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Flexible Circuit Board Materials FCCL
R-F775
R-F786W
Standard type
High curvature CCL
Excellent dimensional stability and Spring back performance
Features
❶
❷
❸
❹
❺
Thin Flexible Circuit Board Materials with a Low modulus polyimide
Excellent Spring back performance and High flexibility (R-F786W)
Excellent dimensional stability (R-F775)
Halogen-free (Adhesiveless)
Offer thick copper foil and Polyimide film (R-F775)
Applications
Smartphone, Casing edge, Slide keyboard, DSCs, Camera module, LCD module, etc.
Spring back performance
12
ED12-25-12
30mm
䕦50%Down
10
10mm
Weight load
3DQDVRQLF
5
R-F786W
ED12-25-12
Gap quantity
Test coupon
Number of times
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14
CCL with Copper
Company A
15
Weight load flexibility
Condition
10
8
6
4
2
0
0
5
3DQDVRQLF
10
Company B
R-F786W
ED12-25-12
㼃㼑㼕㼓㼔㼠㼘㼛㼍㼐䠄䡃䡂䠅
ED12-25-12
General Properties
Condition
Property
Test condition
Unit
R-F775
R-F786W
Standard Value
A
GPa
7.1
5.1
‒
Weight roll :2.0Kgf
Tensile Modulus
Radius
Repetiton
Insulation resistance
of the surface layer
A
Ω
1×1015
1×1015
1.0E+11
or more
Dk
A 1MHz
−
3.2
3.2
4.0(max.)
Df
A 1MHz
−
0.002
0.008
0.07 or less
A and E-169/70
−
94V-0
94VTM-0
94V‒0
After having gent, put it back
Flame resistance(UL)
Chemical resistance
No
abnormality
No
abnormality
No
abnormality
1.3
1.1
0.525 or more
1.3
1.2
0.525 or more
−
No
abnormality
No
abnormality
No
abnormality
−
No
abnormality
No
abnormality
No
abnormality
After etching MD direction
0.030
0.021
0.10∼‒0.10
After etching TD direction
0.037
0.015
0.10∼‒0.10
0.022
0.018
0.10∼‒0.10
0.027
0.015
0.10∼‒0.10
RA 18-25-18
RA 18-25-18
NaOH2mol/l 23℃5 min
−
IPA 23℃5 min
Company B
㻡䃛㼙
A
Peel strength
L/S=1/1mm
Crystalstructure after lamination
3DQDVRQLF
HCL2mol/l 23℃5 min
:0 ⇔ 180°
Judgement :disconnected
㻡䃛㼙
※ special ED copper
N/mm
260℃ solder float for 5sec
Solder heat Resistance
A
288℃ solder float for 1min
Moisture Absorption
Solder Heat Resistance
C-96/40/90
260℃ solder float for 1min
Solder heat resistance
Solder Temp(℃)
Normal state
After abssorption
40℃90%96Hr
Dimensional
stability
%
After E-0.5/150 MD direction
After E-0.5/150 TD direction
R - F7 75
330
270
R - F78 6W
360
30 0
The above data is actual values and not guaranteed values.
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Flexible Circuit Board Materials FCCL
Standard type
R-F775
R-F786W
High curvature CCL
Line-up
Film
Film thickness
Type
Grade
12.5
1/2mil
15
3/5mil
20
4/5mil
25
1mil
38
50
2mil
75
3mil
100
4mil
125
5mil
150
6mil
Standard PI
R-F775 Double side
○*
○
○
○
○
○
○
○
○
○
High Heat
resistance PI
R-F786W Double side
○
−
−
○
−
○
−
−
−
−
*
:Under development
Copper Foil
R-F775
Copper Foil
thickness
SPEC.
2
with
Carrier
6
1/6OZ
9
1/4OZ
12
1/3OZ
18
1/2OZ
35
1OZ
70
2OZ
105
3OZ
150
4OZ
Standard
○
○*
○
○
○
−
−
−
−
Special
−
○*
○
○
○
○
−
−
−
Standard
−
−
○
○
○
○
○
○*
○*
Special
−
○*
○
○
○
−
−
−
−
ED
RA
*
:Under development
R-F786W
Copper Foil
thickness
SPEC.
12
1/3OZ
18
1/2OZ
ED
Special
○
○
RA
Special
○
○
Size
Type
TD(Width)
250mm
Roll
500mm
510mm
Sheet
Max.510mm
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