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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
1 of 34
DATE
15.12.2014
Product Specification
Applicant / Manufacturer
Panasonic Industrial Devices Europe GmbH
Hardware
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Dialog Semiconductors
Software
By purchase of any of products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations.
Panasonic reserves the right to make changes as required without notification.
Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
CHECKED
DESIGNED
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
2 of 34
DATE
15.12.2014
TABLE OF CONTENTS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Key Features ................................................................................................................. 4
Bluetooth Low Energy ................................................................................................... 4
Description for the Module............................................................................................. 4
Block Diagram ............................................................................................................... 5
4.1 PAN1740.............................................................................................................. 5
4.2 Bluetooth IC ......................................................................................................... 5
System Overview .......................................................................................................... 6
5.1 ARM Cortex M0 CPU ........................................................................................... 6
5.2 Bluetooth Smart ................................................................................................... 6
5.2.1 BLE Core ................................................................................................ 6
5.2.2 Smart Snippets ....................................................................................... 7
5.2.3 Memory ................................................................................................... 7
5.2.4 Functional Modes .................................................................................... 8
5.2.5 Power Modes .......................................................................................... 8
Terminal Layout ............................................................................................................ 9
Terminal Description ..................................................................................................... 9
Interfaces .................................................................................................................... 10
8.1 UART ................................................................................................................. 10
8.2 SPI+ ................................................................................................................... 11
8.3 I2C ...................................................................................................................... 11
8.4 General Purpose (GP) ADC ............................................................................... 12
8.5 Quadrature Decoders ......................................................................................... 12
8.6 Keyboard Controller ........................................................................................... 13
8.7 Input/Output Ports .............................................................................................. 13
8.8 Timers ................................................................................................................ 13
8.9 Reset ................................................................................................................. 13
Specifications .............................................................................................................. 14
Soldering Temperature-Time Profile (for reflow soldering)........................................... 17
Module Dimension....................................................................................................... 18
FootPrint of the Module ............................................................................................... 19
Case Marking .............................................................................................................. 20
Marking ....................................................................................................................... 20
Marking Definition ....................................................................................................... 20
Mechanical Requirements ........................................................................................... 20
Reliability Tests ........................................................................................................... 21
Cautions ...................................................................................................................... 21
Design Notes............................................................................................................... 21
Installation Notes ......................................................................................................... 22
Usage Conditions Notes .............................................................................................. 22
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
No.
DS-1740-2400-102
REV.
1.1
PAGE
3 of 34
DATE
15.12.2014
Storage Notes ............................................................................................................. 23
Safety Cautions ........................................................................................................... 23
Other cautions ............................................................................................................. 23
Packaging ................................................................................................................... 25
Label for Package ....................................................................................................... 26
Total Package ............................................................................................................. 26
Ordering Information ................................................................................................... 27
RoHS and REACH Declaration ................................................................................... 27
Data Sheet Status ....................................................................................................... 28
History for this Document ............................................................................................ 28
Related Documents ..................................................................................................... 28
General Information..................................................................................................... 29
Regulatory Information ................................................................................................ 29
FCC Notice ................................................................................................................. 29
Caution........................................................................................................................ 29
Labeling Requirements ............................................................................................... 30
Antenna Warning ........................................................................................................ 30
Approved Antenna List ................................................................................................ 30
RF Exposure ............................................................................................................... 30
Industry Canada Certification ...................................................................................... 31
IC Notice ..................................................................................................................... 31
Labeling Requirements ............................................................................................... 32
European R&TTE Declaration of Conformity ............................................................... 33
Bluetooth ..................................................................................................................... 34
Life Support Policy ...................................................................................................... 34
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
1
No.
DS-1740-2400-102
REV.
1.1
PAGE
4 of 34
DATE
15.12.2014
KEY FEATURES
- Pre-programmed BT/MAC Address
- Includes 16MHz and 32.768kHz crystal Crystal calibrated up to 1ppm
- Single-mode Bluetooth Smart System-on-Chip
- Programmable ARM CORTEX M0 CPU
- Autonomous BTLE Stand Alone Operation
- Bluetooth v4.1 (LE) embedded GATT profile – Low Energy Single Mode
- Small 9.0 x 9.5 x 1.8 mm SMD package with antenna
- Temperature Range from -40°C to +85°C
- Peak Power consumption 4.9mA Rx and Tx
- Less than a few µA in low power modes
- Link budget 93dBm (Rx Sensitivity -93, Tx 0 dBm)
- Integrated shielding to resist EMI
- No external components needed
2
BLUETOOTH LOW ENERGY
Bluetooth Low Energy (BLE), also called Bluetooth Smart, is a part of Bluetooth Ver. 4.0, BT v4.0
covers both BLE as well as Classic Bluetooth v2.1 and v3.0.
Bluetooth Low Energy (BLE) is not backwards compatible with previous Classic Bluetooth
standards (v2.1+EDR or v3.0). Dual mode Bluetooth v4.0 is targeted to gateway products and
backwards compatible, but is not practical for low power devices.
Bluetooth® 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted
Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits.
Bluetooth 4.1 improves usability for consumers, empowers innovation for product developers and
extends the technology’s foundation as an essential link for the Internet of Things.
For more more details please see the BLUETOOTH® 4.1 QUICK REFERENCE GUIDE from
Bluetooth SIG [1]
3
DESCRIPTION FOR THE MODULE
The PAN1740 is a short-range BLE single mode module for implementing Bluetooth functionality
into various electronic devices.
PAN1740 is fully compliant with the Bluetooth V4.1 standard.
It includes dedicated hardware for the Link Layer implementation of Bluetooth®Smart and
interface controllers for enhanced connectivity capabilities.
Please contact your local sales office for further details on additional options and services:
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
5 of 34
DATE
15.12.2014
www.panasonic.com/rfmodules for the US, http://pideu.panasonic.de/products/wirelessmodules.html for EU or write an e-mail to [email protected]
4
BLOCK DIAGRAM
4.1 PAN1740
Crystal
32.768kHz
DC/DC
Vsupply
Full Port Multiplexer
Dialog
UART SPI I2C
GP-ADC
Quad-Decoder
Wakup-Timer
Crystal
16 MHz
PAN1740
4.2 BLUETOOTH IC
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
5
No.
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REV.
1.1
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DATE
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SYSTEM OVERVIEW
The PAN1740 contains the following internal blocks:
5.1 ARM CORTEX M0 CPU
The Cortex-M0 processor is a 32-bit Reduced Instruction Set Computing (RISC) processor
with a von Neumann architecture (single bus interface). It uses an instruction set called
Thumb, which was first supported in the ARM7TDMI processor; however, several newer
instructions from the ARMv6 architecture and a few instructions from the Thumb-2 technology
are also included. Thumb-2 technology extended the previous Thumb instruction set to allow
all operations to be carried out in one CPU state. The instruction set in Thumb-2 includes both
16-bit and 32-bit instructions; most instructions generated by the C compiler use the 16-bit
instructions, and the 32-bit instructions are used when the 16-bit version cannot carry out the
required operations. This results in high code density and avoids the overhead of switching
between two instruction sets.
In total, the Cortex-M0 processor supports 56 base instructions, although some instructions
can have more than one form. While the instruction set is small, the Cortex-M0 processor is
highly capable because the Thumb instruction set is highly optimized.
5.2 BLUETOOTH SMART
5.2.1 BLE Core
The BLE (Bluetooth Low Energy) core is a qualified Bluetooth v4.1 baseband controller
compatible with Bluetooth Smart specification and it is in charge of packet encodingdecoding and frame scheduling.
 Bluetooth Smart Specifications compliant according to the Specification of the
Bluetooth System, v4.1, Bluetooth SIG.
 All device classes are supported -- Broadcast, Central, Observer, Peripheral)
 All packet types (Advertising / Data / Control)
 Encryption (AES / CCM)
 Bit stream processing (CRC, Whitening)
 FDMA / TDMA / events formatting and synchronization
 Frequency Hopping calculation
 Operating clock with internal 16 MHz
 Low power modes with internal 32.678 kHz
 Supports power down of the baseband during the protocol’s idle periods.
 Advanced High performance Bus (AHB) Slave interface for register file access.
 AHB Slave interface for Exchange Memory access of CPU via BLE core.
 AHB Master interface for direct access of BLE core to Exchange Memory space
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
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DATE
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5.2.2 Smart Snippets
The PAN1740 is available together with Dialog’s SmartSnippetsTM Bluetooth Software
platform which includes a qualified Bluetooth Smart single-mode stack on chip.
Numerous Bluetooth Smart profiles for consumer wellness, sport, fitness, security and
proximity applications are supplied as standard, while additional customer profiles can be
developed and added as needed.
The SmartSnippetsTM software development environment is based on KeilTM ‘s uVision
mature tools and contains example application code for both embedded and hosted modes.
5.2.3 Memory
The following memories are part of the PAN1740’s internal blocks:
ROM. This is a 84 kB ROM containing the Bluetooth Smart protocol stack as well as the
boot code sequence.
OTP. This is a 32 kB One-Time Programmable memory array, used to store the application
code as well as Bluetooth Smart profiles. It also contains the system configuration and
calibration data.
System SRAM. This is a 42 kB system SRAM (Sys-RAM) which is primarily used for
mirroring the program code from the OTP when the system wakes/powers up. It also serves
as Data RAM for intermediate variables and various data that the protocol requires.
Optionally, it can be used as extra memory space for the BLE TX and RX data structures.
Retention RAMs. These are 4 special low leakage SRAM cells (2 kB + 2 kB + 3 kB + 1 kB)
used to store various data of the Bluetooth Smart protocol as well as the system’s global
variables and processor stack when the system goes into Deep Sleep mode. Storage of this
data ensures secure and quick configuration of the BLE Core after the system wakes up.
Every cell can be powered on or off according to the application needs for retention area
when in Deep Sleep mode.
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
8 of 34
DATE
15.12.2014
5.2.4 Functional Modes
The PAN1740 is optimized for embedded applications such as health monitoring, sports
measuring, human interaction devices, etc. Customers are able to develop and test their
own applications. Upon completion of development, the application code can be
programmed into the OTP. In general, the system has three functional modes of operation:
A. Development Mode: During this phase application code is developed using the ARM
Cortex M0 SW environment. The compiled code is then downloaded into the System
RAM or any Retention RAMs by means of SWD (JTAG) or any serial interface (e.g.
UART). Address 0x00 is remapped to the physical memory that contains the code and
the CPU is configured to reset and execute code from the remapped device. This mode
enables application development, debugging and on-the-fly testing.
B. Normal Mode: After the application is completed and verified, the code can be burned
into the OTP. When the system boots/wakes up, the DMA of the OTP controller will
automatically copy the program code from the OTP into the system RAM. Next, a SW
reset will remap address 0x00 to the System RAM and code execution is started.
Hence, in this mode, the system is autonomous, contains the required SW in OTP and
is ready for integration into the final product.
C. Calibration Mode: Programming the Bluetooth device address is completed in
Calibration Mode.
5.2.5 Power Modes
There are four different power modes in the PAN1740:
o Active Mode: System is active and operates at full speed.
 Sleep Mode: No power gating has been programmed, the ARM CPU is idle, waiting
for an interrupt. PD_SYS is on. PD_PER and PED_RAD depending on the
programmed enabled value.
 Extended Sleep Mode: All power domains are off except for the PD_AON, the
programmed PD_RRx and the PD_SR. Since the SysRAM retains its data, no OTP
mirroring is required upon waking up the system.
 Deep Sleep Mode: All power domains are off except for the PD_AON and the
programmed PD_RRx. This mode dissipates the minimum leakage power. However,
since the SysRAM has not retained its data, an OTP mirror action is required upon
waking up the system.
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CLASSIFICATION
No.
DS-1740-2400-102
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
6
REV.
1.1
PAGE
9 of 34
DATE
15.12.2014
TERMINAL LAYOUT
Top view, Application PCB
0,55
C
D
A
B
19
20
17
18
15
16
13
9.50
1.80
9.00
12
14
21 Pad = 28 x 0.60mm x 0.60mm 11
Top View
10
23
9
2
24
1
7
4
3
6
5
8
0,60
22
7
TERMINAL DESCRIPTION
PIN
1
2
3
4
5
6
7
Description
GND
RST
P0.7
P0.6
P0.5
P0.4
GND
16
VCC
P0.3
P0.2
P0.1
P0.0
n.c.
VPP
GND
P1_4/SWCLK
17
GND
8
9
10
11
12
13
14
15
I
IO
IO
IO
IO
INPUT. Reset signal (active high).
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes. UART RX*
General purpose I/O port bit or alternate function nodes. UART TX*
AI
IO
IO
IO
IO
Power supply
General purpose I/O port bit or alternate function nodes. UART CTS*
General purpose I/O port bit or alternate function nodes. UART RTS*
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes.
AI INPUT. This pin is used while OTP programming and testing. **
IO INPUT JTAG clock signal
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
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18
P1_5/SW_DIO IO INPUT/OUTPUT. JTAG Data input/output.
19
GND
GND
P1.3
P1.2
P1.1
P1.0
GND
GND
GND
GND
20
21
22
23
24
A
B
C
D
IO
IO
IO
IO
REV.
1.1
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes.
General purpose I/O port bit or alternate function nodes.
For more detailed description of the alternate function nodes please refer to the Dialog
Datasheet.
*Dependent on the software configuration the UART can be set also to any other IO.
** Supply voltage on pin VPP during OTP programming is 6.8V+/-0.25V
8
INTERFACES
8.1 UART
The UART is compliant to the industry-standard 16550 and is used for serial communication with
a peripheral, modem (data carrier equipment, DCE) or data set. Data is written from a master
(CPU) over the APB bus to the UART and it is converted to serial form and transmitted to the
destination device. Serial data is also received by the UART and stored for the master (CPU) to
read back. There is no DMA support on the UART block since its contains internal FIFOs. Both
UARTs support hardware flow control signals (RTS, CTS, DTR, DSR).
Features











16 bytes Transmit and receive FIFOs.
Hardware flow control support (CTS/RTS)
Shadow registers to reduce software overhead and also include a software
programmable reset
Transmitter Holding Register Empty (THRE) interrupt mode
IrDA 1.0 SIR mode supporting low power mode.
Functionality based on the 16550 industry standard:
Programmable character properties, such as number of data bits per character (58), optional
parity bit (with odd or even select) and number of stop bits (1, 1.5 or 2)
Line break generation and detection
Prioritized interrupt identification
Programmable serial data baud rate as calculated by the following: baud rate =
(serial clock frequency)/(divisor).
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CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
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REV.
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DATE
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8.2 SPI+
This interface supports a subset of the Serial Peripheral Interface SPI™. The serial interface
can transmit and receive 8, 16 or 32 bits in master/slave mode and transmit 9 bits in master
mode. The SPI+ interface has enhanced functionality with bidirectional 2x16-bit word FIFOs.
SPI™ is a trademark of Motorola, Inc.
Features








Slave and Master mode
8 bit, 9 bit, 16 bit or 32 bit operation
Clock speeds up to 16 MHz. Programmable output frequencies of SPI source clock
divided by 1, 2, 4, 8
SPI mode 0, 1, 2, 3 support. (clock edge and phase)
Programmable SPI_DO idle level
Maskable Interrupt generation
Bus load reduction by unidirectional writes-only and reads-only modes.
Built-in RX/TX FIFOs for continuous SPI bursts.
8.3 I2C
The I2C is a programmable control bus that provides support for the communications link
between Integrated Circuits in a system. It is a simple two-wire bus with a software-defined
protocol for system control, which is used in temperature sensors and voltage level translators
to EEPROMs, general-purpose I/O, A/D and D/A converters.
Features














Two-wire I2C serial interface consists of a serial data line (SDA) and a serial clock
(SCL)
Two speeds are supported:
Standard mode (0 to 100 Kb/s)
Fast mode (<= 400 Kb/s)
Clock synchronization
32 deep transmit/receive FIFOs
Master transmit, Master receive operation
7 or 10-bit addressing
7 or 10-bit combined format transfers
Bulk transmit mode
Default slave address of 0x055
Interrupt or polled-mode operation
Handles Bit and Byte waiting at both bus speeds
Programmable SDA hold time
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CLASS 2 BLUETOOTH LOW ENERGY
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8.4 GENERAL PURPOSE (GP) ADC
The PAN1740 is equipped with a high-speed ultra low power 10-bit general purpose Analogto-Digital Converter (GPADC). It can operate in unipolar (single ended) mode as well as in
bipolar (differential) mode. The ADC has its own voltage regulator (LDO) of 1.2 V, which
represents the full scale reference voltage.
Features









10-bit dynamic ADC with 65 ns conversion time
Maximum sampling rate 3.3 Msample/s
Ultra low power (5 µA typical supply current at 100 ksample/s)
Single-ended as well as differential input with two input scales
Four single-ended or two differential external input channels
Battery monitoring function
Chopper function
Offset and zero scale adjust
Common-mode input level adjust
8.5 QUADRATURE DECODERS
This block decodes the pulse trains from a rotary encoder to provide the step and the direction
of the movement of an external device. Three axes (X, Y, Z) are supported.
The integrated quadrature decoder can automatically decode the signals for the X, Y and Z
axes of a HID input device, reporting step count and direction: the channels are expected to
provide a pulse train with 90 degrees phase difference; depending on whether the reference
channel is leading or lagging, the directioncan be determined.
This block can be used for waking up the chip as soon as there is any kind of movement from
the external device connected to it.
Features





Three 16-bit signed counters that provide the step count and direction on each of
the axes (X, Y and Z)
Programmable system clock sampling at maximum 16 MHz.
APB interface for control and programming
Programmable source from P0, P1 ports
Digital filter on the channel inputs to avoid spikes
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CLASSIFICATION
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8.6 KEYBOARD CONTROLLER
The keyboard controller can be used for debouncing the incoming GPIO signals when
implementing a keyboard scanning engine. It generates an interrupt to the CPU
(KEYBR_IRQ). In parallel, five extra interrupt lines can be triggered by a state change on 32
selectable GPIOs (GPIOx_IRQ).
Features




Monitors any of the 12 available GPIOs
Generates a keyboard interrupt on key press or key release
Implements debouncing time from 0 up to 63 ms
Supports five separate interrupt generation lines from GPIO toggling
8.7 INPUT/OUTPUT PORTS
The PAN1740 has software-configurable I/O pin assignment, organized into ports Port 0,
Port1.
Features







Port 0: 8 pins, Port 1: 6 pins (including SW_CLK and SWDIO)
Fully programmable pin assignment
Selectable Push-pull or open drain per pin
Selectable 25KOhm pull-up, pull-down resistors per pin
Pull-up voltage VBAT3V (BUCK mode)
Fixed assignment for analog pin ADC[3:0]
Pins retain their last state when system enters the Extended or Deep Sleep mode.
8.8 TIMERS
For any software related description please refer to the according Dialog document.
8.9 RESET
The PAN1740 comprises an RST pad which is active high. It contains an RC filter for spikes
suppression with 400 kΩ and 2.8 pF for the resistor and the capacitor respectively. It also
contains a 25 kΩ pulldown resistor. This pad should be connected to ground if not needed by
the application. The typical latency of the RST pad is in the range of 2 µs.
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CLASSIFICATION
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PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
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REV.
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SPECIFICATIONS
Table 3: Absolute maximum ratings
Parameter
Description
VPIN(LIM)(defaul limiting voltage on a pin
t)
Conditions
Min
Voltage between GND
and VBAT3V
TSTG
storage temperature
tR(SUP)
supply rise time
Power supply rise time
VBAT(LIM)(VBAT
3V)
limiting battery supply
voltage
Supply voltage on
VBAT3V in a buck-converter application, pin
VBAT1V is connected to
ground
*Note1
Max
Unit
-0.1
VBAT3V+
0.2
V
-50
150
°C
100
ms
3.45
V
1.8/2.2
Typ
*Note1
VESD(HBM)(WL
CSP34)
electrostatic discharge
voltage (Human Body
Model)
2000
V
VESD(HBM)(QF
N48)
electrostatic discharge
voltage (Human Body
Model)
4000
V
VESD(MM)(WLC
SP34)
electrostatic discharge
voltage (Machine Model)
175
V
VESD(CDM)(WL
CSP34)
electrostatic discharge
voltage (Charged Device
Model)
500
V
Note1: The BUCK mode of the DCDC can operate correctly with voltages in the range of 2.2V upto 3.3V. If the voltage
drops below that, then the OTP might not be readable any more. However, if no OTP is used, then the
system is able to further operate up to 1.8V.
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PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
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DATE
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Table 4: Recommended operating conditions
Parameter
Description
Conditions
Min
VBAT(VBAT3V)
battery supply voltage
Supply voltage on
VBAT3V in a buck-converter application, pin
VBAT1V is connected to
ground
2.35
3.3
V
VPIN(default)
voltage on a pin
Voltage between GND
and VBAT3V
0
3.3
V
TA
ambient temperature
-40
85
°C
VPP
programming voltage
7.05
V
Max
Unit
Supply voltage on pin
VPP during OTP programming
6.55
Typ
6.8
Max
Unit
Table 5: DC characteristics
Parameter
Description
Conditions
IBAT(DP_SLP)_
BUCK_1kB
battery supply current
Typical buck-application
in deep-sleep with 1kB
retention RAM active.
VBAT3V = 3V, running
from RC32K oscillator at
lowest frequency
0.4
A
IBAT(DP_SLP)_
BUCK_2kB
battery supply current
Typical buck-application in
deep-sleep with 2kB
retention RAM active.
VBAT3V = 3V
(Note 3)
0.45

IBAT(DP_SLP)_
BUCK_8kB
battery supply current
Typical buck-application in
deep-sleep with 8kB
retention RAM active.
VBAT3V = 3V
0.6

IBAT(EXT_SLP)
_BUCK_43KB
battery supply current
Typical buck-application in
extended-sleep mode with
42kB (SysRAM) and
1kB (RetRAM) retained
1.2

IBAT(EXT_SLP)
_BUCK_50kB
battery supply current
Typical buck-application in
extended-sleep mode with
42kB (SysRAM) and
8kB (RetRAM) retained
1.4

IBAT(ACT_RX)_
BUCK
battery supply current
Typical application with buck
converter and receiver
active, VBAT3V
= 3.0V
5.1
m
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Typ
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IBAT(ACT_TX)_
BUCK
battery supply current
Typical application with buck
converter and transmitter
active, VBAT3V = 3.0V
4.8
mA
PBAT(DP_SLP)
_BUCK_1kB
battery power
consump- tion
Typical boost-applica- tion in
deep-sleep with
1kB retention RAM active,
running from RC32K
oscillator
1.2
µW
PBAT(ACT_RX)
_BUCK
battery power
consump- tion
Typical application with buck
converter, receive mode
15.5
mW
PBAT(ACT_TX)
_BUCK
battery power
consump- tion
Typical application with buck
converter, transmit mode
14.3
mW
Table 8: 16 MHz Crystal Oscillator: Timing characteristics
Parameter
Description
tSTA(XTAL)(16M)
crystal oscillator startup
time
Conditions
Min
Typ
Max
Unit
0.5
2
3
ms
Min
Typ
Max
Unit
Table 10: 32 kHz Crystal Oscillator: Timing characteristics
Parameter
Description
Conditions
tSTA(XTAL)(32k)
crystal oscillator startup
time
Typical application, time
until 1000 clocks are
detected
Table 12: DC-DC converter: DC characteristics
Parameter
Description
Conditions
VO(BUCK)
output voltage
CONV_MAX(BUCK)
maximum
conversion
efficiency
VO/
VI(BUCK)
line regulation
2.35V < VBAT3V < 3.3V
VO/IL(BUCK)
load regulation
VBAT3V = 2.5V
VRPL(BUCK)
ripple voltage
buck mode; RMS ripple
voltage
0.4
Min
default settings
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s
Max
Unit
1.41
V
86
%
-2
0.7
2
%/V
-0.2
-0.02
0.2
%/mA
5
mV
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CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
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10 SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
Reflow permissible cycle:
2
Opposite side reflow is prohibited due to module weight.
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ENW89846A1KF
PAN1740
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11 MODULE DIMENSION
No.
Item
Dimension
Tolerance
1
Width
9.50
 0.30
2
Lenght
9.00
 0.30
3
Height
1.80
 0.20
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PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
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DATE
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12 FOOTPRINT OF THE MODULE
All dimensions are in millimeters.
The outer dimensions have a tolerance of  0.2mm.
The layout is symetric to center. The inner pins (2,4,6,9,11,14,16,18,21,23) are shifted to the
center by 1mm.
C
D
A
B
9.50
19
20
17
18
15
16
13
12
14
21 Pad = 28 x 0.60mm x 0.60mm 11
Top View
22
10
23
0.55
1.00
9
2
24
1
0.90
1.70
1.80
2.70
1.80
1.80
3.95
2.95
2.70
1.80
0.90
4
3
6
5
8
7
9,00
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DATE
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13 CASE MARKING
14 MARKING
P
E
Y
F
A
N
Y
C
N
W
W
C
1
8
W
I
7 4 0
H W / S W
9 8 4 6 A 1 K F
D L L
D :
T 7 V 1 7 4 0
15 MARKING DEFINITION
PAN1740 (Model Name), HW/SW (Hardware/Software version)
ENW89846A1KF (Part Number, refer to chapter 28 Ordering Information)
Lot code (YearYear, WeekWeek, Day, LotLot)
FCC ID
ES (Engineering Sample marking)
16 MECHANICAL REQUIREMENTS
No.
Item
1
Solderability
2
Resistance to soldering
heat
Limit
Condition
More than 75% of the soldering area shall be
coated by solder
It shall be satisfied electrical requirements and not
be mechanical damage
Reflow soldering with
recommendable temperature profile
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PAN1740
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17 RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1
hour.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
3
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4
Moisture test
the same as above
+60°C, 90% RH, 300h
5
Low temp. test
the same as above
-40°C, 300h
6
High temp. test
the same as above
+85°C, 300h
No.
18 CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s
functions and damage to the product.
19 DESIGN NOTES
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Follow the conditions written in this specification, especially the control signals of
this module.
The supply voltage has to be free of AC ripple voltage (for example from a
battery or a low noise regulator output). For noisy supply voltages, provide a
decoupling circuit (for example a ferrite in series connection and a bypass
capacitor to ground of at least 47uF directly at the module).
This product should not be mechanically stressed when installed.
Keep this product away from heat. Heat is the major cause of decreasing the life
of these products.
Avoid assembly and use of the target equipment in conditions where the
products' temperature may exceed the maximum tolerance.
The supply voltage should not be exceedingly high or reversed. It should not
carry noise and/or spikes.
Keep this product away from other high frequency circuits.
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DATE
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20 INSTALLATION NOTES
(1)
Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the temperature at the soldering portion of this product according to this
reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to
the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact
between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of
this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause
damage to the unit.
(10) For more details on LGA (Land Grid Arrey) soldering processes refer to the
application note.
21 USAGE CONDITIONS NOTES
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, check and evaluate their operation befor assembly on the final
products.
Do not use dropped products.
Do not touch, damage or soil the pins.
Follow the recommended condition ratings about the power supply applied to this
product.
Electrode peeling strength: Do not add pressure of more than 4.9N when
soldered on PCB.
Pressing on parts of the metal cover or fastening objects to the metal cover will
cause damage.
These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information
and communication equipment.
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DATE
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22 STORAGE NOTES
(1)
(2)
(3)
(4)
(5)
The module should not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely
affected:
 Storage in salty air or in an environment with a high concentration of corrosive
gas, such as Cl2, H2S, NH3, SO2, or NOX
 Storage in direct sunlight
 Storage in an environment where the temperature may be outside the range of
5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.
 Storage of the products for more than one year after the date of delivery Storage
period: Please check the adhesive strength of the embossed tape and soldering
after 6 months of storage.
Keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.
Follow the specification when stacking packed crates (max. 10).
23 SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and
individual components.
Before use, check and evaluate the operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a dual fault causing an unsafe status.
24 OTHER CAUTIONS
(1)
(2)
(3)
(4)
(5)
This specification sheet is copyrighted. Reproduction of this data sheets is
permissible only if reproduction is without alteration and is accompanied by all
associated warranties, conditions, limitations, and notices.
Do not use the products for other purposes than those listed.
Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of
the product.
This product has been manufactured without any ozone chemical controlled
under the Montreal Protocol.
These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special
conditions carefully to determine whether or not they can be used in such a
manner.
 In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
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SINGLE MODE MODULE
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PAN1740
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(6)
(7)
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DATE
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 In direct sunlight, outdoors, or in a dusty environment
 In an environment where condensation occurs.
 In an environment with a high concentration of harmful gas (e.g. salty air, HCl,
Cl2, SO2, H2S, NH3, and NOX)
If an abnormal voltage is applied due to a problem occurring in other components
or circuits, replace these products with new products because they may not be
able to provide normal performance even if their electronic characteristics and
appearances appear satisfactory.
When you have any question or uncertainty, contact Panasonic.
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PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
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25 PACKAGING
Tape Dimension
Y
X
X
Y
SECTION YSCALE 3.5 :
Y
1
SECTION XSCALE 3.5 :
X
1
Ao
Bo
Ko
K1
F
P1
W
9.90
9.40
2.80
2.00
7.50
12.00
16.00
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.10
+/- 0.30
(I)
(II)
(III)
Tooling code: Flatbed - 9
Estimated Max Length: 72m per 22B3
(IV)
Measured from centreline of sprocket hole
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
Packing in Tape
Direction of unreeling (for customer)
trailer (empty)
1 x circumference /hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Pin1 Marking
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Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
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26 LABEL FOR PACKAGE
The picture shows an example from similar product.
105 mm
PAN1315
51 mm
Customer Code
(1T)
ENW89818C2JF
(1P)
Lot code [YYWWDLL]
Example from above:
YY
year
printed 08
WW
normal calendar week
printed 01
D
day
printed 5 (Friday)
L
line identifier, if more as one
printed 1
L
lot identifier per day
printed 1
Customer Order Code, if any, otherwise company name will be printed
(2P)
Panasonic Order Code:
(9D)
Date code as [YYWW]
(Q)
Quantity [XXXX], variable max. 1500
(HW/SW)
Hardware /Software Release
Hardware 01
Indicates the HW revision.
Software 01
Indicates the SW revision.
27 TOTAL PACKAGE
moisture-sensitive print
(already exist on barrier bag)
barcode
label
barrier bag
sealed
desiccant 1) 2)
moisture indicator
barcode
label
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
inner carton box
size 340 x 340 x 41 mm³
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PRODUCT SPECIFICATION
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SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
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DATE
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28 ORDERING INFORMATION
Ordering part number
Description
MOQ (1)
ENW89846A1KF (2)
PAN1740 CLASS 2 Bluetooth single mode Module according BT-4.0.
Bluetooth® smart device
1500
Notes:
(1) Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is
1500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any
quantity via the distribution channels.
(2) Samples are available on customer demand
29
ROHS AND REACH DECLARATION
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product follows the latest official RoHS and REACH Directive.
For the full declaration, please refer to [4].
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SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
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28 of 34
DATE
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30 DATA SHEET STATUS
This data sheet contains the final specification.
Panasonic reserves the right to make changes at any time without notice in order to improve
design and supply the best possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
31 HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
0.1
February 2014
1st preliminary version.
0.2
April 2014
Included Bluetooth 4.1 compliance.
0.3
June 2014
Formating Table 5. Updated Key Features.
1.0
October 2014
Final Specification incl. DoC.
1.1
December
Changed tolerances in chapter 11 Module Dimension.
32 RELATED DOCUMENTS
For an update, please search in the suitable homepage.
[1]
BLUETOOTH® 4.1 QUICK REFERENCE GUIDE:
https://www.bluetooth.org/en-us/specification/adopted-specifications
[2]
Semiconductor Website and Software Tools:
http://support.dialog-semiconductor.com/
[3]
Application Note Land Grid Array
http://www.pideu.panasonic.de/pdf/184ext.pdf
[4]
REACH and RoHS Certificate
http://www.pideu.panasonic.de/pdf/182ext2.jpg
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PRODUCT SPECIFICATION
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SINGLE MODE MODULE
CUSTOMER’S CODE
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ENW89846A1KF
PAN1740
SUBJECT
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REV.
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DATE
15.12.2014
33 GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH 2012.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver ES samples to the customer, these samples have the status Engineering
Samples. This means, the design of this product is not yet concluded. Engineering Samples
may be partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
 the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in another product to be sold by Customer,
 deviation or lapse in function of Engineering Sample,
 Improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages.
In case of any questions, please contact your local sales partner or the related product
manager.
34 REGULATORY INFORMATION
35 FCC NOTICE
The devices PAN1740, for details refer to Chapter 28, including the antennas, which are
listed in 39, complies with Part 15 of the FCC Rules. The device meets the requirements for
modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference
that
may
cause
undesired
operation.
36 CAUTION
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may
void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT




No.
DS-1740-2400-102
REV.
1.1
PAGE
30 of 34
DATE
15.12.2014
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help
37 LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure specifying
the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above.
The FCC identifier is FCC ID: T7V1740. This FCC identifier is valid for all PAN1740
modules, for details, see the Chapter 28 - Ordering Information.
In
any
case
the
end
product
must
be
labelled
exterior
with
"Contains FCC ID: T7V1740"
38 ANTENNA WARNING
For the related part number of PAN1740 refer to Chapter 28 - Ordering Information.
This device is tested with a standard SMA connector and with the antennas listed below.
When integrated in the OEMs product, these fixed antennas require installation preventing
end-users from replacing them with non-approved antennas. Any antenna not in the
following table must be tested to comply with FCC Section 15.203 for unique antenna
connectors and Section 15.247 for emissions.
39 APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
1
LDA212G3110K Murata
Frequency Band
Type
Gain (dBi)
2.4GHz
Chip-Antenna
+0.9
40 RF EXPOSURE
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer
(OEM) must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for
products operating with the approved antennas in the previous table to alert users on FCC
RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN1740 with mounted ceramic antenna
(FCC ID: T7V1740) is far below the FCC radio frequency exposure limits. Nevertheless, the
PAN1740 shall be used in such a manner that the potential for human contact during
normal operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators
and end users must be provided with transmitter operating conditions for satisfying RF
exposure compliance.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
31 of 34
DATE
15.12.2014
41 INDUSTRY CANADA CERTIFICATION
PAN1740 is licensed to meet the regulatory requirements of Industry Canada (IC),
license: IC: 216Q-1740
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 20 above,
having a maximum gain of 0.9 dBi. Antennas not included in this list or having a gain
greater than 0.9 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
Due to the model size the IC identifier is displayed in the installation instruction only and
can not be displayed on the modules label due to the limited size (8.7x15.6mm).
42 IC NOTICE
The devices PAN1740, for details refer to Chapter 28, including the antennas, which are
listed in 39, complies with Canada RSS-GEN Rules. The device meets the requirements for
modular
transmitter
approval
as
detailed
in
RSS-GEN.
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
PAN1740 est garanti conforme aux dispositions règlementaires d’Industry Canada (IC),
licences: IC: 216Q-1740
Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la
réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux
limites d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption
spécifique maximum autorisé.
Des informations pour les utilisateurs sur la réglementation Canadienne concernant
l’exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca.
Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans
le tableau ci-dessus, présentant un gain maximum de 0.9dBi. Des antennes autres que
celles listées ici, ou présentant un gain supérieur a 0.9dBi ne doivent en aucune
circonstance être utilises en combinaison avec ce produit. L’impédance des antennes
compatibles est 50Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité
d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autre
antenne ou un autre émetteur. En raison de la taille du produit, l’identifiant IC est fourni
dans le manuel d’installation.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
32 of 34
DATE
15.12.2014
43 LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure specifying
the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The
IC identifier is 216Q-1740. This IC identifier is valid for all PAN1740 modules, for details,
see the Chapter 28 - Ordering Information.
In
any
case
the
end
product
must
be
labelled
exterior
with
"Contains IC: 216Q-1740"
Obligations d’étiquetage
Les fabricants d’équipements (OEM) doivent s’assurer que les obligations d’étiquetage du
produit final sont remplies. Ces obligations incluent une étiquette clairement visible à
l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus,
ainsi que la notification ci-dessus.
Les identifiants IC sont: IC: 216Q-1740
Ces identifiants sont valides pour tous les modules PAN1740 (Chapter 28. Ordering
Information). Dans tous les cas les produits finaux doivent indiquer sur leur emballage
externe une des mentions suivantes: "Contient IC: 216Q-1740”
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
33 of 34
DATE
15.12.2014
44 EUROPEAN R&TTE DECLARATION OF CONFORMITY
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
CUSTOMER’S CODE
PANASONIC’S CODE
ENW89846A1KF
PAN1740
SUBJECT
No.
DS-1740-2400-102
REV.
1.1
PAGE
34 of 34
DATE
15.12.2014
As a result of the conformity assessment procedure described in Annex III of the Directive
1999/5/EC, the end-customer equipment should be labelled as follows:
All versions of the PAN1740 in the specified reference design can be used in the following
countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland,
Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom,
Switzerland, and Norway.
45 BLUETOOTH
Final Bluetooth Product needs to be created by using following IDs:
QDID
Controller Subsystem
50800
Profile Subsystem
51591
Host SubSystem
51910
Declaration ID
B021655
B021941
B021835
46 INTRINSIC SAFETY
Total capacity shall not exceed 5µF.
The total inductance shall not exceed 3µH.
There is no resistor value in this design.
47 LIFE SUPPORT POLICY
This Panasonic product is not designed for use in life support appliances, devices, or
systems where malfunction can reasonably be expected to result in a significant personal
injury to the user, or as a critical component in any life support device or system whose
failure to perform can be reasonably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness. Panasonic customers using or selling
these products for use in such applications do so at their own risk and agree to fully
indemnify Panasonic for any damages resulting.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
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