LGA Package 50-Lead (11.25mm × 9.00mm × 2.82mm) aaa Z (Reference LTC DWG # 05-08-1804 Rev C) 11.25 BSC X 8.89 BSC 2.72 – 2.92 Y SEE NOTES 7 0.605 – 0.665 7 6 0.605 – 0.665 MOLD CAP 9.00 BSC SUBSTRATE 5 7.62 BSC 4 0.27 – 0.37 3 bbb Z PAD 1 CORNER 4 Z 2.45 – 2.55 2 DETAIL A 1.27 BSC 1 aaa Z PACKAGE TOP VIEW PADS SEE NOTES 4.445 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 DETAIL A PACKAGE SIDE VIEW 3 H G F E D C B A PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3.810 2.540 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.3175 LTMXXXXXX µModule 6. THE TOTAL NUMBER OF PADS: 50 0.3175 7 1.270 2.540 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 0.3175 0.9525 3.810 0.635 0.000 SUGGESTED PCB LAYOUT TOP VIEW TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 50 0113 REV C C(0.30) PAD 1