522AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN10, 3x3, 0.5P
CASE 522AA-01
ISSUE A
DATE 02 JUL 2007
SCALE 2:1
D
PIN ONE
REFERENCE
0.15 C
2X
ÍÍÍ
ÍÍÍ
ÍÍÍ
0.15 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
A3
0.10 C
A
0.08 C
10X
A1
SIDE VIEW
C
L
5
K
10
6
b
10X
0.10 C A
BOTTOM VIEW
1.75
0.35
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
E2
10X
2.45
XXXXX
XXXXX
ALYWG
G
e
1
0.18
MILLIMETERS
NOM
MAX
0.75
0.80
0.03
0.05
0.20 REF
0.24
0.30
3.00 BSC
2.50
2.55
3.00 BSC
1.80
1.85
0.50 BSC
0.19 TYP
0.40
0.45
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
D2
10X
MIN
0.70
0.00
0.05 C
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G”,
may or may not be present.
B
NOTE 3
SOLDERING FOOTPRINT*
2.6016
1.8508 3.3048
2.1746
10X
0.5651
10X
0.5000 PITCH
0.3008
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON22331D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 - Rev. 0
WDFN10 3X3, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON22331D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY C. GIOIA.
29 MAR 2006
A
ADDED DEVICE MARKING INFORMATION. REQ. BY W. CLEMENS.
02 JUL 2007
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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© Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 01A
Case Outline Number:
522AA
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