Data Sheet

74AHC1G17-Q100;
74AHCT1G17-Q100
Single Schmitt trigger buffer
Rev. 1 — 8 March 2016
Product data sheet
1. General description
The 74AHC1G17-Q100 and 74AHCT1G17-Q100 are single buffers with Schmitt-trigger
inputs. Inputs are overvoltage tolerant. This feature allows the use of these devices as
translators in mixed voltage environments.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Symmetrical output impedance
 High noise immunity
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 Low power dissipation
 Balanced propagation delays
3. Applications
 Wave and pulse shapers
 Astable multivibrators
 Monostable multivibrators
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
4. Ordering information
Table 1.
Ordering information
Type number
Package
74AHC1G17GW-Q100
Temperature range Name
Description
Version
40 C to +125 C
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
74AHCT1G17GW-Q100
TSSOP5
5. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74AHC1G17GW-Q100
AJ
74AHCT1G17GW-Q100
CJ
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
$
<
PQE
Fig 1.
PQE
Logic symbol
Fig 2.
IEC logic symbol
$
<
PQE
Fig 3.
Logic diagram
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
7. Pinning information
7.1 Pinning
$+&*4
$+&7*4
QF
$
*1'
9&&
<
DDD
Fig 4.
Pin configuration SOT353-1
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
n.c.
1
not connected
A
2
data input
GND
3
ground (0 V)
Y
4
data output
VCC
5
supply voltage
8. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level
Input
Output
A
Y
L
L
H
H
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < 0.5 V
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
IGND
Tstg
storage temperature
Min
Max
Unit
0.5
+7.0
V
0.5
+7.0
20
-
mA
-
20
mA
-
25
mA
supply current
-
75
mA
ground current
75
-
mA
65
+150
C
-
250
mW
total power dissipation
Ptot
Conditions
[1]
Tamb = 40 C to +125 C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP5 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
V
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74AHC1G17-Q100
Min
Typ
74AHCT1G17-Q100
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
5.5
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
0
-
5.5
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
40
+25
+125
C
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
11. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
HIGH-level
VI = VT+ or VT
output voltage
IO = 50 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 50 A; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = 50 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = 8.0 mA; VCC = 4.5 V
3.94
-
-
3.8
-
3.70
-
V
LOW-level
VI = VT+ or VT
output voltage
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
74AHC1G17-Q100
VOH
VOL
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
A
input
capacitance
-
1.5
10
-
10
-
10
pF
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
II
input leakage
current
ICC
CI
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
74AHCT1G17-Q100
VOH
HIGH-level
VI = VT+ or VT; VCC = 4.5 V
output voltage
IO = 50 A
IO = 8.0 mA
VOL
LOW-level
VI = VT+ or VT; VCC = 4.5 V
output voltage
IO = 50 A
IO = 8.0 mA
0
0.1
-
0.1
-
0.1
V
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
A
ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
74AHC_AHCT1G17_Q100
Product data sheet
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
-
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
11.1 Transfer characteristics
Table 8.
Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8.
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 3.0 V
-
-
2.2
-
2.2
-
2.2
V
VCC = 4.5 V
-
-
3.15
-
3.15
-
3.15
V
VCC = 5.5 V
-
-
3.85
-
3.85
-
3.85
V
VCC = 3.0 V
0.9
-
-
0.9
-
0.9
-
V
VCC = 4.5 V
1.35
-
-
1.35
-
1.35
-
V
VCC = 5.5 V
1.65
-
-
1.65
-
1.65
-
V
VCC = 3.0 V
0.3
-
1.2
0.3
1.2
0.25
1.2
V
VCC = 4.5 V
0.4
-
1.4
0.4
1.4
0.35
1.4
V
VCC = 5.5 V
0.5
-
1.6
0.5
1.6
0.45
1.6
V
VCC = 4.5 V
-
-
2.0
-
2.0
-
2.0
V
VCC = 5.5 V
-
-
2.0
-
2.0
-
2.0
V
negative-going
threshold
voltage
VCC = 4.5 V
0.5
-
-
0.5
-
0.5
-
V
VCC = 5.5 V
0.6
-
-
0.6
-
0.6
-
V
hysteresis
voltage
VCC = 4.5 V
0.4
-
1.4
0.4
1.4
0.35
1.4
V
VCC = 5.5 V
0.4
-
1.6
0.4
1.6
0.35
1.6
V
74AHC1G17-Q100
VT+
VT
VH
positive-going
threshold
voltage
negative-going
threshold
voltage
hysteresis
voltage
74AHCT1G17-Q100
VT+
VT
VH
positive-going
threshold
voltage
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
12. Dynamic characteristics
Table 9.
Dynamic characteristics
GND = 0 V; tr = tf  3.0 ns. For waveform, see Figure 5. For test circuit, see Figure 6.
Symbol Parameter
25 C
Conditions
40 C to +85 C
40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
-
4.2
12.8
1.0
15.0
1.0
16.5
ns
-
6.0
16.3
1.0
18.5
1.0
20.5
ns
-
3.2
8.6
1.0
10.0
1.0
11.0
ns
-
4.6
10.6
1.0
12.0
1.0
13.5
ns
-
12
-
-
-
-
-
pF
-
4.1
7.0
1.0
8.0
1.0
9.0
ns
-
5.9
8.5
1.0
10.0
1.0
11.0
ns
-
13
-
-
-
-
-
pF
74AHC1G17-Q100
tpd
propagation
delay
[1]
A to Y;
VCC = 3.0 V to 3.6 V
[2]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
[3]
CL = 15 pF
CL = 50 pF
CPD
power
dissipation
capacitance
per buffer;
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[4]
74AHCT1G17-Q100
tpd
propagation
delay
A to Y;
VCC = 4.5 V to 5.5 V
[1][3]
CL = 15 pF
CL = 50 pF
CPD
power
dissipation
capacitance
[4]
per buffer;
VI = GND to VCC
[1]
tpd is the same as tPLH and tPHL.
[2]
Typical values are measured at VCC = 3.3 V.
[3]
Typical values are measured at VCC = 5.0 V.
[4]
CPD is used to determine the dynamic power dissipation PD (W).
PD = CPD  VCC2  fi + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
13. Waveforms
9,
$LQSXW
90
90
*1'
W3+/
W3/+
9&&
92+
<RXWSXW
92/
W7/+
9,
38/6(
*(1(5$725
92
'87
&/
57
W7+/
PQD
DDD
The test data is given in Table 10
Test data is given in Table 9.
Definitions for test circuit:
CL = Load capacitance.
RT = Termination resistance should be equal to output
impedance Zo of the pulse generator.
Fig 5.
Table 10.
The input (A) to output (Y) propagation delays
Fig 6.
Test circuit for measuring switching times
Test data
Type number
Input
Output
VI
VM
VM
74AHC1G17-Q100
GND to VCC
0.5  VCC
0.5  VCC
74AHCT1G17-Q100
GND to 3.0 V
1.5 V
0.5  VCC
13.1 Transfer characteristic waveforms
92
9,
97
9+
97
97
Fig 7.
97
Transfer characteristic
74AHC_AHCT1G17_Q100
Product data sheet
92
9,
9+
PQE
PQE
Fig 8.
The definitions of VT+, VT and VH
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
PQD
PQD
,&&
P$
,&&
P$
Fig 9.
9,9
Typical 74AHC1G17-Q100 transfer
characteristics; VCC = 3.0 V
9 9 ,
Fig 10. Typical 74AHC1G17-Q100 transfer
characteristics; VCC = 4.5 V
PQD
,&&
P$
9,9
Fig 11. Typical 74AHC1G17-Q100 transfer characteristics; VCC = 5.5 V
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
PQD
PQD
,&&
P$
,&&
P$
9 9 ,
9,9
Fig 13. Typical 74AHCT1G17-Q100 transfer
characteristics; VCC = 5.5 V
Fig 12. Typical 74AHCT1G17-Q100 transfer
characteristics; VCC = 4.5 V
14. Application information
The slow input rise and fall times cause additional power dissipation, which can be
calculated using the following formula:
Padd = fi  (tr  ICC(AV) + tf  ICC(AV))  VCC where:
Padd = additional power dissipation (W);
fi = input frequency (MHz);
tr = input rise time (ns); 10 % to 90 %;
tf = input fall time (ns); 90 % to 10 %;
ICC(AV) = average additional supply current (A).
Average additional ICC differs with positive or negative input transitions, as shown in
Figure 14 and Figure 15.
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
PQD
PQD
ǻ,&&$9
—$
ǻ,&&$9
—$
SRVLWLYHJRLQJ
HGJH
SRVLWLYHJRLQJ
HGJH
QHJDWLYHJRLQJ
HGJH
9&&9
Fig 14. Average additional ICC for 74AHC1G17-Q100
Schmitt trigger devices; linear change of VI
between 0.1VCC to 0.9VCC
74AHC_AHCT1G17_Q100
Product data sheet
QHJDWLYHJRLQJ
HGJH
9&&9
Fig 15. Average additional ICC for 74AHCT1G17-Q100
Schmitt trigger devices; linear change of VI
between 0.1VCC to 0.9VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 16
74AHC1G17-Q100; 74AHCT1G17-Q100
NXP Semiconductors
Single Schmitt trigger buffer
15. Package outline
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
(
'
627
$
;
F
\
+(
Y 0 $
=
$
$
$
$
ș
/S
H
/
Z 0
ES
GHWDLO;
H
PP
VFDOH
',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV
81,7
$
PD[
$
$
$
ES
F
'
(
H
H
+(
PP
/
/S
Y
Z
\
=
ș
ƒ
ƒ
1RWH
3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG
287/,1(
9(56,21
627
5()(5(1&(6
,(&
-('(&
-(,7$
02
6&$
(8523($1
352-(&7,21
,668('$7(
Fig 16. Package outline SOT353-1 (TSSOP5)
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
16. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
MIL
Military
17. Revision history
Table 12.
Revision history
Document ID
Release date
74AHC_AHCT1G17_Q100 v.1 20160308
74AHC_AHCT1G17_Q100
Product data sheet
Data sheet status
Change notice Supersedes
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
-
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC_AHCT1G17_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC_AHCT1G17_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 16
NXP Semiconductors
74AHC1G17-Q100; 74AHCT1G17-Q100
Single Schmitt trigger buffer
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
12
13
13.1
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Transfer characteristics . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Transfer characteristic waveforms . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 March 2016
Document identifier: 74AHC_AHCT1G17_Q100