05-08-1820

LGA Package
66-Lead (15mm × 9mm × 2.32mm)
(Reference LTC DWG # 05-08-1820 Rev A)
SEE NOTES
DETAIL A
2.19 – 2.45
G
aaa Z
7
F
E
D
C
B
A
PAD 1
1
PAD “A1”
CORNER
2
4
3
4
5
15.00
BSC
MOLD
CAP
12.70
BSC
SUBSTRATE
6
7
0.290 – 0.350
1.90 – 2.10
8
9
Z
// bbb Z
DETAIL B
10
11
0.630 ±0.025 SQ. 68x
X
aaa Z
9.00
BSC
eee S X Y
Y
7.620
BSC
DETAIL B
PADS
SEE NOTES
3
PACKAGE BOTTOM VIEW
3.810
2.540
1.270
0.000
1.270
2.540
3.810
0.315
0.315
PACKAGE TOP VIEW
1.27
BSC
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.350
2. ALL DIMENSIONS ARE IN MILLIMETERS
5.080
3.810
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
0.315
0.315
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 66
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 66 0113 REV A
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