ACTS245T Data Sheet July 1999 Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver Intersil’s Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD Total Dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil ACTS245T is a Radiation Hardened Octal NonInverting Bidirectional Bus Transceiver intended for two-way asynchronous communication between data busses. File Number 4611.1 Features • QML Class T, Per MIL-PRF-38535 • Radiation Performance - Gamma Dose (γ) 1 x 105 RAD(Si) - Latch-Up Free Under Any Conditions - Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) - SEU LET Threshold . . . . . . . . . . . . .>100 MEV-cm2/mg • 1.25 Micron Radiation Hardened SOS CMOS • Significant Power Reduction Compared to ALSTTL Logic Specifications • DC Operating Voltage Range . . . . . . . . . . . . 4.5V to 5.5V Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. • Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min Detailed Electrical Specifications for the ACTS245T are contained in SMD 5962-96719. A “hot-link” is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp • Fast Propagation Delay . . . . . . . . 18ns (Max), 12ns (Typ) Pinouts ACTS245T (SBDIP), CDIP2-T20 TOP VIEW Intersil’s Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp DIR 1 A0 2 19 OE A1 3 18 B0 A2 4 17 B1 A3 5 16 B2 TEMP. RANGE (oC) A4 6 15 B3 A5 7 14 B4 A6 8 13 B5 -55 to 125 A7 9 12 B6 GND 10 11 B7 Ordering Information ORDERING NUMBER 5962R9671901TRC 5962R9671901TXC PART NUMBER ACTS245DTR ACTS245KTR -55 to 125 NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct. ACTS245T (FLATPACK), CDFP4-F20 TOP VIEW DIR 1 20 VCC A0 2 19 OE A1 3 18 B0 A2 4 17 B1 A3 5 16 B2 A4 6 15 B3 A5 7 14 B4 A6 8 13 B5 A7 9 12 B6 10 11 B7 GND 1 20 VCC CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 ACTS245T Functional Diagram NOTE: (1 of 8) P N A B P N OE DIR TRUTH TABLE INPUTS OE DIR OPERATION L L B Data to A Bus L H A Data to B Bus H X Isolation NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial. 2 ACTS245T Die Characteristics DIE DIMENSIONS: BACKSIDE FINISH: (2440µm x 2970µm x 533µm ±51µm) Sapphire 96 x 117 x 21mils ±2mil PASSIVATION: METALLIZATION: Type: Silox (SiO2) Thickness: 8.0kÅ ±1.0kÅ Type: Al Si Cu Thickness: 10.0kÅ ±2kÅ WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 SUBSTRATE POTENTIAL: Unbiased (Silicon on Sapphire) TRANSISTOR COUNT: Bond Pad #20 (VCC) First 420 Bond Pad #20 (VCC) Uses Two Bond Wires PROCESS: Bond Pad #10 (GND) Uses Two Bond Wires CMOS SOS Metallization Mask Layout ACTS245T DIR (1) A0 (2) VCC (20) VCC (20) OE (19) A1 (3) (18) B0 A2 (4) (17) B1 A3 (5) (16) B2 A4 (6) (15) B3 A5 (7) (14) B4 A6 (8) (13) B5 (9) A7 (10) GND (10) GND (11) B7 (12) B6 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 3