INTERSIL HA

HA-2529/883
Uncompensated, High Slew Rate
High Output Current, Operational Amplifier
July 1997
Features
Description
• This Circuit is Processed in Accordance to MIL-STD-883
and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
The HA-2529/883 is a monolithic operational amplifier which
typifies excellence of design. With a design based on years
of experience coupled with the reliable dielectric isolation
process, these amplifiers provide an outstanding combination of DC and AC parameters at closed loop gains of 3 or
greater without external compensation.
• High Slew Rate . . . . . . . . . . . . . . . . . . . . . 135V/µs (Min)
150V/µs (Typ)
• High Output Current . . . . . . . . . . . . . . . . . ±30mA (Min)
The HA-2529/883 offers 135V/µs (min) slew rate and fast
settling time (200ns typ), while consuming a mere 6mA
(max) quiescent supply current, making these amplifiers
ideal components for video circuitry and data acquisition
designs. With 15MHz minimum gain-bandwidth product
combined with 7.5kV/V minimum open loop gain, the
HA-2529/883 is an ideal component for demanding signal
conditioning designs. These devices provide ±30mA (min)
output current drive with an output voltage swing of ±10V
(min), making then suited for pulse amplifier and RF amplifier components. HA-2529/883 will upgrade a system presently using the HA-2520/22/883 or EHA-2520/22/883 in
regards to output current, slew rate, offset voltage drift, and
offset current drift. To insure compliance with slew rate and
transient response specifications, all devices are 100% tested
for AC performance characteristics over full temperature.
• High Gain-Bandwidth Product . . . . . . . . . 15MHz (Min)
20MHz(Typ)
• Wide Power Bandwidth . . . . . . . . . . . . . . . 2.1MHz (Min)
• High Input Impedance . . . . . . . . . . . . . . . . . 50MΩ (Min)
130MΩ (Typ)
• Low Offset Current . . . . . . . . . . . . . . . . . . . 25nA (Max)
5nA (Typ)
• Fast Settling (10V Step to 0.1%) . . . . . . . . . . . 200ns (Typ)
• Low Quiescent Supply Current . . . . . . . . . . 6mA (Max)
Applications
• Data Acquisition Systems
Ordering Information
• RF Amplifiers
• Video Amplifiers
PART NUMBER
• Signal Generators
• Pulse Amplification
TEMP.
RANGE (oC)
PACKAGE
PKG.
NO.
HA2-2529/883
-55 to 125
8 Pin Metal Can
T8.C
HA7-2529/883
-55 to 125
8 Ld CERDIP
F8.3A
Pinouts
HA-2529/883
(CERDIP)
TOP VIEW
HA-2529/883
(METAL CAN)
TOP VIEW
COMP
BAL
1
-IN
2
+IN
3
V-
4
8
+
COMP
7
V+
6
OUT
5
BAL
8
BAL
+
2
-IN
+IN
7 V+
1
6 OUT
5
3
BAL
4
V-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
511025-883
File Number 3736.1
Spec Number
HA-2529/883
Absolute Maximum Ratings
TA = 25oC
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA
θJC
CERDIP Package . . . . . . . . . . . . . . . . 115oC/W
28oC/W
Metal Can Package . . . . . . . . . . . . . . . 160oC/W
75oC/W
Package Power Dissipation Limit at 75oC for TJ ≤ 175oC
CERDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 870mW
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625mW
Package Power Dissipation Derating Factor Above 75oC
CERDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.7mW/oC
Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3mW/oC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . . 40V
Differential Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . . V+ to VPeak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
ESD Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <2000V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
VINCM ≤ 1/2 (V+ - V-)
RL ≥ 500Ω
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETER
Input Offset Voltage
Input Bias Current
SYMBOL
VIO
+IB
-IB
Input Offset
Current
Common Mode Range
IIO
+CMR
-CMR
Large Signal Voltage
Gain
+AVOL
-AVOL
Common Mode
Rejection Ratio
+CMRR
-CMRR
Output Voltage Swing
+VOUT
-VOUT
CONDITIONS
VCM = 0V
VCM = 0V, +RS = 100kΩ,
-RS = 100Ω
VCM = 0V, +RS = 100Ω,
-RS = 100kΩ
VCM = 0V, +RS = 100kΩ,
-RS = 100kΩ
V+ = 5V, V- = -25V
V+ = 25V, V- = -5V
VOUT = 0V and +10V, RL = 2kΩ
VOUT = 0V and -10V, RL = 2kΩ
∆VCM = +10V, V+ = +5V,
V- = -25V,
VOUT = -10V
∆VCM = -10V, V+ = +25V,
V- = -5V, VOUT = +10V
RL = 2kΩ
RL = 2kΩ
GROUP A
SUBGROUPS
TEMP.
(oC)
MIN
MAX
UNITS
1
25
-5
5
mV
2, 3
125, -55
-8
8
mV
1
25
-200
200
nA
2, 3
125, -55
-400
400
nA
1
25
-200
200
nA
2, 3
125, -55
-400
400
nA
1
25
-25
25
nA
2, 3
125, -55
-50
50
nA
1
25
+10
-
V
2, 3
125, -55
+10
-
V
1
25
-
-10
V
2, 3
125, -55
-
-10
V
4
25
10
-
kV/V
5, 6
125, -55
7.5
-
kV/V
4
25
10
-
kV/V
5, 6
125, -55
7.5
-
kV/V
1
25
83
-
dB
2, 3
125, -55
80
-
dB
1
25
83
-
dB
2, 3
125, -55
80
-
dB
4
25
10
-
V
5, 6
125, -55
10
-
V
4
25
-
-10
V
5, 6
125, -55
-
-10
V
Spec Number
2
511025-883
HA-2529/883
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified.
PARAMETER
Output Current
SYMBOL
+IOUT
-IOUT
Quiescent Power Supply
Current
+ICC
-ICC
Power Supply
Rejection Ratio
+PSRR
-PSRR
Offset Voltage
Adjustment
+VIOAdj
-VIOAdj
CONDITIONS
GROUP A
SUBGROUPS
TEMP.
(oC)
MIN
MAX
UNITS
4
25
30
-
mA
5, 6
125, -55
20
-
mA
4
25
-
-30
mA
5, 6
125, -55
-
-20
mA
1
25
-
6
mA
2, 3
125, -55
-
7
mA
1
25
-6
-
mA
2, 3
125, -55
-7
-
mA
1
25
80
-
dB
2, 3
125, -55
80
-
dB
1
25
80
-
dB
2, 3
125, -55
80
-
dB
1
25
VIO-1
-
mV
2, 3
125, -55
VIO-1
-
mV
1
25
VIO+1
-
mV
2, 3
125, -55
VIO+1
-
mV
VOUT = -10V
VOUT = +10V
VOUT = 0V, IOUT = 0mA
VOUT = 0V, IOUT = 0mA
∆VSUP = 10V, V+ = +20V,
V- = -15V, V+ = +10V, V- = -15V
∆VSUP = 10V, V+ = +15V,
V- = -20V, V+ = +15V, V- = -10V
Note 2
Note 2
NOTE:
2. Offset adjustment range is [VIO (Measured) ±1mV] minimum referred to output. This test is for functionality only to assure adjustment
through 0V.
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +3V/V, Unless Otherwise Specified.
PARAMETERS
Slew Rate
SYMBOL
+SR
-SR
Rise and Fall Time
tr
tf
Overshoot
+OS
-OS
CONDITIONS
GROUP A
SUBGROUPS
TEMP. (oC)
MIN
MAX
UNITS
7
25
135
-
V/µs
8A, 8B
125, -55
125
-
V/µs
7
25
135
-
V/µs
8A, 8B
125, -55
125
-
V/µs
7
25
-
45
ns
8A, 8B
125, -55
-
50
ns
7
25
-
45
ns
8A, 8B
125, -55
-
50
ns
7
25
-
40
%
8A, 8B
125, -55
-
40
%
7
25
-
40
%
8A, 8B
125, -55
-
40
%
VOUT = -5V to +5V
25% ≤ +SR ≤ 75%
VOUT = +5V to -5V
75% ≥ -SR ≥ 25%
VOUT = 0 to +200mV
10% ≤ tr ≤ 90%
VOUT = 0 to -200mV
10% ≤ tf ≤ 90%
VOUT = 0 to +200mV
VOUT = 0 to -200mV
Spec Number
3
511025-883
HA-2529/883
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Characterized at: VSUPPLY = ±15V, RLOAD = 2kΩ, CLOAD = 50pF, CCOMP = 0pF, Unless Otherwise Specified.
PARAMETERS
SYMBOL
Differential Input Resistance
RIN
NOTES
TEMP. (oC)
MIN
MAX
UNITS
VCM = 0V
3
25
50
-
MΩ
3
25
15
-
MHz
3, 4
25
2.1
-
MHz
CONDITIONS
Gain Power Bandwidth
GBWP
VO = 200mV, fO ≥ 10kHz
Full Power Bandwidth
FPBW
VPEAK = 10V
Minimum Closed Loop
Stable Gain
CLSG
RL = 2kΩ, CL = 50pF
3
-55 to 125
±3
-
V/V
Output Resistance
ROUT
Open Loop
3
25
-
60
Ω
3, 5
-55 to 125
-
210
mW
Power Consumption
PC
VOUT = 0V, IOUT = 0mA
NOTES:
3. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These parameters are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization
based upon data from multiple production runs which reflect lot to lot and within lot variation.
4. Full Power Bandwidth guarantee based on Slew Rate measurement using FPBW = Slew Rate/(2πVPEAK).
5. Quiescent Power Consumption based upon Quiescent Supply Current test maximum. (No load on outputs.)
TABLE 4. ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
SUBGROUPS (SEE TABLES 1 AND 2)
Interim Electrical Parameters (Pre Burn-In)
1
Final Electrical Test Parameters
1 (Note 6), 2, 3, 4, 5, 6, 7, 8A, 8B
Group A Test Requirements
1, 2, 3, 4, 5, 6, 7, 8A, 8B
Groups C and D Endpoints
1
NOTE:
6. PDA applies to Subgroup 1 only.
Spec Number
4
511025-883
HA-2529/883
Die Characteristics
DIE DIMENSIONS:
WORST CASE CURRENT DENSITY:
0.78 x 105 A/cm2
67 mils x 57 mils x 19 mils
1700µm x 1440µm x 483µm
SUBSTRATE POTENTIAL (Powered Up):
METALLIZATION:
Unbiased
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
TRANSISTOR COUNT: 40
PROCESS: Bipolar Dielectric Isolation
GLASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
Metallization Mask Layout
HA-2529/883
COMP
V+
OUT
BAL
-IN
+IN
BAL
V-
Spec Number
5
511025-883
HA-2529/883
Test Circuit
(Applies to Tables 1 and 2)
667
1.33K
ACOUT
0.1
100K
S7
3
S3A
S1
2
1
-
1
OPEN 2
S2
1
S5A
S6
1
OPEN 2
100K 2
100
50K
OPEN
1
NOTE: Includes stray
capacitances
2
1
S5B
+
2
For loop stability, use min value
capacitor to prevent oscillation
500K
2
DUT
OPEN 1
-
S8
2
3
OPEN
1
-
+
S9
+
-1
2
S3B
BUFFER
V2
2K
1
OPEN
100
V1
1
1 OPEN
2
-1/10
50pF
(NOTE)
V+
0.1
VAC
1
50
10K
VEOUT
x2
5K
2
S4
ALL RESISTORS = ±1% (Ω)
ALL CAPACITORS = ±10% (µF)
1
50K
Test Circuits and Waveforms
+1.67V
INPUT
-67mV
0mV
90%
OUTPUT
-5V
0
67mV
INPUT
-1.67V
+5V
OVERSHOOT
∆V
10%
∆t
SLEW
RATE
= ∆V/∆t
+200mV
90%
OUTPUT
10%
0V
ERROR BAND
±10mV FROM
FINAL VALUE
SETTLING
TIME
RISE TIME
NOTE:
Measured on both positive and negative transitions from 0V
to +200mV and 0V to -200mV at the output.
FIGURE 1. SLEW RATE AND SETTLING TIME
VIN
FIGURE 2. TRANSIENT RESPONSE
+
-
VOUT
1.33kΩ
50Ω
50pF
667Ω
FIGURE 3. SIMPLIFIED TEST CIRCUIT (APPLIES TO TABLE 2)
Spec Number
6
511025-883
Burn-In Circuits
HA7-2529/883 CERDIP
1
R1
8
2
-
3
+
D2
C3
6
4
V-
V+
7
D1
C1
5
C2
HA2-2529/883 METAL CAN
V+
C3
C1
8
1
7
+
2
6
5
3
4
R1
V-
NOTES:
R1 = 1MΩ, ±5%, 1/4W (Min)
C1 = C2 = 0.01µF/Socket (Min) or 0.1µF/Row (Min)
C3 = 0.01µF/Socket (10%)
D1 = D2 = 1N4002 or Equivalent/Board
|(V+) - (V-)| = 30V
7
C2
D2
D1
HA-2529/883
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
c1
F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A)
LEAD FINISH
8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
-D-
-A-
BASE
METAL
INCHES
(c)
E
b1
M
M
(b)
-Bbbb S
C A-B S
SECTION A-A
D S
D
BASE
PLANE
Q
-C-
SEATING
PLANE
A
α
L
S1
eA
A A
b2
b
ccc M
C A-B S
e
D S
eA/2
c
aaa M C A - B S D S
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.405
-
10.29
5
E
0.220
0.310
5.59
7.87
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
3.81 BSC
-
eA/2
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
MILLIMETERS
0.150 BSC
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
N
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
8
8
8
Rev. 0 4/94
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
Spec Number
8
511025-883
HA-2529/883
Metal Can Packages (Can)
T8.C MIL-STD-1835 MACY1-X8 (A1)
REFERENCE PLANE
A
8 LEAD METAL CAN PACKAGE
e1
L
L2
L1
INCHES
ØD2
A
A
k1
Øe
ØD ØD1
2
N
1
F
α
β
Øb1
Øb
k
C
L
BASE AND
SEATING PLANE
Q
BASE METAL
Øb1
LEAD FINISH
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between
L2 and 0.500 from the reference plane. Diameter is uncontrolled
in L1 and beyond 0.500 from the reference plane.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.165
0.185
4.19
4.70
-
Øb
0.016
0.019
0.41
0.48
1
Øb1
0.016
0.021
0.41
0.53
1
Øb2
0.016
0.024
0.41
0.61
-
ØD
0.335
0.375
8.51
9.40
-
ØD1
0.305
0.335
7.75
8.51
-
ØD2
0.110
0.160
2.79
4.06
-
e
0.200 BSC
5.08 BSC
-
e1
0.100 BSC
2.54 BSC
-
F
-
0.040
-
1.02
-
k
0.027
0.034
0.69
0.86
-
k1
0.027
0.045
0.69
1.14
2
L
0.500
0.750
12.70
19.05
1
L1
-
0.050
-
1.27
1
L2
0.250
-
6.35
-
1
Q
0.010
0.045
0.25
1.14
-
α
45o BSC
45o BSC
β
45o BSC
45o BSC
3
N
8
8
4
2. Measured from maximum diameter of the product.
3
Rev. 0 5/18/94
3. α is the basic spacing from the centerline of the tab to terminal 1
and β is the basic spacing of each lead or lead position (N -1
places) from α, looking at the bottom of the package.
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
6. Controlling dimension: INCH.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
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Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
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Taiwan Limited
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Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
Spec Number
9
511025-883