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High Current, Low-Profile Power Inductors
FLAT-PAC™ FP0705 Series
Applications
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SMD Device
Portable electronics
Servers and workstations
Data networking and storage systems
Notebook and desktop computers
Graphics cards and battery power systems
Multi-phase regulators
Voltage Regulator Module (VRM)
DCR sensing
Environmental Data
Description
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125°C maximum total temperature operation
7.0 x 7.0 x 4.95mm surface mount package
Ferrite core material, High current carrying capacity
Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 72nH to 220nH
Current range from 20 to 65 Amps, frequency range up
to 2MHz
• RoHS compliant
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape-and-reel packaging, 950 parts per reel,
13” dia. reel
Product Specifications
Part Number
R1 Version
FP0705R1-R07-R
FP0705R1-R10-R
FP0705R1-R12-R
FP0705R1-R15-R
FP0705R1-R18-R
FP0705R1-R22-R
R2 Version
FP0705R2-R07-R
FP0705R2-R10-R
FP0705R2-R12-R
FP0705R2-R15-R
FP0705R2-R18-R
FP0705R2-R22-R
R3 Version
FP0705R3-R07-R
FP0705R3-R10-R
FP0705R3-R12-R
FP0705R3-R15-R
FP0705R3-R18-R
FP0705R3-R22-R
OCL1 ± 10% (nH) FLL2 Min. (nH)
72
105
120
150
180
220
51
75
86
108
130
158
72
105
120
150
180
220
51
75
86
108
130
158
72
105
120
150
180
220
51
75
86
108
130
158
Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mOhm)@20°C K-factor6
43
65
44
37
30
25
20
50
36
30
24
20
16
38
65
44
37
30
25
20
50
36
30
24
20
16
32
65
44
37
30
25
20
50
36
30
24
20
16
0.25 ± 10%
826
826
826
826
826
826
0.32 ± 9.4%
826
826
826
826
826
826
0.46 ± 6.5%
826
826
826
826
826
826
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0705Rx-Rxx-R
• FP0705 = Product code and size
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
05-05-08
BU-SB08210
Page 1 of 4
Data Sheet: 4325
Dimensions - mm
A = 7.0 Max.
Top View
B = 7.0 Max.
Side View
C = 4.95 Max.
D = 2.45 ± 0.2
Bottom View
Recommended Pad Layout
b
C
E = 1.52 ± 0.2
Schematic
3.1
B
1
2.0
E
0705Rx
Rxx
wwllyy R
F = 3.5 Typ.
A
1
3.3
F
2
2
Nominal DCR is measured from point “a” to point “b.”
Part Marking: Coiltronics Logo
0705Rx (Rx = DCR indicator)
D
a
Rxx = inductance value in μH (R = decimal point)
wwllyy = date code
R = revision level
Packaging Information - mm
2.0
1.5
dia.
4.0
1.75
A
7.5
1
0705Rx
Rxx
wwllyy R
6.5 7.1
16.00
±0.30
3.5
2
1.5
dia
12.0
A
B
7.1
B
5.1
SECTION A-A
SECTION B-B
User direction of feed
Supplied in tape-and-reel packaging, 950 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
Temperature Rise (°C)
80
60
40
20
0
0.0
0.2
0.4
0.6
0.8
1.0
Total Loss (W)
05-05-08
BU-SB08210
Page 2 of 4
Data Sheet: 4325
1.2
Inductance Characteristics
OCL vs. Isat1
100%
% of OCL
80%
60%
40%
+125°C
20%
+25°C
-40°C
0%
0%
20%
40%
60%
% of Isat1
80%
100%
120%
Core Loss
Core Loss vs. Bp-p
1MHz
10
500kHz
300kHz
1
200kHz
100kHz
Core Loss(W)
0.1
0.01
0.001
0.0001
0.00001
100
1000
10000
Bp-p (Gauss)
05-05-08
BU-SB08210
Page 3 of 4
Data Sheet: 4325
Solder Reflow Profile
TP
TC -5°C
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
Thickness
<2.5mm
_2.5mm
>
Temperature
TL
Preheat
A
T smax
25°C
Table 1 - Standard SnPb Solder (T c)
tP
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
w w w. c o o p e r b u s s m a n n . c o m
05-05-08
BU-SB08210
Page 4 of 4
Data Sheet: 4325
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