05-08-1773

LGA Package
32-Lead (15mm × 11.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1773 Rev A)
SEE NOTES
DETAIL A
2.69 – 2.95
8
aaa Z
7
7
6
5
4
3
2
1
PAD 1
A
PAD “A1”
CORNER
B
4
C
D
E
15.00
BSC
12.70
BSC
MOLD
CAP
F
G
SUBSTRATE
H
0.290 – 0.350
2.400 – 2.600
J
Z
bbb Z
DETAIL B
K
L
X
aaa Z
11.25
BSC
Y
DETAIL B
PACKAGE TOP VIEW
0.630 ±0.025 Ø 32x
4.445
3.175
1.905
0.635
0.635
1.905
3.175
1.27
BSC
PADS
SEE NOTES
3
PACKAGE BOTTOM VIEW
0.630 ±0.025 Ø 32x
eee S X Y
4.445
8.89
BSC
eee S X Y
DETAIL c
DETAIL A
6.350
5.080
DETAIL C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
0.000
5. PRIMARY DATUM -Z- IS SEATING PLANE
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
6. THE TOTAL NUMBER OF PADS: 32
7
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.10
bbb
0.10
eee
0.05
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 32 0113 REV A
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