05-08-1821

LGA Package
68-Lead (15mm × 9mm × 2.82mm)
(Reference LTC DWG # 05-08-1821 Rev A)
SEE NOTES
DETAIL A
2.72 – 2.92
G
aaa Z
7
F
E
D
C
B
A
PAD 1
1
PAD “A1”
CORNER
2
4
3
4
5
15.00
BSC
MOLD
CAP
12.70
BSC
SUBSTRATE
6
7
0.290 – 0.350
2.200 – 2.600
8
9
Z
// bbb Z
DETAIL B
10
11
0.630 ±0.025 SQ. 68x
X
aaa Z
9.00
BSC
eee S X Y
DETAIL B
3.810
2.540
1.270
0.000
1.270
2.540
PACKAGE TOP VIEW
3.810
7.620
BSC
Y
PADS
SEE NOTES
3
PACKAGE BOTTOM VIEW
DETAIL A
6.350
5.080
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
2.540
1.270
0.000
1.270
2.540
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 68
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
1.27
BSC
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 68 1212 REV A
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