ABBTM-NVC-MDCS71

Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
FEATURES:
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
Moisture Sensitivity Level (MSL) – Level 3
| | | | | | | | | | | | | | |
APPLICATIONS:
• Single mode Bluetooth v4.1 low energy
• Sports and fitness
• 4 dBm TX power/ -92.5dBm RX sensitivity, RSSI monitoring for proximity applications • Healthcare
• Supports master and slave
• Home entertainment
• Support GATT-based Profile: Proximity, Find Me, Heart Rate, HID and etc.
• Office and mobile accessories
• UART/I2C master/SPI master interfaces
• Automotive
• 9 digital PIOs/3 analog IOs
• Commercial
• 10bit ADC IOs
• Watches
• Wakeup interrupt and watchdog timer
• Human interface devices
• SMT pads for easy and reliable PCB mounting, Internal chip antenna
• 19.50x12.50x2.4mm
• FCC ID: OC3BM1871*
• QDID: B020997*
*Note: ABBTM-NVC-MDCS71 crosses to NovaComm P/N: NVC-MDCS71. BQB/FCC certification documentation is under
P/N: NVC-MDCS71.
GENERAL DESCRIPTION
ABBTM-NVC-MDCS71 is a single-mode Bluetooth 4.1 low power module, based on NovaComm’s proprietary technology. Using the CSR’s
uEnergy platform, it enables ultralow power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. It contains everything required to create a Bluetooth low energy product with
RF, baseband, MCU, qualified Bluetooth V4.1 stack and customized firmware on a single module.
The module can be power directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes
only 600nA and will wake up in few hundred microseconds.
PIN CONFIGURATION:
Figure 1. Pinout (Topview)
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PIN DESCRIPTION
Pin
Symbol
1
2
3
4
GND
AIO2
AIO1
AIO0
5
UART_TX
6
UART_RX
7
PIO3
8
PIO4
9
GND
10
PIO5/SPI_CLK
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_CLK select by SPI_PIO_SEL
11
PIO6/SPI_CSB
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug chip select, selected by SPI_PIO_SEL
12
PIO7/SPI_MOSI
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_MOSI, selected by SPI_PIO_SEL
13
VDD_PIO
Powered
PIO power supply
Bi-directional with programmable
strength internal pull-up/down
Bi-directional tri-state with weak internal
pull-up
Programmable input/output line
Or debug SPI_MISO, selected by SPI_PIO_SEL
I2C data input/output or SPI serial flash data
output(SF_OUT)
I2C clock or SPI serial flash clock output
(SF_CLK)
Ground
Programmable input/output line
PWM or LED Controls
Programmable input/output line
PWM or LED Controls
14
PIO8/SPI_MISO
15
I2C_SDA
16
I2C_SCL
17
GND
18
PIO9
19
PIO10
20
PIO11
21
22
23
SPI_PIO_SEL
VDD_BAT
GND
24
WAKE
25
GND
ABRACON IS
ISO 9001:2008
CERTIFIED
I/O Type
Description
Ground
Bidirectional analogue
Bidirectional analogue
Bidirectional analogue
CMOS output, tri-state, with weak
internal pull-up
CMOS input with weak internal pulldown
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Ground
Ground
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
UART data output
UART data input
Programmable input/output line
PWM or LED Controls
Programmable input/output line
PWM or LED Controls
Ground
Input with weak internal pull-up
Ground
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Input with strong internal pull-down
Power supply
Ground
Input has no internal pull-up or pull-down
use external pull-down
Ground
LLC
Programmable input/output line
Selects SPI debug on (8:5)
Button cell battery or DC 1.8V to 3.6V
Ground
Set high to wake the module from hibernate. Use
an external pull-down for this pin.
Ground
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
ELECTRICAL CHARACTERISTICS
Absolute Maximum Rating
Rating
Min
Max
Unit
Storage Temperature
-40
+85
°C
Battery (VDD_BAT) operation*
1.8
3.6
V
I/O supply voltage
-0.4
+3.6
V
Vss-0.4
VDD+0.4
V
Other Terminal Voltages except RF
* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and
other specifications are not guaranteed in excess of 4.2V.
Recommended Operating Conditions
Operating Condition
Operating Temperature Range
Min
-30
Battery (VDD_BAT) operation
I/O Supply Voltage (VDD_PIO)
Typ
Max
+85
Unit
°C
1.8
+3.6
V
1.2
+3.6
V
Power Consumptions
The current consumption are measured at the VDD_BAT.
Mode
Description
Total typical current at
3V (average)
Fast Advertising
All functions are shutdown. To wake up toggle
the WAKE pin
All functions are shutdown except for the sleep
clock. The module can wake up on a timer on the
sleep clock.
In 30 second after Power on VDD=3.3V
Slow Advertising
In 3 minutes after fast advertising VDD=3.3V
6uA
Standby (no connect)
VDD=3.3V ,VDD_PIO=3.3v
5uA
Standby (connect)
VDD=3.3V ,VDD_PIO=3.3v
8uA
Transmit data
VDD=3.3V VDD_PIO=3.3V
1mA
RF RX /TX active (0dBm) *
VDD=3.3V VDD_PIO=3.3V
~16mA peak
Dormant
Hibernate
<600nA
<1.5uA
0.8mA
* Note: The TX power of the module can be increased by firmware to a maximum of 4dBm and the peak current is around
28mA.
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
I/O CHARACTERISTICS
Digital I/O Characteristics
Supply Voltage Levels
Min
Typ
Max
Unit
Input Voltage Levels
VIL input logic level low
-0.4
0.4
V
VIH input logic level high
0.7*VDD
VDD + 0.4
V
25
ns
0.4
V
Tr/Tf
Output Voltage Levels
VOL output logic level low, IOL = 4.0mA
VOH output logic level high, IOH = -4.0mA
0.75*VDD
V
Tr/Tf
5
ns
Input and Tri-state Current
With strong pull-up
-150
-40
-10
μA
With strong pull-down
10
40
150
μA
With weak pull-up
-5.0
-1.0
-0.33
μA
With weak pull-down
0.33
+1.0
5.0
μA
CI Input Capacitance
1.0
5.0
pF
Max
1.3
Unit
V
AIO Characteristics
Input Voltage Levels
AIO
Min
0
Typ
ESD Protection
Condition
Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114
Class
2
Max Rating
2000V (all pins)
Machine Model Contact Discharge per JEDEC EIA/JESD22-A115
200V
200V (all pins)
III
500V (all pins)
Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
Power Supply
The module integrates internal regulators. It can be easily powered up by connecting a 3V coin battery with a >100uF
capacitor at pin VDD_BAT.
Internal Antenna
Figure 2. Capacitor at pin VDD_BAT
The module integrates an on-board chip antenna. There’s no need to use external antenna on customer’s PCB. Please
take precaution to leave ample clearance for the antenna (See Figure 6).
PIO
9 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO.
PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down.
Note: At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt
request lines or as wake-up lines from sleep modes.
AIO
3 AIOs are provided. They can be connected to internal 10 bits ADC. Depending on the software, they can be used
to read or output a voltage between 0V to 1.3V. Each of them can be also used as a digital output with special firmware.
PWM
PIO3, PIO4, PIO9, PIO10 can be driven by internal PWM module. The PWM module also works while the module
is sleep. Therefore it can be used as a LED flasher. These functions are controlled by special firmwares.
UART
This module has a standard. UART interface which provides a simple mechanism for communicating with other serial
devices using the RS232 protocol.
The UART CTS and RTS signals can be assigned to any PIO pin by the on-chip firmware.
Possible UART Settings
Parameter
Baud Rate
Possible Values
Minimum
Maximum
Flow Control
Parity
Number of Stop Bits
Bits per Byte
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
1200 baud (≤2%Error)
9600 baud (≤1%Error)
2M baud (≤1%Error)
RTS/CTS or None
None, Odd or Even
1 or 2
8
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS/RoHS II compliant
RoHS
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
I2C Master
The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and
I2C_SDA.
SPI Master
The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as
SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz.
SPI Debug
The SPI Debug interface is chosen when SPI_PIO_SEL is high. The interface is used to program and debug the module.
So always place test points or header on PCB for this interface and SPI_PIO_SEL.
SOFTWARE STACK
ABBTM-NVC-MDCS71 is a single mode Bluetooth 4.1 module. It can support all GATT-based profiles. Several profiles
have been developed such as Healthy Thermometer Profile. Please contact Abracon for the support of more profiles and
applications with iNovaLE stack.
iNovaLE Stack
Figure 3. iNovaLE Stack
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS/RoHS II compliant
RoHS
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
REFERENCE DESIGN
.
Figure 4. Reference Design
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
LAYOUT AND SOLDERING
Soldering Recommendations
.
ABBTM-NVC-MDCS71 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile
used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular
type of solder paste used. Please refer to the datasheet of the particular solder paste for profile configurations.
The following are recommended for soldering the module to ensure reliable solder joint and operation of the module
after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by
case. Thus following recommendation should be taken as reference only.
•
Refer to technical documentations of particular solder paste for profile configurations
•
Avoid using more than one flow.
•
Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of
150µm stencil thickness is recommended.
•
Aperture size of the stencil should be 1:1 with the pad size.
•
A low residue, “no clean” solder paste should be used due to low mounted height of the component.
REFLOW PROFILE
Figure 5. Typical Lead-Free Reflow Solder Profile for ABBTM-NVC-MDCS71
Key features of the profile:
ABRACON IS
ISO 9001:2008
CERTIFIED
•
Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium
•
Equilibrium time = 60 to 180 seconds
•
Ramp to Maximum temperature (250°C) = 3°C/sec max.
•
Time above liquidus temperature (217°C): 45-90 seconds
•
Device absolute maximum reflow temperature: 255°C
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS/RoHS II compliant
RoHS
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
Layout Guideline
.
It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any
metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated
maximum 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an
unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around
the antenna of ABBTM-NVC-MDCS71 when the module is placed at the edge of a PCB.
Do not place copper on the top layer under the module, as shown in Figure 6. The module has vias on the area shown,
which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from
the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module.
Figure 6. Placement of the Module on a Main Board
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABBTM-NVC-MDCS71
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
OUTLINE DIMENSIONS
Recommended Land Pattern
Pin 1
.
Pin 1
Pin 25
Pin 25
Dimensions: mm
TAPE & REEL:
80pcs/tray
Dimensions: mm
ATTENTION: Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applications. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where
component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and
authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Similar pages