LGA Package 32-Lead (15mm × 11.25mm × 2.82mm) (Reference LTC DWG # 05-08-1773 Rev A) SEE NOTES DETAIL A 2.69 – 2.95 8 aaa Z 7 7 6 5 4 3 2 1 PAD 1 A PAD “A1” CORNER B 4 C D E 15.00 BSC 12.70 BSC MOLD CAP F G SUBSTRATE H 0.290 – 0.350 2.400 – 2.600 J Z bbb Z DETAIL B K L X aaa Z 11.25 BSC Y DETAIL B PACKAGE TOP VIEW 0.630 ±0.025 Ø 32x 4.445 3.175 1.905 0.635 0.635 1.905 3.175 1.27 BSC PADS SEE NOTES 3 PACKAGE BOTTOM VIEW 0.630 ±0.025 Ø 32x eee S X Y 4.445 8.89 BSC eee S X Y DETAIL c DETAIL A 6.350 5.080 DETAIL C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 5. PRIMARY DATUM -Z- IS SEATING PLANE COMPONENT PIN “A1” LTMXXXXXX µModule 6. THE TOTAL NUMBER OF PADS: 32 7 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.10 bbb 0.10 eee 0.05 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 32 0113 REV A