MA-COM MASW-004240

MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Features
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Operating Freq. 10 ± 2GHz or 24 ± 2GHz
Surface Mount Device
Integrated Bias Network
No Wire Bonds Required
Low Current Consumption
+12 mA for On State/0V for Off Condition
Rugged, Glass Encapsulated Construction
Fully Monolithic
Polymer Scratch Protection
RoHS Compliant
Description
The MASW-004240-13170W is a surface mount
SP4T switch chip with integrated bias network. It
utilizes M/A-COM technology Solutions HMICTM
(Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310, which allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in
low loss, low dispersion glass. By using small
spacing between elements, this combination of
silicon and glass gives HMIC devices low loss and
high isolation performance with exceptional
repeatability through low millimeter frequencies.
Patterned gold backside metal allows for manual
or re-flow soldering without the need for wire bond
connections to the RF and bias ports. The chip
may be soldered using 80Au/20Sn, RoHS
compliant solders or electrically conductive silver
epoxy. The RF bond pads are labeled J1-J5 and
are 375x375µM (15x15mils) square. The DC bias
bond pads are labeled B2-B5 and are also
375x375µM (15x15mils) square.
Yellow areas denote backside soldering points
for bias and RF connections.
Parameter
Absolute Maximum
Operating Temperature
-65oC to +125oC
Storage Temperature
-65oC to +150oC
Junction Temperature
+175oC
Applied Forward Current
+40mA
RF Incident Power
Mounting Temperature
+30dBm C.W.
o
+280 C for 10 Seconds
Applications
The MASW-004240-13170W has been designed for
24GHz automotive radar sensor applications and is
also ideally suited for use at 10GHz. The switch is
turned on by applying a forward current of +12mA
at 4V to the appropriate bias port and is turned off at
0V. The RF bias network has been incorporated into
the design for ease of use and space
considerations.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
MASW-004240-13170W (SP4T)
Electrical Specifications @ TAMB = +25oC
Parameter
Insertion
Loss
Isolation
Input Return
Loss
Frequency
10GHz
&
24GHz
10GHz
&
24GHz
10GHz
&
24GHz
Port 1
Port 2
Stimulus
J1
J2
J1
Minimum
Typical
Maximum
12mA @ B2
2.5
3.5dB
J3
12mA @ B3
2.5
3.5dB
J1
J4
12mA @ B4
2.5
3.5dB
J1
J5
12mA @ B5
2.5
3.5dB
J1
J2
12mA @ B2
40dB
50
J1
J3
12mA @ B3
40dB
50
J1
J4
12mA @ B4
40dB
50
J1
J5
12mA @ B5
40dB
50
J1
J2
12mA @ B2
14
J1
J3
12mA @ B3
14
J1
J4
12mA @ B4
14
J1
J5
12mA @ B5
14
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
TYPICAL ISOLATION
TYPICAL INSERTION LOSS
0.0
0
-0.5
-10
-1.5
Isolation (dB)
Insertion Loss (dB)
-1.0
-2.0
-2.5
-3.0
-3.5
-4.0
-20
-30
-40
-50
-4.5
-60
-5.0
0
5
10
15
20
25
0
30
5
15
20
25
30
Frequency (Ghz)
Frequency (GHz)
TYPICAL OUTPUT RETURN LOSS
TYPICAL INPUT RETURN LOSS
0
0
-2
-2
Output Return Loss (dB)
Input Return Loss (dB)
10
-4
-6
-8
-10
-12
-14
-16
-4
-6
-8
-10
-12
-14
-16
-18
-18
-20
-20
0
5
10
15
20
Frequency (GHz)
25
30
0
5
10
15
20
25
30
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
MASW-004240-13170W Schematic
Operation of the MASW-004240-13170W
Operation of the MASW-00420-13170W PIN diode switch is achieved by simultaneously applying a current of
+12mA DC to the bias port of the on arm and 0V to the remaining isolated off arms.
Driver Connections
Control Level ( DC Current ) at Port
Condition of RF Output
B2
B3
B4
B5
J1-J2
J1-J3
J1-J4
J1-J5
-12mA
0V
0V
0V
Low Loss
Isolation
Isolation
Isolation
0V
-12mA
0V
0V
Isolation
Low Loss
Isolation
Isolation
0V
0V
-12mA
0V
Isolation
Isolation
Low Loss
Isolation
0V
0V
0V
-12mA
Isolation
Isolation
Isolation
Low Loss
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Chip Dimensions and Pad Locations1,2,3
Dim
A
B
C
D
E
F
G
H
Dim
J1
J2
J3
J4
J5
B2
B3
B4
B5
R.F. & DC ground
Chip Dimensions
Mils
Millimeters
Min.
Max
Min.
Max
132.0
134.0
3.350
3.400
128.5
129.0
3.270
3.280
4.0
6.0
0.102
0.152
67.0
71.0
0.170
0.180
14.5
15.0
0.370
0.380
43.3
43.7
1.100
1.110
28.3
28.7
0.720
0.730
9.5
10.0
0.245
0.255
Bond Pad Centers
Mils
Millimeters
X
Y
X
Y
0
-57
0
-1.450
-57
-57
1.450
-1.450
57
57
1.450
1.450
-57
57
-1.450
1.450
-57
-57
-1.450
-0.145
-57
15
1.450
0.380
12
57
0.313
1.450
-12
57
-0.313
1.450
-57
15
-1.450
0.380
Notes:
1.
2.
3.
Backside metallization thickness is.01µM.
Hatched areas indicate backside ohmic gold contacts
Bond pad centers are referenced from chip center.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Die Attachment and Handling Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of
60Pb/40Sn, 80Au/20Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance
and optimum heat sink. .
When soldering these devices a hot gas or oven re-flow process is preferred. We recommend utilizing a vacuum
tip and applying a downward force of 40 - 60 grams to the top surface of the device. When soldering, position the
die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. All mounting pads should be heated simultaneously so that the solder under the pads flows at the same time.
Avoid soldering the pads one at a time as doing so would produce an un-equal heat flow and potentially create
thermal stress to the chip.
Solder reflow should not be performed by causing the heat to flow through the top surface of the die. Die should
be uniformly heated in a re-flow oven. A typical heating profile and handling instructions are provided in
Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the
MA-COM website at www.macomtech.com
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is <1W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule. Typically 150°C for 1 hour.
Ordering Information
Part Number
Package
MASW-004240-13170W
Waffle Pack
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.