05-08-1838

LGA Package
32-Lead (11.25mm × 6.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1838 Rev A)
aaa Z
6.25
BSC
Y
PADS
SEE NOTES
2.72 – 2.92
X
SEE NOTES
DETAIL A
5.08
BSC
7
3
A
0.605 – 0.665
PAD 1
CORNER
MOLD
CAP
4
11.25
BSC
B
SUBSTRATE
C
D
8.89
BSC
0.27 – 0.37
2.45 – 2.55
E
Z
DETAIL B
bbb Z
DIA (0.635)
PAD 1
F
1.27
BSC
G
H
aaa Z
5
PACKAGE TOP VIEW
0.635 ±0.025 SQ. 31x
3
2
1
DETAIL B
2.540
1.270
0.3175
0.3175
1.270
2.540
0.000
eee S X Y
4
PACKAGE BOTTOM VIEW
4.445
DETAIL A
3.175
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
1.905
2.8575
3.4925
0.635
0.000
0.635
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
1.905
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
3.175
4.445
5. PRIMARY DATUM -Z- IS SEATING PLANE
SUGGESTED PCB LAYOUT
TOP VIEW
6. THE TOTAL NUMBER OF PADS: 32
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 32 0113 REV A
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