485AE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485AE
ISSUE B
1
SCALE 2:1
DATE 21 JUL 2014
ÇÇ
ÇÇ
ÇÇ
PIN 1
LOCATION
D
A
B
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉÉ
ÉÉ
ÉÉÉ ÉÉ
ÇÇ
0.15 C
EXPOSED Cu
0.15 C
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. OUTLINE MEETS JEDEC DIMENSIONS PER
MO−220, VARIATION VEED−6.
L
MOLD CMPD
A1
DETAIL B
(A3)
DETAIL B
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A3
ALTERNATE
CONSTRUCTIONS
A
0.08 C
A1
SIDE VIEW
NOTE 4
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
D2
16X
L
DETAIL A
5
XXXXX
XXXXX
ALYWG
G
8
9
4
16X
E2
K
1
b
0.10 C A B
A
L
Y
W
G
12
16
RECOMMENDED
SOLDERING FOOTPRINT*
13
16X
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.25
1.55
3.00 BSC
1.25
1.55
0.50 BSC
0.20
−−−
0.30
0.50
0.00
0.15
e
e/2
NOTE 3
BOTTOM VIEW
3.30
(Note: Microdot may be in either location)
16X
0.65
PACKAGE
OUTLINE
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
3.30
16X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON14949D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
1
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN16 3X3, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON14949D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION, REQ. BY D. TRUHITTE
13 MAY 2004
A
ADDED TERMINAL OPTIONS DETAILS A AND B. REQ. BY A. CARMONA.
30 JUN 2008
B
ADDED RECOMMENDED SOLDERING FOOTPRINT. REQ. BY B. MARQUIS.
21 JUL 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. B
Case Outline Number:
485AE