DF Package 12-Lead Plastic DFN (4mm × 4mm) (Reference LTC DWG # 05-08-1733 Rev A) 2.50 REF 0.70 ±0.05 3.38 ±0.05 4.50 ±0.05 3.10 ±0.05 2.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 (4 SIDES) 2.50 REF 7 12 0.40 ±0.10 3.38 ±0.10 2.65 ±0.10 PIN 1 NOTCH R = 0.20 TYP OR 0.35 × 45° CHAMFER PIN 1 TOP MARK (NOTE 6) 0.200 REF 6 R = 0.115 TYP 0.75 ±0.05 1 BOTTOM VIEW—EXPOSED PAD 0.00 – 0.05 NOTE: 1. PACKAGE OUTLINE DOES NOT CONFORM TO JEDEC MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (DF12) DFN 1112 REV A 0.25 ±0.05 0.50 BSC