05-08-1755

LGA Package
133-Lead (15mm × 15mm × 2.82mm)
(Reference LTC DWG # 05-08-1755 Rev A)
SEE NOTES
DETAIL A
aaa Z
15
BSC
X
2.72 – 2.92
Y
0.12 – 0.28
7
13.97
BSC
12
11
10
9
8
15
BSC
7
13.97
BSC
MOLD
CAP
SUBSTRATE
6
5
1.27
BSC
0.27 – 0.37
2.45 – 2.55
4
Z
bbb Z
DETAIL B
3
PAD 1
CORNER
2
4
1
aaa Z
PADS
SEE NOTES
PACKAGE TOP VIEW
K
J
H
G
F
E
D
C
B
A
PACKAGE BOTTOM VIEW
DETAIL B
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
eee S X Y
5.7150
L
3
0.630 ±0.025 SQ. 133x
6.9850
M
6.9850
5.7150
DETAIL A
4.4450
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.1750
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.9050
0.6350
0.0000
0.6350
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
1.9050
3.1750
5. PRIMARY DATUM -Z- IS SEATING PLANE
4.4450
6. THE TOTAL NUMBER OF PADS: 133
7
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.10
bbb
0.10
eee
0.05
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 133 0113 REV A
C(0.30)
PAD 1
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