569AD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
LFLGA64 5x5 / FLGA64
CASE 569AD
ISSUE A
0.75
A
0.75
5.0±0.08
0.10 S A
BOTTOM VIEW
0.10 S B
TOP VIEW
DATE 17 JAN 2014
0.15
6
2
3 4
5
5.0±0.08
B
0.5
7 8
×4
1
LASER
MARKED
INDEX
b
a
60−∅0.3±0.03
0.03
H
G
F
E
D C
B
A
0.5
S AB
0.8±0.05
S
0.05 S
DETAIL_a
NSMD
Off set Via type
0.55±0.05
LAND
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
October, DESCRIPTION:
2002 − Rev. 0
R0.275
0.55±0.03
Aperture of
Solder Resist
98AON67021E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
LFLGA64 5X5 / FLGA64
1
© Semiconductor Components Industries, LLC, 2002
0.55±0.03
XXXXXX
YMDDD
0.55±0.03
0.55±0.05
GENERIC
MARKING DIAGRAM*
0.55±0.05
0.55±0.05
0.55±0.03
0.075 S
0.0 NOM
SIDE VIEW
DETAIL_b
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
3
LFLGA64 5x5 / FLGA64
CASE 569AD
ISSUE A
DATE 17 JAN 2014
SOLDERING FOOTPRINT*
0.55
5.00
3.90
3.50
0.525
P0.50
3.50
3.90
P0.50
R0.1375
R0.2625
∅0.275
(Unit: mm)
0.525
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON67021E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
LFLGA64 5X5 / FLGA64
2
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 2 OFXXX
3
DOCUMENT NUMBER:
98AON67021E
PAGE 3 OF 3
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−380 TO
ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
29 FEB 2012
A
ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D.
TRUHITTE.
17 JAN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. A
Case Outline Number:
569AD
Similar pages