USER GUIDES

User Guide 036
lSL8273MEVAL1Z Evaluation Board User Guide
Description
Key Features
The ISL8273M is a 80A step-down DC/DC power supply
module with an integrated digital PWM controller, dual-phase
synchronous power switches, inductors and passives. Only
input/output capacitors and minimal passives are needed to
finish the design. 80A of continuous output current can be
delivered without a need of airflow or heatsink. The ISL8273M
uses ChargeMode™ control (ASCR) architecture, which
responds to a transient load within a single switching cycle.
• VIN range of 4.5V to 14V, VOUT adjustable from 0.6V to 2.5V
• Programmable VOUT, margining, input and output UVP/OVP,
IOUT limit, OTP/UTP, soft-start/stop, sequencing and
external synchronization
• Monitor: VIN, VOUT, IOUT, temperature, duty cycle, switching
frequency and faults
• ChargeMode™ control tunable with PMBus
• Mechanical switch for enable and power-good LED indicator
The ISL8273MEVAL1Z evaluation board is a 4.7inx4.8in
8-layer FR4 board with 2oz. copper on all layers. This
evaluation board comes with placeholders for pin-strap
resistor population to adjust output voltage, switching
frequency, soft-start/stop timing and input UVLO threshold,
ASCR gain and residual parameters and device PMBus™
address. More configurations, such as sequencing, Digital-DC™
(DDC) bus configuration and fault limits can be easily
programmed or changed via PMBus compliant serial bus
interface.
Specifications
This board has been configured for the following operating
conditions by default:
• VIN = 5V to 12V
• VOUT = 1V
• IMAX = 80A
• fSW = 364kHz
The optional ZLUSBEVAL3Z (USB to PMBus adapter) is
provided with this evaluation board, which connects the
evaluation board to a PC to activate the PMBus
communication interface. The PMBus command set is
accessed by using the PowerNavigator™ evaluation software
from a PC running Microsoft Windows. The ISL8273MEVAL1Z
can operate in pin-strap mode without needing the
ZLUSBEVAL3Z adapter or PMBus communication.
• Peak efficiency: >90% at 70% load
• Output ripple: <10mVP-P
• ASCR gain = 200, ASCR residual = 90
• On/off delay = 5ms; On/off ramp time = 5ms
Ordering Information
References
PART NUMBER
DESCRIPTION
ISL8273MEVAL1Z
ISL8273M datasheet
ISL8273M evaluation board, ZLUSBEVAL3Z
adapter, USB cable
INTER-DEVICE CONNECTION
(OPTIONAL)
VOUT 1V
(CAN BE ADJUSTED
0.6V TO 2.5V)
DDC
VIN
SYNC
VIN
5V TO 12V
VOUT
VDD
EN
PG
PMBus DONGLE
CONNECTION
(OPTIONAL)
SDA
SCL
ISL8273M
VSENP
VSENN
SALRT
FIGURE 1. BLOCK DIAGRAM
August 7, 2015
UG036.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015. All Rights Reserved
Intersil (and design), PowerNavigator, ChargeMode and Digital-DC are trademarks owned by Intersil Corporation or
one of its subsidiaries. All other trademarks mentioned are the property of their respective owners.
User Guide 036
PGOOD LED
INTERCONNECTS DDC AND
SYNC BETWEEN BOARDS
ENABLE SWITCH
INTERCONNECTS DDC
AND SYNC
BETWEEN BOARDS
TO DAISY CHAIN PMBus
CONNECTION
CONNECT TO ZLUSBEVAL3Z
DONGLE. FOR MULTIPLE
BOARD EVALUATION,
CONNECT TO PMBus DONGLE
OUT CONNECTION OF OTHER
BOARD
VOUT REGULATION MONITOR
FIGURE 2. TOP SIDE
RESISTOR PLACEHOLDERS
FIGURE 3. BOTTOM SIDE
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User Guide 036
Recommended Equipment
• DC power supply with minimum 15V/40A sourcing capacity
• Electronic load capable of sinking current up to 80A
• Digital Multimeters (DMMs)
• Oscilloscope with higher than 100MHz bandwidth
Functional Description
The ISL8273MEVAL1Z provides all circuitry required to evaluate
the features of the ISL8273M. A majority of the features of the
ISL8273M, such as compensation-free ChargeMode™ control,
soft-start delay and ramp times, supply sequencing and voltage
margining are available on this evaluation board. For sequencing
evaluation, the board can be connected to any Intersil digital
module evaluation board that supports the DDC bus.
placeholder location on bottom layer. Refer to the “Switching
Frequency Resistor Settings” table in the ISL8273M
datasheet for recommended values.
11. To change soft-start/stop delay and ramp time, disconnect
board from the setup and populate a 1% standard 0603
resistor at R6 placeholder location on bottom layer. Refer to
the “Soft Start/Stop Resistor Settings” table in the ISL8273M
datasheet for recommended values.
12. To change UVLO, disconnect board from the setup and
populate a 1% standard 0603 resistor at the R6 placeholder
location on bottom layer. Refer to the “UVLO Resistor Settings”
table in the ISL8273M datasheet for recommended values.
Notice that the UVLO programming shares the same pin with
soft-start/stop programming.
Figures 2 and 3 show the board images of the ISL8273MEVAL1Z
evaluation board.
13. To change ASCR gain and residual, disconnect board from the
setup and populate a 1% standard 0603 resistor at the R7
placeholder location on bottom layer. Refer to the “ASCR
Resistor Settings” table and the design guide matrix in the
ISL8273M datasheet for recommended values.
Quick Start Guide
PMBus Option
Pin-strap Option
ISL8273MEVAL1Z can be evaluated for all features using the
provided ZLUSBEVAL3Z dongle and PowerNavigator™ evaluation
software. Follow these steps to evaluate theISL8273M with
PMBus option.
ISL8273MEVAL1Z can be configured in pin-strap mode with
standard 1% 0603 resistors. PMBus interface is not required to
evaluate ISL8273M in pin-strap mode. Output voltage (VOUT),
switching frequency (fSW), soft-start/stop delay and ramp time,
input undervoltage protection (UVLO) threshold, ASCR gain and
residual, and device PMBus address can be changed by
populating recommended resistors at placeholders provided in
the evaluation board. By default, the evaluation board operates
in pin-strap mode and regulates at VOUT = 1V, fSW = 364kHz,
soft-start/stop delay time = 5ms, soft-start/stop ramp
time = -5ms to 5ms, UVLO = 4.5V, ASCR gain = 200, ASCR
residual = 90 and PMBus address = 28h. Follow these steps to
evaluate the ISL8273M in pin-strap mode.
1. Set ENABLE switch to “DISABLE”.
2. Connect Load to VOUT lug connectors (J7-J8 and J9-J10).
3. Connect power supply to VIN connectors (J5 and J6). Make
sure power supply is not enabled when making connection.
4. Turn power supply on.
5. Set ENABLE switch to “ENABLE”.
6. Measure 1V VOUT at probe point labeled “VOUT REGULATION
MONITOR” (J11).
7. Observe switching frequency of 364kHz at probe points
labeled “PHASE1” (TP10) and “PHASE2” (TP11).
8. To measure the module efficiency, connect the multimeter
voltage probes at probe points labeled “VIN” (TP1), “GND”
(TP2) and “VOUT” (TP12).
9. To change VOUT, disconnect board from the setup and
populate a 1% standard 0603 resistor at RVSET placeholder
location on bottom layer. Refer to the “Output Voltage
Resistor Settings” table in the ISL8273M datasheet for
recommended values. By default, VOUT_MAX is set to 110%
of VOUT set by pin-strap resistor.
10. To change switching frequency, disconnect board from the
setup and populate a 1% standard 0603 resistor at the RFSET
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1. Install PowerNavigator™ software from the following Intersil
website: www.intersil.com/powernavigator
2. Set ENABLE switch to “DISABLE”.
3. Connect Load to VOUT lug connectors (J7-J8 and J9-J10).
4. Connect power supply to VIN connectors (J5 and J6). Make
sure power supply is not enabled when making connection.
5. Connect the ZLUSBEVAL3Z dongle (USB to PMBus™ adapter)
to the ISL8273MEVAL1Z board using the 6-pin male
connector labeled “PMBus DONGLE IN”.
6. Turn power supply on.
7. Connect supplied USB cable from computer USB to
ZLUSBEVAL3Z dongle.
8. Launch PowerNavigator™ software.
9. It is optional to load a predefined setup from a configuration
file using the PowerNavigator™ software. The ISL8273M
device on the board operates in pin-strap mode from factory
default, but the user may modify the operating parameters
through the evaluation software or by loading a predefined
set-up from a configuration file. A sample “Configuration File”
on page 7 is provided and can be copied to a notepad editor
to make desired changes. The default pin-strap
configurations will be overwritten if a user-defined
configuration file is loaded.
10. Set the ENABLE switch to “ENABLE”. Alternatively, the PMBus
ON_OFF_CONFIG and OPERATION commands may be used
from the PowerNavigator™ software to allow PMBus Enable.
11. Monitor and configure the ISL8273MEVAL1Z board using the
PMBus commands in the evaluation software. To store the
configuration changes, disable the module and use the
command STORE_USER_ALL. To restore factory default
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User Guide 036
settings, disable the module and use the command
RESTORE_FACTORY and STORE_USER_ALL.
12. PowerNavigator™ tutorial videos are available on the Intersil
website. www.intersil.com/powernavigator
13. For sequencing via Digital-DC Bus (DDC) or to evaluate
multiple Intersil digital power products using a single
ZLUSBEVAL3Z dongle, the ISL8273M can be daisy chained
with other digital power evaluation boards. The PMBus
address can be changed by placing a 1% standard 0603
resistor at the R4 placeholder location on the bottom layer.
Refer to the “SMBus Address Resistor Selection” table in the
ISL8273M datasheet for recommended values.
Evaluation Board Information
If input voltage is less than 5.3V, tie the VCC test point directly to
VIN or to a separate 5V power supply for best efficiency.
If external synchronization is used, connect the SYNC test point to
the external clock. Note that the external clock signal should be
active before the module is enabled.
VOUT Transient Response Check
The ISL8273MEVAL1Z board has a built-in transient load test
circuit (see the schematic in Figure 4). A 100A N-Channel
MOSFET (Manufacturer PN: BSC010NE2LSI) is connected across
VOUT and PGND next to the remote voltage sensing location
(CVSEN). A 10mΩ current-sense resistor R54 is used for
monitoring the drain-to-source current of the MOSFET. For a
transient load test, inject the gate drive pulse signal at J16. The
load current can be monitored through J15. Because the MOSFET
will operate in the saturation region instead of the linear region
when the gate turn-on signal is applied, the pulse width and duty
cycle of the gate signal must be limited small enough to avoid
MOSFET overheating (recommended duty cycle should be less
than 2%). The amplitude of the gate driver pulse voltage can be
adjusted to obtain a desired transient load current step size.
VOUT
BSC010NE2LSI
J16
J15
47k 
10m 
TRANSIENT LOAD
MONITOR
TRANSIENT LOAD
PULSE INPUT
FIGURE 4. SCHEMATIC FOR TRANSIENT LOAD MEASUREMENT
Thermal Considerations and
Current Derating
Board layout is very critical in order to make the module operate
safely and deliver maximum allowable power. To work in the high
temperature environments and carry large currents, the board
layout needs to be carefully designed to maximize thermal
performance. To achieve this, select enough trace width, copper
weight and the proper connectors.
The ISL8273MEVAL1Z evaluation board is designed for running
80A at room temperature without additional cooling systems
needed. However, if the output voltage is increased or the board
is operated at elevated temperatures, then the available current
is derated. Refer to the derated current curves in the ISL8273M
datasheet to determine the maximum output current the
evaluation board can supply. JA is measured by inserting a
thermocouple inside the module to measure peak junction
temperature.
PCB Layout Guidelines
The ISL8273MEVAL1Z board layout has been optimized for
electrical performance, low loss and good thermal performance.
The key features of the ISL8273MEVAL1Z layout are:
• Large PGND planes and a separate SGND plane. The SGND
plane is connected to PGND on the second layer with a single
point connection. Multiple vias are used for small pins such as
J16, H16, K16, M5, M14, M17 and N5 to connect to inner
SGND or PGND layer.
• Ceramic capacitors between VIN and PGND, VOUT and PGND,
and bypass capacitors between VDD, VDRV and the ground
plane are placed close to the module to minimize high
frequency noise. Some output ceramic capacitors are placed
close to the VOUT pads in the direction of the load current path
to create a low impedance path for the high frequency inductor
ripple current.
• Large copper areas are used for power path (VIN, PGND, VOUT)
to minimize conduction loss and thermal stress. Multiple vias
are used to connect the power planes in different layers.
• Remote sensing traces are connected from the regulation
point to VSENP and VSENN pins. The two traces are placed in
parallel, to achieve tight output voltage regulation. The
regulation point is on the right side of the board in between the
VOUT power lugs and the PGND power lugs.
• Multiple vias are used to connect PAD14 and 16 (SW1 and
SW2) to inner layers for better thermal performance. The inner
layer SW1 and SW2 traces are limited in area and are
surrounded by PGND planes to avoid noise coupling. Caution
was taken that no sensitive traces, such as the remote sensing
traces, were placed close to these noisy planes.
• SWD1 (L3) and SWD2 (P10) pins are connected to SW1 and
SW2 pads respectively with short loop wires of 40mil width.
The wire width should be at least 20mils.
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UG036.0
August 7, 2015
EN
FROM PREQUEL
VCC
C9
TP1
FROM PREQUEL
J1
SALRT
2
4
6
1 2
3 4
5 6
J3
SYNC
1
3
5
1 2
3 4
5 6
J2
1
3
5
DISABLE
VIN
2
4
6
DDC
TO SEQUEL
TO SEQUEL
1
SW1
TP8
5
ENABLE
3
2
SDA
SCL 1
VI2C 3
10K
R10
TP9
10UF
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ISL8273MEVAL1Z Schematic
J4
2
4
6
1 2
3 4
5 6
1
3
5
1 2
3 4
5 6
2
4
6
J7
VCC
COMMUNICATION CONNECTION
J8
E14
D14
V25
TP5
EN
NC
J11
1 2
200
R13
22UF
CVSEN
C25
470UF
C24
470UF
C23
100UF
C22
100UF
C21
100UF
C20
100UF
C19
470UF
C18
470UF
C16
100UF
C15
100UF
470UF
C32
470UF
C31
100UF
C30
100UF
C29
100UF
C28
100UF
VOUT
0.01
J15
R54
DNP
R7
10UF
2
7
3
6
4
R57
10UF
10UF
8
J9
VOUT
5
J10
BSC010NE2LSI
C12
47K
1
3
GRN
I00000273
PGND TIED TO SGND
D1
C17
1
J16
RED
10UF
C11
VCC
1.5K
C10
TP4
10UF
C8
R8
C14
VOUT
PG
U2
R9
1.5K
0
TP11
VR6
TP7
GND
R12
PHASE2
VR5
TP6
VCC
100UF
VSENN
C27
PGND
PGND
PGND
PGND
PGND
PAD1
PAD3
PAD5
L3
PAD14
PAD13
H4
H3
PAD2
PAD4
PAD7
P11
PAD16
PAD15
E15
F15
D5
G14
C13
VDRV1
VDRV1
VDD
VR
VR55
VIN
VIN
VIN
U1
N6
N16
M1
G15
L14
M13
R6
DNP
R5
21.5K
RVSET
DNP
17.8K
RFSET
DNP
R4
ISL8273MAIRZ
0
VOUT
PGND
PGND
SWD1
SW1
PGND
VSENP
VSENN
VOUT
PGND
PGND
SWD2
SW2
PGND
NC
NC
PG
ASCR
PAD10
PAD12
M5
M17
N5
R1
R2
6.65K
C1
0.1UF
UVLO
VMON
R11
User Guide 036
100K
TP3
VDRV
VDRV
VCC
V25
VR5
VR6
R3
4.75K
SCL
SDA
SALRT
SA
DDC
SYNC
NC
NC
VSET
NC
MGN
CS
SS/UVLO
VMON
SGND
SGND
SGND
SGND
SGND
TP12
100UF
R8
R17
L2
M10
K14
PAD8
PAD9
PAD11
VCC
C13
C12
C11
C10
E4
D13
F4
G4
C6
C5
C8
C7
D4
C9
H16
J16
K16
M14
PAD6
TP10
VSENP
TP2
SCL
SDA
SALRT
SA
DDC
SYNC
INTER-DEVICE CONNECTION
VOUT
PHASE1
GND
J6
VR55
C26
47UF
C2
22UF
C7
47UF
C6
22UF
C5
22UF
C4
C3
470UF
5
22UF
J5
DRAWN BY:
PG
3
PG
TIM KLEMANN
RELEASED BY:
4
2
UNDER DUT
2
TITLE:
DATE:
TIM KLEMANN
2N7002L
ENGINEER:
11/14/2014
DATE:
UPDATED BY:
Q1
1
DATE:
04/21/2015
ISL8273M 80A
EVALUATION BOARD
SCHEMATIC
TESTER
MASK#
FILENAME:
FIGURE 5. SCHEMATIC
DATE:
TAO TAO
HRDWR ID
REV.
ISL8273MEVAL1Z
ISL8273M/ISL8273MEVAL1ZA
SHEET
1
OF
A1
1
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User Guide 036
Bill of Materials
REFERENCE DESIGNATORS
QTY
C1
1
PANASONIC
ECJ-2VB1E104K
CAP, SMD, 0805, 0.1µF, 25V, 10%, X7R, ROHS
CVSEN
1
JOHANSON
DIELECTRICS INC
6R3R15X226KV4E
CAP, SMD, 0805, 22µF, 6.3V, 10%, X5R, ROHS
C8, C9, C10, C11, C12, C17
6
VENKEL
C1206X7R250-106KNE CAP, SMD, 1206, 10µF, 25V, 10%, X7R, ROHS
C13-C16, C20-C23, C27-C30
12
MURATA
GRM31CR60J107ME39L CAP, SMD, 1206, 100µF, 6.3V, 20%, X5R, ROHS
C2, C4, C5, C6
4
MURATA
GRM32ER71C226KE18L CAP, SMD, 1210, 22µF, 16V, 10%, X7R, ROHS
C7, C26
2
TDK
C3225X5R1C476M
CAP, SMD, 1210, 47µF, 16V, 20%, X5R, ROHS
C18, C19, C24, C25, C31, C32
6
SANYO
6TPE470MI
CAP-POSCAP, LOW ESR, SMD, D4, 470µF, 6.3V, 20%,
18mΩ, ROHS
C3
1
PANASONIC
EEE-1EA471P
CAP, SMD, 10mm, 470µF, 25V, 20%, ALUM.ELEC.,
380mA, ROHS
J5, J6
2
JOHNSON
COMPONENTS
108-0740-001
CONN-JACK, BANANA-SS-SDRLESS, VERTICAL, ROHS
TP1-TP12
12
KEYSTONE
5005
CONN-COMPACT TEST PT, VERTICAL, RED, ROHS
J11, J15, J16
3
BERG/FCI
69190-202HLF
CONN-HEADER, 1x2, RETENTIVE, 2.54mm, 0.230x0.120,
ROHS
J2, J4
2
SAMTEC
SSQ-103-02-T-D-RA
CONN-SOCKET STRIP, TH, 2x3, 2.54mm, TIN, R/A, ROHS
J1, J3
2
SAMTEC
TSW-103-08-T-D-RA
CONN-HEADER, 2x3, BRKAWY, 2.54mm, TIN, R/A, ROHS
D1
1
LUMEX
SSL-LXA3025IGC-TR
LED, SMD, 3x2.5mm, 4P, RED/GREEN, 12/20MCD, 2V
U1
1
INTERSIL
ISL8273MAIRZ
IC-80A DIGITAL DC/DC MODULE, 42P, HDA, ROHS
Q1
1
ON SEMICONDUCTOR 2N7002LT1G
TRANSISTOR-MOS, N-CHANNEL, SMD, SOT23, 60V,
115mA, ROHS
U2
1
INFINEON
TECHNOLOGY
TRANSIST-MOS, N-CHANNEL, 8P, PG-TDSON-8, 25V, 100A,
ROHS
R4-R7
0
R11, R12
2
VENKEL
CR0603-10W-000T
RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS
R10
1
KOA
RK73H1JT1002F
RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS
R1
1
VENKEL
CR0603-10W-1003FT
RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS
R8, R9
2
VENKEL
CR0603-10W-1501FT
RES, SMD, 0603, 1.5k, 1/10W, 1%, TF, ROHS
RFSET
1
PANASONIC
ERJ-3EKF1782V
RES, SMD, 0603, 17.8k, 1/10W, 1%, TF, ROHS
R13
1
VENKEL
CR0603-10W-2000FT
RES, SMD, 0603, 200Ω, 1/10W, 1%, TF, ROHS
RVSET
1
VENKEL
CR0603-10W-2152FT
RES, SMD, 0603, 21.5k, 1/10W, 1%, TF, ROHS
R57
1
YAGEO
RC0603FR-0747KL
RES, SMD, 0603, 47k, 1/10W, 1%, TF, ROHS
R3
1
VENKEL
CR0603-10W-4751FT
RES, SMD, 0603, 4.75k, 1/10W, 1%, TF, ROHS
R2
1
YAGEO
RC0603FR-076K65L
RES, SMD, 0603, 6.65k, 1/10W, 1%, TF, ROHS
R54
1
VISHAY
WSL2512R0100FEA
RES-CURR.SENSE, SMD, 2512, 0.01Ω, 1W, 1%, ROHS
SW1
1
C&K COMPONENTS
GT13MCBE
SWITCH-TOGGLE, THRU-HOLE, 5PIN, SPDT, 3POS, ON-OFFON, ROHS
J7-J10
4
BERG/FCI
KPA8CTP
HDWARE,MTG, CABLE TERMINAL,6-14AWG, LUG and
SCREW, ROHS
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6
MANUFACTURER
MANUFACTURER PART
BSC010NE2LSI
DESCRIPTION
RESISTOR, SMD, 0603, 0.1%, MF, DNP-PLACE HOLDER
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User Guide 036
Configuration File
Sample Configuration File for ISL8273M Module. Copy and paste (from RESTORE_FACTORY TO ### End User Store) to a notepad and
save it as Confile_file_name.txt. The # symbol is used for a comment line. Following settings are already loaded to ISL8273M module
as factory defaults.
RESTORE_FACTORY
STORE_USER_ALL
# VOUT Related
VOUT_COMMAND
VOUT_MAX
VOUT_MARGIN_HIGH
VOUT_MARGIN_LOW
VOUT_OV_FAULT_LIMIT
VOUT_OV_FAULT_RESPONSE
VOUT_OV_WARN_LIMIT
VOUT_UV_WARN_LIMIT
VOUT_UV_FAULT_LIMIT
VOUT_UV_FAULT_RESPONSE
POWER_GOOD_ON
VOUT_TRANSITION_RATE
VOUT_DROOP
VOUT_CAL_OFFSET
# IOUT Related
IOUT_CAL_GAIN
IOUT_CAL_OFFSET
IOUT_OC_FAULT_LIMIT
IOUT_UC_FAULT_LIMIT
MFR_IOUT_OC_FAULT_RESPONSE
MFR_IOUT_UC_FAULT_RESPONSE
ISENSE_CONFIG
# Other Faults
OT_FAULT_LIMIT
OT_FAULT_RESPONSE
OT_WARN_LIMIT
UT_WARN_LIMIT
UT_FAULT_LIMIT
UT_FAULT_RESPONSE
VIN_OV_FAULT_LIMIT
VIN_OV_FAULT_RESPONSE
VIN_OV_WARN_LIMIT
VIN_UV_WARN_LIMIT
VIN_UV_FAULT_LIMIT
VIN_UV_FAULT_RESPONSE
#Enable, Timing and Sequence Related
ON_OFF_CONFIG
TON_DELAY
TON_RISE
TOFF_DELAY
TOFF_FALL
POWER_GOOD_DELAY
FREQUENCY_SWITCH
SYNC_CONFIG
SEQUENCE
# Manufacturer Related
MFR_ID
MFR_MODEL
MFR_REVISION
MFR_LOCATION
MFR_DATE
MFR_SERIAL
USER_DATA_00
# Advance Settings
USER_CONFIG
DDC_CONFIG
DDC_GROUP
# Loop Compensation
ASCR_CONFIG
STORE_USER_ALL
### End User Store
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7
# reset device to the factory setting
# Clears user memory space
0x80
# Disable and no retry
0x80
# Disable and no retry
0xba00
0x0000
0x0000
# 1 mV/us
# 0 mV/A
# 0 mV/A
0xb370
0x0000
# 0.86 mV/A
#0A
0x80
0x80
# Disable and no retry
# Disable and no retry
0xebe8
0x80
0xeb70
0xdc40
0xe530
0x80
0xd380
0x80
0xd353
0xca5d
0xca40
0x80
# 125 °C
# Disable and no retry
# 110 °C
# -30 °C
# -45 °C
# Disable and no retry
# 14 V
# Disable and no retry
# 13.3 V
# 4.73 V
# 4.5 V
# Disable and no retry
0x16
0xca80
0xca80
0xca80
0xca80
0xca00
# Pin Enable, Soft Off
# 5 ms
# 5 ms
# 5 ms
# 5 ms
# 4 ms
0x00
0x0000
# Use Pin-strap for FSW setting
# Sequence Disabled
Intersil Corp
Rev-1
Milpitas, CA
09/05/2014
1234
Module
# Example Only
# Example Only
# Example Only
# Example Only
# Example Only
# Example Only
# Example Only
0x80
0x0a01
0x00000000
# ASCR on for Start, Open Drain PG
# DDC rail ID = 10, 2-phase
# All Broadcast disabled
# ASCR gain = , Residual =
# Store all above settings to NVRAM
UG036.0
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User Guide 036
Layout
FIGURE 6. SILKSCREEN TOP
FIGURE 7. TOP LAYER COMPONENT SIDE
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Layout (Continued)
FIGURE 8. LAYER 2
FIGURE 9. LAYER 3
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Layout (Continued)
FIGURE 10. LAYER 4
FIGURE 11. LAYER 5
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Layout (Continued)
FIGURE 12. LAYER 6
FIGURE 13. LAYER 7
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User Guide 036
Layout (Continued)
FIGURE 14. BOTTOM LAYER SOLDER SIDE
FIGURE 15. SILKSCREEN BOTTOM
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User Guide 036
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board.
80
80
70
421kHz
70
60
50
READ_IOUT
READ_IOUT
60
533kHz
40
300kHz
30
889kHz
20
50
+25°C
+65°C
40
30
+45°C
20
10
10
0°C
0
0
10
20
30
40
50
60
70
0
80
0
10
80
40
50
60
70
80
80
70
471kHz
70
60
60
READ_IOUT
READ_IOUT
30
FIGURE 17. OUTPUT CURRENT MEASUREMENT ACCURACY AT
VIN = 12V, VOUT = 1V, fSW = 300kHz FOR VARIOUS
AMBIENT TEMPERATURES
FIGURE 16. OUTPUT CURRENT MEASUREMENT ACCURACY AT
VIN = 12V, VOUT = 1V, TA = +25°C FOR VARIOUS
SWITCHING FREQUENCIES
50
889kHz
571kHz
40
30
20
+25°C
+65°C
50
40
30
+45°C
20
10
0
20
ACTUAL OUTPUT CURRENT (A)
ACTUAL OUTPUT CURRENT (A)
670kHz
0
10
20
10
30
40
50
60
70
0
80
0°C
0
10
ACTUAL OUTPUT CURRENT (A)
20
30
40
50
60
100
94
95 2.5V, 530kHz
80
FIGURE 19. OUTPUT CURRENT MEASUREMENT ACCURACY AT
VIN = 12V, VOUT = 2.5V, fSW = 571kHz FOR VARIOUS
AMBIENT TEMPERATURES
FIGURE 18. OUTPUT CURRENT MEASUREMENT ACCURACY AT
VIN = 12V, VOUT = 2.5V, TA = +25°C FOR VARIOUS
SWITCHING FREQUENCIES
1.8V, 346kHz
70
ACTUAL OUTPUT CURRENT (A)
1.2V, 300kHz
2.5V
92
85
1V, 300kHz
1.5V, 346kHz
80
0.8V, 300kHz
75
70
65
EFFICIENCY (%)
EFFICIENCY (%)
1.8V
90
90
88
10
20
30
40
50
60
70
80
LOAD CURRENT (A)
FIGURE 20. EFFICIENCY vs OUTPUT CURRENT AT VIN = 12V, FOR
VARIOUS OUTPUT VOLTAGES
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1.2V
86
84
82
0
1.5V
80
300
1V
0.8V
350
400
450
500
550
FREQUENCY (kHz)
600
650
700
FIGURE 21. EFFICIENCY vs SWITCHING FREQUENCY AT VIN = 12V,
IOUT = 70A FOR VARIOUS OUTPUT VOLTAGES
UG036.0
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User Guide 036
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
ASCR GAIN = 140
RESIDUAL = 90
ASCR GAIN = 220
RESIDUAL = 90
VOUT (50mV/DIV)
VOUT (100mV/DIV)
IOUT (20A/DIV)
IOUT (20A/DIV)
50µs/DIV
50µs/DIV
FIGURE 22. LOAD TRANSIENT RESPONSE AT VIN = 12V, VOUT = 1V,
IOUT = 0A TO 40A (>100A/μs), fSW = 300kHz.
COUT = 14 x 100μF CERAMIC + 6 x 470μF POSCAP
FIGURE 23. LOAD TRANSIENT RESPONSE AT VIN = 12V, VOUT = 2.5V,
IOUT = 0A TO 40A (>100A/μs), fSW = 800kHz.
COUT = 6 x 100μF CERAMIC + 3 x 470μF POSCAP
ENABLE
ENABLE
VOUT (500mV/DIV)
VOUT (500mV/DIV)
POWER GOOD
POWER GOOD
5ms/DIV
5ms/DIV
FIGURE 24. SOFT-START AT VIN = 12V, VOUT = 1V, TON_DELAY = 5ms,
TON_RISE = 5ms, POWER_GOOD_DELAY = 3ms
FIGURE 25. SOFT-STOP AT VIN = 12V, VOUT = 1V, TOFF_DELAY = 5ms,
TOFF_FALL = 5ms
SW1 (10V/DIV)
SW1 (10V/DIV)
SW2 (10V/DIV)
SW2 (10V/DIV)
VOUT (500mV/DIV)
VOUT (500mV/DIV)
IIN5A/DIV
50µs/DIV
FIGURE 26. OUTPUT SHORT-CIRCUIT PROTECTION AT VIN = 12V,
VOUT = 1V, fSW = 421kHz
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50µs/DIV
FIGURE 27. OUTPUT OVERVOLTAGE PROTECTION AT VIN = 12V,
VOUT = 1V, fSW = 421kHz,
VOUT_OV_FAULT_LIMIT = 1.15V
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Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
SW1 (10V/DIV)
SW1 (10V/DIV)
SW2 (10V/DIV)
SW2 (10V/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IIN (5A/DIV)
IIN (5A/DIV)
50ms/DIV
50ms/DIV
FIGURE 28. OUTPUT SHORT-CIRCUIT PROTECTION WITH
CONTINUOUS RETRY ENABLED (HICCUP MODE),
VIN = 12V, VOUT = 1V
MODULE #1:VOUT = 1V
MODULE #2:VOUT = 1.5V
MODULE #3:VOUT = 2.5V
VOUT_3 (1V/DIV)
FIGURE 29. OUTPUT SHORT-CIRCUIT RECOVERY FROM CONTINUOUS
RETRY (HICCUP MODE). VIN = 12V, VOUT = 1V
MODULE #1:VOUT = 1V
MODULE #2:VOUT = 1.5V
MODULE #3:VOUT = 2.5V
VOUT_3 (1V/DIV)
VOUT_2 (1V/DIV)
VOUT_2 (1V/DIV)
VOUT_1 (1V/DIV)
VOUT_1 (1V/DIV)
ENABLE
ENABLE
5ms/DIV
FIGURE 30. SOFT-START WITH OUTPUT SEQUENCING AT VIN = 12V,
THREE ISL8273MEVAL1Z BOARDS ARE CONNECTED IN
DAISY CHAIN
5ms/DIV
FIGURE 31. SOFT-STOP WITH OUTPUT SEQUENCING AT VIN = 12V,
THREE ISL8273MEVAL1Z BOARDS ARE CONNECTED IN
DAISY CHAIN
10V/DIV
SW1 OF MODULE #1
SW2 OF MODULE #1
10V/DIV
VOUT (200mV/DIV)
SW1 OF MODULE #2
10V/DIV
SW2 OF MODULE #2
10V/DIV
5ms/DIV
FIGURE 32. DYNAMIC VOLTAGE SCALING WITH VOUT
CHANGE FROM 1V TO 1.1V, VIN = 12V,
VOUT_TRANSITION_RATE = 1mV/µs
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1µs/DIV
FIGURE 33. PHASE SPREADING/INTERLEAVING, TWO
ISL8273MEVAL1Z BOARDS ARE CONNECTED IN DAISY
CHAIN, MODULE #1 RAIL POSITION: 0; MODULE #2
RAIL POSITION:4. VIN = 12V, VOUT_1 = 1.8V,
VOUT_2 = 1.2V, fSW = 421kHz
UG036.0
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User Guide 036
Typical Performance Data The following data was acquired using a ISL8273MEVAL1Z evaluation board. (Continued)
FIGURE 34. THERMAL IMAGE AT VIN = 12V, VOUT = 1V, IOUT = 80A,
fSW = 300kHz, TA = +25°C, NO AIRFLOW
FIGURE 35. THERMAL IMAGE AT VIN = 12V, VOUT = 1.8V, IOUT = 80A,
fSW = 350kHz, TA = +25°C, NO AIRFLOW
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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