05-08-1722

DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev Ø)
0.64 ±0.05
(2 SIDES)
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
6
0.40 ± 0.10
10
0.70 ±0.05
2.55 ±0.05
1.15 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
2.39 ±0.05
(2 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.64 ± 0.05
(2 SIDES)
5
0.25 ± 0.05
0 – 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
1
(DDB10) DFN 0905 REV Ø
0.50 BSC
2.39 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
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