Datasheet

DATASHEET
±16.5kV ESD Protected, +125°C, 1.8V to 3.6V,
Low Power, SOT-23, RS-485/RS-422 Transmitters
ISL32613E, ISL32614E
Features
The Intersil ISL32613E and ISL32614E are ±16.5kV HBM ESD
Protected (7kV IEC61000 contact), 1.8V powered, single
transmitters for differential communication. These drivers
have very low bus currents (±40µA), so they present less than
a “1/8 unit load” to the bus. This allows more than 256
transmitters on the network, without violating the RS-485
specification’s 32 unit load maximum and without using
repeaters.
• Wide supply voltage range . . . . . . . . . . . . . . . . . . 1.8V to 3.6V
Hot Plug circuitry ensures that the Tx outputs remain in a high
impedance state while the power supply stabilizes.
• Hot Plug - Tx outputs remain three-state during power-up
Both ICs utilize slew rate limited drivers, which reduce EMI and
minimize reflections from improperly terminated transmission
lines or unterminated stubs in multidrop and multipoint
applications. The ISL32613E is more slew rate limited for data
rates up to 128kbps, while the less limited ISL32614E is
useful for data rates up to 256kbps.
• Slew rate limited for data rates up to 256kbps
For companion low power single RS-485 receivers, please see
the ISL32610E datasheet.
Applications
• Low quiescent supply current. . . . . . . . . . . . . . . . 80µA (max)
- Very low shutdown supply current . . . . . . . . . . . 2µA (max)
• High ESD protection on RS-485 outputs . . . . ±16.5kV HBM
- Class 3 ESD level on all other pins. . . . . . . . . . . >8kV HBM
• Specified for +125°C or full military temperature range
• Low Tx leakage allows >256 devices on the bus
• Current limiting and thermal shutdown for driver overload
protection
• 5V tolerant logic inputs
• Pb-Free (RoHS Compliant)
• Industrial/process control networks
• Space-constrained systems
• Factory automation
• Building environmental control/lighting systems
10m
Truth Table
RD = ∞, CD = 50pF
TRANSMITTING
INPUTS
DYNAMIC (128kbps)
ICC (A)
1m
STATIC
100µ
OUTPUTS
DE (Note 9)
DI
Z
Y
1
1
0
1
1
0
1
0
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode
10µ
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
VCC (V)
FIGURE 1. ISL32613E WITH VCC = 1.8V REDUCES OPERATING
ICC BY A FACTOR OF 177 COMPARED WITH ICC AT
VCC = 3.6V
July 27, 2015
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1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011, 2012, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL32613E, ISL32614E
Pin Configuration
Pin Descriptions
ISL32613E, ISL32614E
(6 LD SOT-23)
TOP VIEW
DI 1
VCC 2
PIN #
PIN
NAME
1
DI
5 GND
2
VCC
System power supply input (1.8V to 3.6V).
4 Z
3
DE
Driver output enable. The driver outputs, Y and
Z, are enabled by bringing DE high, and are high
impedance when DE is low. If the driver enable
function is not needed, connect DE to VCC
through a 1kΩ to 2kΩ resistor.
4
Z
5
GND
6
Y
6 Y
D
DE 3
FUNCTION
Driver input. A low on DI forces output Y low and
output Z high. Similarly, a high on DI forces
output Y high and output Z low.
±16.5kV HBM, ±7kV IEC61000 (contact
method) ESD Protected inverting differential
transmitter output.
Ground connection
±16.5kV HBM, ±7kV IEC61000 (contact
method) ESD Protected noninverting
differential transmitter output.
TABLE 1. SUMMARY OF FEATURES AT VCC = 1.8V
PART NUMBER
FUNCTION
DATA RATE
(kbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
TX ENABLE?
(Note 9)
MAXIMUM QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL32613E
1 Tx
128
Yes
Yes
Yes
80
Yes
6 Ld SOT
ISL32614E
1 Tx
256
Yes
Yes
Yes
80
Yes
6 Ld SOT
Ordering Information
PART
MARKING
(Note 4)
PART NUMBER
(Notes 1, 2)
TEMP RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
ISL32613EFHZ-T
613F
-40 to +125
6 Ld SOT-23
P6.064
ISL32613EFHZ-T7A
613F
-40 to +125
6 Ld SOT-23
P6.064
ISL32614EFHZ-T
614F
-40 to +125
6 Ld SOT-23
P6.064
ISL32614EFHZ-T7A
614F
-40 to +125
6 Ld SOT-23
P6.064
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32613E, ISL32614E. For more information on MSL please see
techbrief TB363.
4. SOT-23 “PART MARKING” is branded on the bottom side.
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Typical Operating Circuits
+1.8V
+1.8V
+
1
0.1µF
0.1µF
+
2
VCC
3 RO
VCC
R
D
5 RE
B 4
4 Z
A 6
6 Y
ISL32611E
DI 1
DE 3
ISL3261XE
GND
GND
2
5
FIGURE 2. NETWORK WITH ENABLES
+1.8V
+
1
VCC
3 RO
0.1µF
0.1µF
+1.8V
1kΩ TO 2kΩ (Note 9)
+
2
3
DE
VCC
R
D
B 4
4 Z
A 5
6 Y
DI 1
ISL3261XE
ISL32610E
GND
2
GND
5
FIGURE 3. NETWORK WITHOUT ENABLES
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Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltages
DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z (VCC = 0V or ≥ 2.7V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
Y, Z (VCC = 1.8V, Output Enabled)) . . . . . . . . . . . . . . . . . . . . . . -8V to +3V
Y, Z (VCC = 1.8V, Output Disabled)) . . . . . . . . . . . . . . . . . . . . . . -8V to +8V
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . see “Electrical Specifications”
Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . . +125°C
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
6 Ld SOT-23 Package (Notes 5, 6). . . . . . . .
177
95
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see TB493
Recommended Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V
Common Mode Range; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2V
VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V
Temperature Range
(F Suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
Differential Load (RD); VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥10kΩ
VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥60Ω
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. For JC, the “case temp” location is taken at the package top center.
Electrical Specifications
temperature range. (Note 7)
PARAMETER
VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply across the operating
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10)
UNIT
DC CHARACTERISTICS
Driver Differential VOUT
VOD
Change in Magnitude of Driver
Differential VOUT for Complementary
Output States
Driver Common Mode VOUT
Change in Magnitude of Driver
Common Mode VOUT for
Complementary Output States
Logic Input High Voltage (DI, DE)
VCC = 1.8V
Full
0.8
0.92
-
V
VCC ≥ 3.15V
Full
2
-
-
V
RL = 54Ω (Figure 4), VCC ≥ 3V
Full
1.5
-
-
V
No Load
Full
1.1
1.45
VCC
V
VOD
RL = 100Ω (Figure 4)
Full
-
0.01
0.2
V
V0C
RL = 100Ω (Figure 4)
Full
-
1.1
1.4
V
VOC
RL = 100Ω (Figure 4)
Full
-
0.01
0.2
V
VCC = 1.8V
Full
1.26
-
-
V
2.7V ≤ VCC ≤ 3.6V
Full
2.2
-
-
V
VCC = 1.8V
Full
-
-
0.4
V
2.7V ≤ VCC ≤ 3.6V
Full
-
-
0.8
V
VIH
Logic Input Low Voltage (DI, DE)
VIL
RL = 100Ω (Figure 4)
Logic Input Current
IIN
DI = DE = 0V or VCC (Note 9)
Full
-2
-
2
µA
Output Leakage Current
(Y, Z, Note 9)
IOZ
DE = 0V,
VCC = 0V or 1.8V, or 3.6V
VO = 7V at VCC = 1.8V
Full
-
0.1
30
µA
VO = 12V at VCC = 3.6V
Full
-
0.1
40
µA
VO = -7V
Full
-40
-8
-
µA
VCC = 1.8V, DE = VCC, -2V ≤ VO ≤ 2V
Full
-
-
±250
mA
VCC ≥ 2.7V, DE = VCC, -7V ≤ VO ≤ 12V
Full
-
±150
-
mA
Driver Short-circuit Current,
VO = High or Low (Note 8)
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ISL32613E, ISL32614E
Electrical Specifications
VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply across the operating
temperature range. (Note 7) (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10)
UNIT
SUPPLY CURRENT
No-load Supply Current
ICC
Shutdown Supply Current
ISHDN
DE = VCC = 1.8V, DI = 0V or VCC
Full
-
20
80
µA
DE = VCC, 2.7V ≤ VCC ≤ 3.6V, DI = 0V or VCC
Full
-
100
150
µA
1.8V ≤ VCC ≤ 3.6V, DE = 0V, DI = 0V or VCC
Full
-
0.01
2
µA
Human Body Model, from bus pins to GND
25
-
±16.5
-
kV
IEC61000 Contact, from bus pins to GND
25
-
±7
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±8
-
kV
Machine Model
25
-
±400
-
V
VCC = 1.8V
Full
128
-
-
kbps
3V ≤ VCC ≤ 3.6V
Full
256
-
-
kbps
VCC = 1.8V
Full
-
1700
2600
ns
3V ≤ VCC ≤ 3.6V
Full
-
1100
1500
ns
VCC = 1.8V
Full
-
30
200
ns
3V ≤ VCC ≤ 3.6V
Full
-
2
30
ns
VCC = 1.8V
Full
-
1600
2600
ns
3V ≤ VCC ≤ 3.6V
Full
400
960
1500
ns
ESD PERFORMANCE
RS-485 Pins (Y, Z)
All Pins
DRIVER SWITCHING CHARACTERISTICS (ISL32613E, 128kbps Version)
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
Driver Differential Output Skew
tDSK
Driver Differential Rise or Fall Time
tR, tF
CD = 50pF (Figure 5)
CD = 50pF (Figure 5)
CD = 50pF (Figure 5)
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND (Figure 6)
Full
-
460
800
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
460
800
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND (Figure 6)
Full
-
60
250
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
60
250
ns
VCC = 1.8V
Full
256
-
-
kbps
3V ≤ VCC ≤ 3.6V
Full
500
-
-
kbps
RD = ∞, CD = 50pF
(Figure 5)
VCC = 1.8V
Full
-
700
2000
ns
3V ≤ VCC ≤ 3.6V
Full
-
350
500
ns
RD = ∞, CD = 50pF
(Figure 5)
VCC = 1.8V
Full
-
30
200
ns
3V ≤ VCC ≤ 3.6V
Full
-
2
30
ns
VCC = 1.8V
Full
-
1700
2600
ns
DRIVER SWITCHING CHARACTERISTICS (ISL32614E, 256kbps Version)
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
Driver Differential Output Skew
tDSK
RD = ∞, CD = 50pF
Driver Differential Rise or Fall Time
tR, tF
RD = ∞, CD = 50pF
(Figure 5)
3V ≤ VCC ≤ 3.6V
Full
200
350
800
ns
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND (Figure 6)
Full
-
460
800
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
460
800
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND (Figure 6)
Full
-
60
250
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
60
250
ns
NOTES:
7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified.
8. Applies to peak current. See “Typical Performance Curves” on page 8 for more information.
9. If the Driver Enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor.
10. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design.
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Test Circuits and Waveforms
VCC
RL/2
DE
Z
DI
VOD
D
Y
RL/2
VOC
FIGURE 4. DC DRIVER TEST CIRCUITS
VCC
DI
50%
50%
0V
tSD2
tSD1
DE
VCC
Z
DI
VOH
OUT (Z)
RD
D
50%
CD
50%
VOL
OUT (Y)
Y
tDDHL
tDDLH
SIGNAL
GENERATOR
DIFF OUT (Y - Z)
90%
50%
10%
tR
-VOD
tF
tDSK = |tDDLH - tDDHL|
tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)|
FIGURE 5A. TEST CIRCUIT
+VOD
90%
50%
10%
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
VCC
Z
DI
500Ω
D
SIGNAL
GENERATOR
VCC
SW
Y
DE
50%
50%
0V
GND
50pF
tZH
tHZ
OUTPUT HIGH
PARAMETER
OUTPUT
DI
SW
tHZ
Y/Z
1/0
GND
tLZ
Y/Z
0/1
VCC
tZH
Y/Z
1/0
GND
tZL
Y/Z
0/1
FIGURE 6A. TEST CIRCUIT
VOH - 0.25V
50%
OUT (Y, Z)
VOH
0V
tZL
tLZ
VCC
OUT (Y, Z)
50%
OUTPUT LOW
VCC
VOL + 0.25V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER ENABLE AND DISABLE TIMES
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Application Information
Driver Features
These transmitters are differential output devices that operate
with VCC as low as 1.8V, and up to 3.6V. Devices are RS-485
compliant with VCC ≥ 3V, but significant power savings are
obtained by operating at VCC = 1.8V.
The transmitter outputs are tri-statable via the active high DE
input. If the Tx enable function is not needed, tie DE to VCC
through a 1kΩ to 2kΩ resistor. Outputs are slew rate limited to
minimize EMI, and to reduce reflections in unterminated or
improperly terminated networks.
1.8V Operation
The ISL32613E and ISL32614E operate with VCC as low as 1.8V.
When coupled with the ISL32610E or ISL32611E 1.8V receivers,
they provide a differential communication link optimized for very
low power, and for slow data rates. Figures 9 and 10 illustrate the
static and dynamic power savings from using these transmitters
at low supply voltages. With VCC = 1.8V rather than 3.3V, using
the ISL32613E at 128kbps reduces the operating supply current
from 9.9mA to 56µA (a factor of 177).
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD or parasitic diodes to
VCC, so they withstand input voltages exceeding 5.5V, regardless
of the VCC voltage.
Hot Plug Function
When a piece of equipment powers up, there is a period of time
during which the processor or ASIC driving the RS-485 control
line (DE) is unable to ensure that the RS-485 Tx outputs are kept
disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, these transmitters incorporate a “Hot Plug”
function. During power-up, circuitry monitoring VCC ensures that the
Tx outputs remain disabled for a period of time, regardless of the
state of DE. This gives the processor/ASIC a chance to stabilize and
drive the control lines to the proper states.
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ESD Protection
All pins on these devices include class 3 (8kV) Human Body
Model (HBM) ESD protection structures, but the driver outputs
incorporate advanced structures that allow them to survive ESD
events in excess of ±16.5kV HBM and ±7kV to the IEC61000
contact test method. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect to an
exposed port on the exterior of the finished product. Simply
touching the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether it is powered up or not,
and without degrading the common mode range. This built-in
ESD protection eliminates the need for board-level protection
structures (e.g., transient suppression diodes) and the
associated, undesirable capacitive load they present.
Driver Overload Protection
The driver output stages incorporate short-circuit, current-limiting
circuitry, which ensures that the output current never exceeds the
RS-485 specification over a ±2V (-7V to +12V for VCC ≥ 2.7V)
common mode voltage range.
In the event of a major short-circuit condition, the device also
includes a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This eliminates
power dissipation, allowing the die to cool. The drivers
automatically reenable after the die temperature drops by about
+20°C. If the condition persists, the thermal shutdown/reenable
cycle repeats until the fault is cleared.
Low Power Shutdown Mode
This BiCMOS transmitter uses a fraction of the power required by
its bipolar counterparts, but it also includes a shutdown feature
that reduces the already low quiescent ICC to a 10nA trickle. This
device enters shutdown whenever the driver disables (DE = GND).
FN7906.2
July 27, 2015
ISL32613E, ISL32614E
Typical Performance Curves
VCC = 1.8V, TA = +25°C; unless otherwise specified.
22
60
18
50
-40°C
16
14
40
+125°C
12
ICC (µA)
DRIVER OUTPUT CURRENT (mA)
DE = VCC
-55°C
20
RD = 120Ω
10
8
10
4
+25°C
2
0
20
+85°C
6
30
0
0.2
RD = 1kΩ
0.4
0.6
0.8
1.0
1.2
1.4
DIFFERENTIAL OUTPUT VOLTAGE (V)
1.6
0
-40
1.8
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
10m
-15
FIGURE 8. STATIC SUPPLY CURRENT vs TEMPERATURE
10m
RD = ∞, CD = 50pF
RD = ∞, CD = 50pF
128kbps
128kbps
256kbps
1m
1m
100µ
56kbps
ICC (A)
ICC (A)
56kbps
100µ
9.6kbps
9.6kbps
10µ
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
10µ
1.8
3.6
2.0
2.2
2.4
VCC (V)
2.6
2.8
3.0
3.2
3.4
3.6
VCC (V)
FIGURE 9. ISL32613E DYNAMIC SUPPLY CURRENT vs SUPPLY
VOLTAGE AT DIFFERENT DATA RATES
FIGURE 10. ISL32614E DYNAMIC SUPPLY CURRENT vs SUPPLY
VOLTAGE AT DIFFERENT DATA RATES
110
-55°C
100
OUTPUT CURRENT (mA)
90
-40°C
80
70
60
+25°C
50
40
30
+125°C
20
10
0
-10
Y OR Z = LOW
+125°C
-55°C
-20
Y OR Z = HIGH
-30
-2.0
-1.5
-1.0
-0.5
0
0.5
OUTPUT VOLTAGE (V)
1.0
1.5
2.0
FIGURE 11. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE
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DI
1.5
1.5
1
1
0.5
Y-Z
0
-0.5
-1
-1.5
-0.5
-1
0
DRIVER INPUT (V)
2
DI
1.5
1.5
1
1
0.5
Y-Z
0
-0.5
-1
-1.5
TIME (400ns/DIV)
FIGURE 14. ISL32614E DRIVER WAVEFORMS, LOW-TO-HIGH
TIME (1µs/DIV)
RD = 10kΩ, CD = 50pF
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DI
Y-Z
0
FIGURE 13. ISL32614E DRIVER WAVEFORMS, HIGH-TO-LOW
FIGURE 12. ISL32613E DRIVER WAVEFORMS, LOW-TO-HIGH
RD = 10kΩ, CD = 50pF
0
0.5
-1.5
TIME (1µs/DIV)
2
DRIVER INPUT (V)
0
RD = 10kΩ, CD = 50pF
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DI
2
2
0
DRIVER INPUT (V)
RD = 10kΩ, CD = 50pF
VCC = 1.8V, TA = +25°C; unless otherwise specified. (Continued)
DRIVER INPUT (V)
Typical Performance Curves
0.5
Y-Z
0
-0.5
-1
-1.5
TIME (400ns/DIV)
FIGURE 15. ISL32614E DRIVER WAVEFORMS, HIGH-TO-LOW
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Si Gate BiCMOS
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ISL32613E, ISL32614E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to
make sure you have the latest revision.
DATE
REVISION
CHANGE
July 27, 2015
FN7906.2
Ordering Information Table on page 2: Removed part numbers ISL32614EMHZ-T and ISL32614EMHZ-T7A.
Recommended Operating Conditions table on page 4: Removed the line referencing “M Suffix”.
Replaced “Product” section with “About Intersil” on page 10.
May 2, 2012
FN7906.1
Page 1, “Features” - changed “Specified for +125°C Operation” to “Specified for +125°C or Full Mil
Temperature Operation”. Also changed Figure 1 title.
Page 2, added new part “ISL32614EMHZ-T” to the “Ordering Information”.
Page 4, changed “Y, Z (VCC = 1.8V)” to “Y, Z (VCC = 1.8V, Output Enabled)” and added “Y, Z (VCC = 1.8V, Output
Disabled)... -8V to +8V” under the “Absolute Maximum Rating”. Also added “(F Suffix)” and “(M Suffix)...-55°C to
+125°C” under the “Recommended Operating Conditions”.
Page 8, replaced Figure 7 and added -55°C curve to Figure 11 under the “Typical Performance Curves”.
August 30, 2011
FN7906.0
Initial Release
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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ISL32613E, ISL32614E
Package Outline Drawing
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 4, 2/10
0-8°
1.90
0.95
0.08-0.22
D
A
6
5
4
2.80
PIN 1
INDEX AREA
1.60 +0.15/-0.10
3
3
(0.60)
1
2
3
0.20 C
2x
0.40 ±0.10
B
SEE DETAIL X
3
0.20 M C A-B D
END VIEW
TOP VIEW
10° TYP
(2 PLCS)
2.90 ±0.10
3
1.15 +0.15/-0.25
C
0.10 C
SEATING PLANE
0.00-0.15
SIDE VIEW
(0.25)
GAUGE
PLANE
1.45 MAX
DETAIL "X"
0.45±0.1
4
(0.95)
(0.60)
(1.20)
(2.40)
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to gauge plane.
5.
Package conforms to JEDEC MO-178AB.
TYPICAL RECOMMENDED LAND PATTERN
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