DC8 Package 8-Lead Plastic DFN (2mm × 2mm) (Reference LTC DWG # 05-08-1719 Rev A) 0.70 ±0.05 2.55 ±0.05 1.15 ±0.05 0.64 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ± 0.05 0.45 BSC 1.37 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.05 TYP 2.00 ±0.10 (4 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6) R = 0.115 TYP 5 8 0.40 ± 0.10 0.64 ± 0.10 (2 SIDES) PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER (DC8) DFN 0106 REVØ 4 0.200 REF 1 0.23 ± 0.05 0.45 BSC 0.75 ±0.05 1.37 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE