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Dual Conductor, High Current Power Inductors
HALOGEN
HF
Pb
FREE
Flat-Pac™ FPT705 Series
Applications
• Designed specifically for use with Picor® Cool-Power®
ZVS-Buck Regulator Family (Picor part number Series
PI33xx and PI34xx)
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Description
Packaging
• Halogen free, lead free, RoHS compliant
• Supplied in tape-and reel packaging, 1400 parts per
13” diameter reel
• 125°C maximum total operating temperature
• 8.0 x 7.1 x 5.35mm maximum surface mount package
• Ferrite core material
• Dual conductor, two-turn construction
• Inductance range from 150nH to 300nH
Product Specifications
Part Number6
FPT705-150-R
FPT705-170-R
FPT705-190-R
FPT705-200-R
FPT705-230-R
FPT705-270-R
FPT705-300-R
OCL1 ±10% (nH)
150
170
190
200
230
270
300
FLL2 min. (nH)
135
153
171
180
207
243
270
1. Open Circuit Inductance (OCL) test parameters: 100kHz, 0.1Vrms,
0.0Adc @ 25°C (Pins 1-3, short 2-4).
2. Full Load Inductance (FLL) test parameters: 100kHz, 0.1Vrms,
Isat1 @ 25°C (Pins 1-3, short 2-4).
3. Irms: DC current for an approximate temperature rise of 40°C without core loss.
Derating is necessary for AC currents. PCB layout, trace thickness and width,
air-flow, and proximity of other heat-generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed
125°C under worst case operating conditions verified in the end application.
0812
BU-SB12618
Page 1 of 6
Irms3 (Amps)
13
Isat4 @ 25°C (Amps)
35
31
28
25
23
19
17
DCR5 (mΩ) @ 20°C
0.65 ± 0.15
4. Isat1: Peak current for approximately 2% rolloff at +25℃.
5. DCR Tested from Pins (1-2) and (3-4) @ 20°C.
6. Part Number Definition: FPT705-xxx-R
FPT705 = Product code and size
xxx= Inductance value in nH
“-R” Suffix = RoHS compliant
Data Sheet: 4451
Dimensions - mm
Top View
Bottom View
Side View
Recommended Pad Layout
Schematic
5.35
All soldering surfaces to be coplanar within 0.10 millimeters.
Part Marking:
• FPT705 (Product code and size)
• xxx = (Inductance=(Inductance value in nH)
• wwllyy= Date Code, R= Revision level
DCR is measured between
points "A" and point "B"
Packaging Information - mm
5.55
Section A-A
Direction of Feed
Supplied in tape and reel packaging, 1400 parts on a 13” diameter reel.
0812
BU-SB12618
Page 2 of 6
Data Sheet: 4451
Inductance Characteristics
FPT705-150-R
11 0 %
100%
90%
% of OCL
80%
70%
60%
50%
40%
30%
0
5
10
15
20
25
30
35
40
45
50
55
60
65
Idc (Amps)
FPT705-170-R
11 0 %
100%
90%
% of OCL
80%
70%
60%
50%
40%
30%
0
5
10
15
20
25
30
35
Idc (Amps)
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BU-SB12618
Page 3 of 6
Data Sheet: 4451
40
45
50
55
Inductance Characteristics
FPT705-190-R
11 0 %
100%
90%
% of OCL
80%
70%
60%
50%
40%
30%
0
5
10
15
20
25
30
35
40
45
50
Idc (Amps)
FPT705-200-R & -230-R
11 0 %
100%
90%
% of OCL
80%
70%
60%
50%
F P T705-200-R
40%
30%
F P T705-230-R
0
5
10
15
20
25
30
Idc (Amps)
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BU-SB12618
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Data Sheet: 4451
35
40
45
50
Inductance Characteristics
FPT705-270-R & -300-R
11 0 %
100%
90%
% of OCL
80%
70%
60%
50%
F P T705-270-R
40%
30%
F P T705-300-R
0
5
10
15
20
25
Idc (Amps)
0812
BU-SB12618
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Data Sheet: 4451
30
35
40
Solder Reflow Profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Temperature
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
25°C
ts
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document
are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user
with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit
distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once
a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
© 2012 Cooper Bussmann
w w w. c o o p e r b u s s m a n n . c o m
0812
BU-SB12618
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Data Sheet: 4451
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