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High Current, Low-Profile Power Inductors
FLAT-PAC™ FP1105 Series
Applications
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SMD Device
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Description
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Multi-phase regulators
Voltage Regulator Module (VRM)
Portable electronics
Servers and workstations
Data networking and storage systems
Notebook and desktop computers
Graphics cards and battery power systems
DCR sensing
125°C maximum total temperature operation
11.0 x 8.0 x 4.90mm surface mount package
Ferrite core material
High current carrying capacity
Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 101nH to 226nH
Current range from 39 to 81Amps
Frequency range up to 2MHz
RoHS compliant
Packaging
• Supplied in tape and reel packaging, 900 parts per reel, 13” dia. reel
Product Specifications
Part Number
FP1105R1-R10-R
FP1105R1-R12-R
FP1105R1-R15-R
FP1105R1-R20-R
FP1105R1-R22-R
OCL1 ± 10% (nH) FLL2 Min. (nH)
100
72
120
86
150
109
192
138
226
163
Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
81
63
467
66
50
467
46
54
42
0.35 ± 8.6%
467
42
34
467
39
28
467
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1105Rx-Rxx-R
• FP1105 = Product code and size
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
05-05-08
BU-SB08211
Page 1 of 4
Data Sheet: 4324
Dimensions - mm
A = 11.0 Max.
B = 8.0 Max.
Top View
Left View
B
C
1
C = 4.9 Max.
D = 2.4 ± 0.2
Bottom View
Recommended Pad Layout
D
b
E = 2.3 ± 0.3
F = 6.2 Typ.
Schematic
2.8
E
1
2.8
1105Rx A
Rxx
wwllyy R
F
2
2
Nominal DCR is measured from point “a” to point “b.”
Part Marking: Coiltronics Logo
5.8
a
1105Rx (Rx = DCR indicator)
Rxx = inductance value in μH (R = decimal point)
wwllyy = date code
R = revision level
Packaging Information - mm
1.5 dia
1.5 dia
4.0
A
2.0
1.75
SECTION A-A
1
11.5
24.0
+/-0.3
1105Rx
Rxx
wwllyy R
11.3
2
A
12.0
8.2
Supplied in tape-and-reel packaging, 900 parts per reel, 13” diameter reel.
5.2
User direction of feed
Temperature Rise vs.Total Loss
50
Temperature rise(°C )
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Total loss (W)
05-05-08
BU-SB08211
Page 2 of 4
Data Sheet: 4324
1.6
Inductance Characteristics
OCL vs. I sat1
100%
% of OCL
80%
60%
40%
+125°C
20%
+25°C
-40°C
0%
0%
20%
40%
60%
% of I sat1
80%
100%
120%
Core Loss
Core Loss vs. B p-p
1MHz
10
500kHz
300kHz
200kHz
Core Loss (W)
1
100kHz
0.1
0.01
0.001
0.0001
100
1000
10000
Bp-p (Gauss)
05-05-08
BU-SB08211
Page 3 of 4
Data Sheet: 4324
Solder Reflow Profile
TP
TC -5°C
Package
Thickness
<2.5mm
_2.5mm
>
Temperature
TL
Preheat
A
T smax
25°C
Table 1 - Standard SnPb Solder (T c)
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
w w w. c o o p e r b u s s m a n n . c o m
05-05-08
BU-SB08211
Page 4 of 4
Data Sheet: 4324
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