05-08-1810

LGA Package
66-Lead (15mm × 9mm × 4.32mm)
aaa Z
(Reference LTC DWG # 05-08-1810 Rev B)
12.700
BSC
15.000
BSC
X
Y
DETAIL A
0.605 – 0.665
4.22 – 4.42
7
MOLD
CAP
6
SUBSTRATE
0.605 – 0.665
0.27 – 0.37
3.95 – 4.05
7.620
BSC
DETAIL B
4
Z
bbb Z
9.000
BSC
5
3
PAD 1
CORNER
2
1.270
BSC
4
1
aaa Z
DETAIL B
PACKAGE TOP VIEW
0.635 ±0.025 SQ. 66x
PADS
SEE NOTES
J
H
G
F
E
D
C
PACKAGE BOTTOM VIEW
3
DETAIL A
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2.540
1.270
K
6.350
5.080
3.810
2.540
0.9525
1.270
1.5875
0.000
1.270
2.540
3.810
5.080
6.350
eee S X Y
L
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.5875
0.9525
0.000
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
1.270
5. PRIMARY DATUM -Z- IS SEATING PLANE
2.540
6. THE TOTAL NUMBER OF PADS: 66
7
3.810
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
LTMXXXXXX
µModule
COMPONENT
PIN 1
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 66 0113 REV B
B
A
PAD 1
C (0.30)
SEE NOTES
7
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