX3L1G3157_Q100
Product data sheet
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
0.5VCC
RL
S
VIL or VIH
Y0 1 switch
Y1 2
Z
fi
switch
S
1
VIL
2
VIH
dB
GND
001aag574
To obtain 0 dBm level at output, adjust fi voltage. Increase fi frequency until dB meter reads 3 dB.
Fig 18. Test circuit for measuring the frequency response when channel is in ON-state
0.5VCC
VCC
0.5VCC
RL
RL
S
VIL or VIH
Y0 1 switch
Y1 2
Z
fi
switch
S
1
VIH
2
VIL
dB
GND
001aag561
To obtain 0 dBm level at output, adjust fi voltage.
Fig 19. Test circuit for measuring isolation (OFF-state)
NX3L1G3157_Q100
Product data sheet
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
VI
G
logic
input
S
Y0
1
Z
Y1
2
switch
S
1
VIL
2
VIH
switch
RL
RL
0.5VCC
0.5VCC
CL
V
VO
001aah442
a. Test circuit
logic
input (S)
off
on
off
Vct
VO
001aah443
b. Input and output pulse definitions
Fig 20. Test circuit for measuring crosstalk voltage between digital inputs and switch
NX3L1G3157_Q100
Product data sheet
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
VCC
S
Y0
1
Z
Y1
2
switch
Rgen
VI
G
VO
RL
CL
Vgen
GND
001aac366
a. Test circuit
logic
(S) off
input
on
VO
off
ΔVO
001aac478
b. Input and output pulse definitions
Definition: Qinj = VO  CL.
VO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
Fig 21. Test circuit for measuring charge injection
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
13. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 22. Package outline SOT363 (SC-88)
NX3L1G3157_Q100
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Low-ohmic single-pole double-throw analog switch
14. Abbreviations
Table 13.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MIL
Military
MM
Machine Model
PDA
Personal Digital Assistant
TTL
Transistor-Transistor Logic
15. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX3L1G3157_Q100 v.1
20130523
Product data sheet
-
-
NX3L1G3157_Q100
Product data sheet
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Rev. 1 — 23 May 2013
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Low-ohmic single-pole double-throw analog switch
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NX3L1G3157_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 23 May 2013
© NXP B.V. 2013. All rights reserved.
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NXP Semiconductors
Low-ohmic single-pole double-throw analog switch
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX3L1G3157_Q100
Product data sheet
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Low-ohmic single-pole double-throw analog switch
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
11.2
11.3
12
12.1
12.2
12.3
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ON resistance test circuit and graphs. . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Waveform and test circuits . . . . . . . . . . . . . . . 11
Additional dynamic characteristics . . . . . . . . . 13
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 May 2013
Document identifier: NX3L1G3157_Q100