Data Sheet

HEF4555B-Q100
1-of-4 decoder/demultiplexer
Rev. 1 — 21 October 2013
Product data sheet
1. General description
The HEF4555B-Q100 contains two 1-of-4 decoders/demultiplexers. Each
decoder/demultiplexer has two address inputs, nA0 and nA1. They also have an active
LOW enable input (nE) and four mutually exclusive outputs which are active HIGH (nY0 to
nY3). When used as a decoder, nE when HIGH, forces nY0 to nY3 LOW. When used as a
demultiplexer, the information on nA0 and nA1 with nE as data input selects the
appropriate output. All unselected outputs are LOW.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 3) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 3)
 Specified from 40 C to +85 C
 Fully static operation
 5 V, 10 V, and 15 V parametric ratings
 Standardized symmetrical output characteristics
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 Complies with JEDEC standard JESD 13-B
3. Applications
 Code conversion
 Address decoding
 Demultiplexing: when using the enable input as data input
HEF4555B-Q100
NXP Semiconductors
1-of-4 decoder/demultiplexer
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +85 C.
Type number
Package
Name
HEF4555BT-Q100 SO16
Description
Version
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
5. Functional diagram
1Y0 4
2 1A0
nY0
1Y1 5
DECODER
1Y2 6
nA0
3 1A1
1Y3 7
nY1
1 1E
2Y0 12
nA1
14 2A0
2Y1 11
DECODER
nY2
2Y2 10
13 2A1
2Y3 9
nE
15 2E
nY3
001aae753
001aae751
Fig 1.
Functional diagram
Fig 2.
Logic diagram for one decoder/multiplexer
6. Pinning information
6.1 Pinning
+()%4
(
9''
$
(
$
$
<
$
<
<
<
<
<
<
966
<
DDD
Fig 3.
Pin configuration
HEF4555B_Q100
Product data sheet
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6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1A0, 1A1, 2A0, 2A1
2, 3, 14, 13
address input
1E, 2E
1, 15
enable input (active LOW
1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3
4, 5, 6, 7, 12, 11, 10, 9
output (active HIGH)
VDD
16
supply voltage
VSS
8
ground (GND)
7. Functional description
Table 3.
Function selection[1]
Inputs
Outputs
nE
nA0
nA1
nY0
nY1
nY2
nY3
L
L
L
H
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
H
L
L
H
H
L
L
L
H
H
X
X
L
L
L
L
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
Conditions
Min
Max
Unit
0.5
+18
V
VI < 0.5 V or VI > VDD + 0.5 V
-
10
mA
0.5
VDD + 0.5
V
VO < 0.5 V or VO > VDD + 0.5 V
-
10
mA
VI
input voltage
IOK
output clamping current
II/O
input/output current
-
10
mA
IDD
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
-
500
mW
-
100
mW
Ptot
total power dissipation
Tamb 40 C to +85 C
P
power dissipation
per output
[1]
[1]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
HEF4555B_Q100
Product data sheet
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9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
VI
Conditions
Min
Typ
Max
Unit
supply voltage
3
-
15
V
input voltage
0
-
VDD
V
Tamb
ambient temperature
in free air
40
-
+85
C
t/V
input transition rise and fall rate
VDD = 5 V
-
-
3.75
s/V
VDD = 10 V
-
-
0.5
s/V
VDD = 15 V
-
-
0.08
s/V
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter
VIH
VIL
VOH
VOL
IOH
IOL
HIGH-level input voltage
LOW-level input voltage
Conditions
Tamb = 25 C
Tamb = 85 C
Min
Max
Min
Max
Min
Max
5V
3.5
-
3.5
-
3.5
-
V
10 V
7.0
-
7.0
-
7.0
-
V
15 V
11.0
-
11.0
-
11.0
-
V
5V
-
1.5
-
1.5
-
1.5
V
10 V
-
3.0
-
3.0
-
3.0
V
15 V
-
4.0
-
4.0
-
4.0
V
VDD
IO < 1 A
IO < 1 A
HIGH-level output voltage IO < 1 A;
VI = VSS or VDD
Tamb = 40 C
Unit
5V
4.95
-
4.95
-
4.95
-
V
10 V
9.95
-
9.95
-
9.95
-
V
15 V
14.95
-
14.95
-
14.95
-
V
5V
-
0.05
-
0.05
-
0.05
V
10 V
-
0.05
-
0.05
-
0.05
V
15 V
-
0.05
-
0.05
-
0.05
V
HIGH-level output current VO = 2.5 V
5V
-
1.7
-
1.4
-
1.1
mA
VO = 4.6 V
5V
-
0.52
-
0.44
-
0.36 mA
VO = 9.5 V
10 V
-
1.3
-
1.1
-
0.9
mA
VO = 13.5 V
15 V
-
3.6
-
3.0
-
2.4
mA
VO = 0.4 V
5V
0.52
-
0.44
-
0.36
-
mA
VO = 0.5 V
10 V
1.3
-
1.1
-
0.9
-
mA
LOW-level output voltage
LOW-level output current
IO < 1 A;
VI = VSS or VDD
VO = 1.5 V
15 V
3.6
-
3.0
-
2.4
-
mA
II
input leakage current
VDD = 15 V
15 V
-
0.3
-
0.3
-
1.0
A
IDD
supply current
IO = 0 A;
VI = VSS or VDD
5V
-
20
-
20
-
150
A
10 V
-
40
-
40
-
300
A
15 V
-
80
-
80
-
600
A
-
-
-
-
7.5
-
-
pF
CI
input capacitance
HEF4555B_Q100
Product data sheet
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NXP Semiconductors
1-of-4 decoder/demultiplexer
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; Tamb = 25 C; for test circuit, see Figure 5; unless otherwise specified.
Symbol
tPHL
Parameter
Conditions
HIGH to LOW
propagation delay
nAn  nYn;
see Figure 4
nE  nYn
VDD
Min
Typ
Max
Unit
88 ns + (0.55 ns/pF)CL
-
115
230
ns
10 V
34 ns + (0.23 ns/pF)CL
-
45
90
ns
15 V
22 ns + (0.16 ns/pF)CL
-
30
65
ns
5V
98 ns + (0.55 ns/pF)CL
-
125
250
ns
10 V
39 ns + (0.23 ns/pF)CL
-
50
95
ns
5V
Extrapolation formula
[1]
22 ns + (0.16 ns/pF CL
-
30
65
ns
113 ns + (0.55 ns/pF)CL
-
140
280
ns
10 V
44 ns + (0.23 ns/pF)CL
-
55
105
ns
15 V
32 ns + (0.16 ns/pF)CL
-
40
75
ns
5V
123 ns + (0.55 ns/pF)CL
-
150
295
ns
10 V
44 ns + (0.23 ns/pF)CL
-
55
110
ns
32 ns + (0.16 ns/pF)CL
-
40
75
ns
10 ns + (1.00 ns/pF)CL
-
60
120
ns
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
15 V
LOW to HIGH
propagation delay
tPLH
nAn  nYn
nE  nYn
5V
[1]
15 V
transition time
tt
on nYn
5V
[1][2]
[1]
The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
[2]
Transition time tt is the same as the HIGH to LOW and LOW to HIGH transition times tTHL and tTLH.
Table 8.
Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf  20 ns; Tamb = 25 C.
Symbol
Parameter
PD
dynamic power
dissipation
VDD
Typical formula for PD (W)
Where:
PD = 4500  fi + (fo  CL)  VDD2
fi = input frequency in MHz,
10 V
PD = 18800  fi + (fo  CL) 
VDD2
fo = output frequency in MHz,
15 V
PD = 45700  fi + (fo  CL) 
VDD2
CL = output load capacitance in pF,
5V
VDD = supply voltage in V,
(fo  CL) = sum of the outputs.
HEF4555B_Q100
Product data sheet
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1-of-4 decoder/demultiplexer
12. Waveforms
VDD
0.5VM
nAn, nE input
GND
tPHL
tPLH
VOH
nYn output
0.5VM
VOL
tTHL
tTLH
001aal114
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4.
Inputs nAn and nE to output nYn propagation delays
Table 9.
Measurement points
Supply voltage
Input
Output
VDD
VM
VM
5 V to 15 V
0.5VDD
0.5VDD
HEF4555B_Q100
Product data sheet
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VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VDD
VI
VO
G
DUT
RT
CL
001aal115
Test data is given in Table 10.
Definitions for test circuit:
Device Under Test (DUT);
RL = Load resistance;
CL = Load capacitance including jig and probe capacitance;
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator;
VEXT = External voltage for measuring switching times.
Fig 5.
Load circuitry for switching times
Table 10.
Test data
Supply voltage
5 V to 15 V
HEF4555B_Q100
Product data sheet
Input
Load
VEXT
VI
tr = tf
CL
tPLH, tPHL
tTHL, tTLH
VDD
 20 ns
50 pF
open
VDD
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13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 6.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT109-1 (SO16)
HEF4555B_Q100
Product data sheet
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Rev. 1 — 21 October 2013
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14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
HBM
Human Body Model
ESD
ElectroStatic Discharge
MM
Machine Model
MIL
Military
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4555B_Q100 v.1
20131021
Product data sheet
-
-
HEF4555B_Q100
Product data sheet
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Rev. 1 — 21 October 2013
© NXP B.V. 2013. All rights reserved.
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
HEF4555B_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 October 2013
© NXP B.V. 2013. All rights reserved.
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
HEF4555B_Q100
Product data sheet
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18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 October 2013
Document identifier: HEF4555B_Q100