05-08-1805

LGA Package
35-Lead (11.25mm × 6.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1805 Rev B)
11.250
BSC
aaa Z
X
8.890
BSC
0.605 – 0.665
PADS
SEE NOTES
2.72 – 2.92
Y
SEE NOTES
7
3
5
4
0.605 – 0.665
MOLD
CAP
6.250
BSC
SUBSTRATE
Z
bbb Z
3
0.27 – 0.37
2.40 – 2.60
PAD 1
CORNER
5.080
BSC
DETAIL A
2
1.270
BSC
1
aaa Z
PACKAGE TOP VIEW
4
H
4.445
3.175
1.905
0.635
0.0000
0.635
1.905
3.175
4.445
DETAIL A
PACKAGE SIDE VIEW
G
F
E
D
C
B
A
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
2.540
1.270
0.0000
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
0.9525
1.270
1.5875
6. THE TOTAL NUMBER OF PADS: 35
7
0.9525
0.635
0.3175
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 35 0113 REV B
PAD 1
C (0.30)
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