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Technical Data 4430
Effective June 2014
Supersedes November 2011
Coiltronics HCM0503 Series
High current power inductors
Applications
•
Voltage Regulator Module (VRM)
•
Multi-phase regulators
•
Point-of-load modules
•
Desktop and server VRMs and EVRDs
•
Base station equipment
•
Notebook regulators
•
Battery power systems
•
Graphics cards
•
Data networking and storage systems
Environmental data
Product description
•
High current carrying capacity
•
Low core losses
•
Magnetically shielded, low EMI
•
Frequency range up to 1MHz
•
Inductance range from 0.20µH to 15µH
•
Current range from 2.1A to 22.2A
•
5.5 x 5.3mm footprint surface mount
package in a 3mm height
•
Powder Iron core material
•
Halogen free, lead free, RoHS compliant
•
Storage temperature range (Component):
-55°C to +125°C
•
Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
HALOGEN
Pb HF
FREE
The Coiltronics brand of
magnetics (formerly of
the Bussmann Division of
Cooper Industries)
is now part of
Eaton’s Electrical Group,
Electronics Division.
Coiltronics is now
part of Eaton
Same great
products plus
even more.
155
Technical Data 4430
Effective June 2014
HCM0503 Series
High current, power inductors
Product specifications
OCL 1
(μH) ± 20%
FLL min.2
(μH)
Irms 3
(Amps)
Isat 4
(Amps)
DCR (mΩ)
@ 20°C (Typ.)
DCR (mΩ)
@ 20°C (Max.)
K-factor5
HCM0503-R20-R
0.20
0.128
22.2
21.0
2.10
2.31
1764
HCM0503-R35-R
0.35
0.224
16.6
14.9
3.90
4.29
1259
HCM0503-R47-R
0.47
0.300
12.0
11.5
6.50
7.15
820
HCM0503-R75-R
0.75
0.480
11.3
9.7
8.50
9.35
801
HCM0503-1R0-R
1.00
0.640
10.1
8.5
10.4
11.4
588
HCM0503-1R5-R
1.50
0.960
7.5
7.0
17.1
18.5
393
HCM0503-2R2-R
2.20
1.40
6.8
6.5
22.5
25.0
325
HCM0503-3R3-R
3.30
2.10
5.5
6.0
36.4
40.4
273
HCM0503-4R7-R
4.70
3.00
4.5
5.5
54.0
60.0
226
HCM0503-5R6-R
5.60
3.60
4.3
3.5
63.0
70.6
206
HCM0503-100-R
10.0
6.40
2.8
2.3
122
132
158
HCM0503-150-R
15.0
9.60
2.4
2.1
138
166
127
Part Number6
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc,
+25°C.
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat, @ +25°C.
3. Irms: DC current for an approximate temperature rise of 40°C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed 125°C under worst case operating conditions verified in the end
application.
2
4. Isat: Peak current for approximately 20% rolloff at +25°C.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I.
Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM0503-yyy-R
- HCM0503 = Product code and size
- yyy= Inductance value in µH, R = decimal point,
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
www.eaton.com/elx
156
HCM0503 Series
High current, power inductors
Technical Data 4430
Effective June 2014
Dimensions - mm
Part marking: xxx= Inductance value in uH, R= decimal point, If no R is present then last
digit is # of zeroes
wly= Date code, R= Revision level
All soldering surfaces to be coplanar within 0.10 millimeters
Tolerances are +/- 0.2 millimeters unless stated otherwise
Color: Grey
Packaging information - mm
4.0
1.5 dia.
2.0
1.5 dia.
1.75
7.5
16.0 ±0.3
5.7 5.2
2.0
2.9
3.2
SECTION A — A
5.4
Supplied in tape and reel packaging, 2000 parts per 13” diameter reel.
8.0
User direction of feed
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3
157
Technical Data 4430
Effective June 2014
HCM0503 Series
High current, power inductors
Temperature rise vs. total loss
50
Temperature Rise (ºC)
40
30
20
10
0
Core loss
0.0
0.1
0.2
0.3
0.4
0.5
Total Loss (W)
Core Loss vs B
10000.0
0.6
0.8
0.9
1.0
p-p
500kHz
300kHz
200kHz
100kHz
50kHz
1000.0
Core Loss (mW)
0.7
100.0
25kHz
10.0
1.0
0.1
4
100
1000
B p-p (Gauss)
10000
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158
HCM0503 Series
High current, power inductors
Technical Data 4430
Effective June 2014
Inductance characteristics
HCM0503-R35-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM0503-R20-R
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30
0
2
4
6
8
Idc (Amps)
Idc(Amps)
HCM0503-R47-R
HCM0503-R75-R
110%
110%
100%
100%
90%
80%
% of OCL
% of OCL
90%
70%
60%
80%
70%
60%
50%
50%
40%
0
2
4
6
8
10
12
14
16
18
20
22
40%
24
0
2
4
6
8
Idc (Amps)
10
12
14
16
18
20
Idc (Amps)
HCM0503-1R0-R
HCM0503-1R5-R
110%
110%
100%
100%
90%
90%
80%
% of OCL
% of OCL
10 12 14 16 18 20 22 24 26
70%
60%
80%
70%
60%
50%
50%
40%
0
2
4
6
8
Idc (Amps)
10
12
14
16
40%
0
2
4
6
8
10
12
Idc (Amps)
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5
159
Technical Data 4430
Effective June 2014
HCM0503 Series
High current, power inductors
Inductance characteristics
HCM0503-3R3-R
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM0503-2R2-R
110%
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
1
2
3
4
5
6
7
8
9
10
11
12
0
1
2
3
4
Idc(Amps)
100%
100%
90%
90%
80%
70%
50%
50%
40%
3
4
5
6
7
8
9
9
10
11
9
40%
10
0
1
2
3
Idc (Amps)
4
5
6
7
8
3.5
4.0
4.5
Idc (Amps)
HCM0503-100-R
HCM0503-150-R
110%
110%
100%
100%
90%
% of OCL
90%
% of OCL
8
70%
60%
2
7
80%
60%
1
6
HCM0503-5R6-R
110%
% of OCL
% of OCL
HCM0503-4R7-R
110%
0
5
Idc (Amps)
80%
70%
80%
70%
60%
60%
50%
50%
40%
0.0
40%
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Idc(Amps)
6
3.5
4.0
4.5
5.0
0.5
1.0
1.5
2.0
2.5
3.0
5.0
Idc (Amps)
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160
HCM0503 Series
High current, power inductors
Technical Data 4430
Effective June 2014
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
25°C
T smax
Volume
mm3
<350
235°C
220°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Eaton’s Electrical Group
Electronics Division
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Eaton’s Electrical Group
Electronics Division
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Eaton’s Electrical Group
Electronics Division
Burton-on-the-Wolds
Leicestershire, LE 12 5th UK
Phone: +44 (0) 1509 882 600
Fax: +44 (0) 1509 882 786
Eaton’s Electrical Group
Electronics Division
Avda Santa Eulalia, 290
Terrassa, Barcelona 08223 Spain
Phone: +34-93-736-2813
Fax: +34-93-783-5055
Asia Pacific
Eaton’s Electrical Group
Electronics Division
No.2, #06-01
Serangoon North Avenue 5
Singapore 554911
Tel: +65 6645 9888
Fax: +65 6728 3155
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Eaton’s Electrical Group
Electronics Division
114 Old State Road
Ellisville, MO 63021
United States
www.eaton.com/elx
© 2014 Eaton
All Rights Reserved
Publication No. 4430 — BU-SB14454
June 2014
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
www.eaton.com/elx
7
161
Technical Data 4085
Effective June 2014
Supersedes September, 2010
Coiltronics HCM0703 Series
High current power inductors
Applications
•
Voltage Regulator Module (VRM)
•
Multi-phase regulators
•
Point-of-load modules
•
Desktop and server VRMs and EVRDs
•
Base station equipment
•
Notebook regulators
•
Battery power systems
•
Graphics cards
•
Data networking and storage systems
Environmental data
Product description
•
High current carrying capacity
•
Low core losses
•
Magnetically shielded, low EMI
•
Frequency range up to 5MHz
•
Inductance range from 0.15μH to 33μH
•
Current range from 1.8A to 52A
•
7.4x7.0mm footprint surface mount
package in a 3.0mm height
•
Powder iron core material
•
Halogen free, lead free, RoHS compliant
•
Storage temperature range (Component):
-55°C to +125°C
•
Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
HALOGEN
Pb HF
FREE
The Coiltronics brand of
magnetics (formerly of
the Bussmann Division of
Cooper Industries)
is now part of
Eaton’s Electrical Group,
Electronics Division.
Coiltronics is now
part of Eaton
Same great
products plus
even more.
162
Technical Data 4085
Effective June 2014
HCM0703 Series
High current, power inductors
Product specifications
Part Number6
OCL1
(μH) ±20%
FLL min.2
(μH)
Irms3
(amps)
Isat4
(amps)
DCR (mΩ)
@ 20°C
Typical
DCR (mΩ)
@ 20°C
Maximum
K-factor5
HCM0703-R15-R
0.15
0.09
26.0
52.0
1.90
2.50
1044
HCM0703-R22-R
0.22
0.13
23.0
40.0
2.50
2.80
986
HCM0703-R47-R
0.47
0.28
17.5
26.0
4.00
4.20
580
HCM0703-R68-R
0.68
0.41
15.5
25.0
5.00
5.50
455
HCM0703-R82-R
0.82
0.49
13.0
24.0
6.70
8.00
439
HCM0703-1R0-R
1.00
0.60
11.0
22.0
9.00
10.0
374
HCM0703-1R5-R
1.50
0.90
9.00
18.0
14.0
15.0
366
HCM0703-2R2-R
2.20
1.32
8.00
14.0
18.0
20.0
281
HCM0703-3R3-R
3.30
1.98
6.00
13.5
28.0
30.0
252
HCM0703-4R7-R
4.70
2.82
5.50
10.0
37.0
40.0
210
HCM0703-6R8-R
6.80
4.08
4.50
8.00
54.0
60.0
151
HCM0703-8R2-R
8.20
4.92
4.00
7.50
64.0
68.0
142
HCM0703-100-R
10.0
6.00
3.20
7.00
70.5
77.6
132
HCM0703-330-R
33.0
19.8
1.80
2.00
220
242
76
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc,
+25°C.
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat, @ +25°C.
3. Irms: DC current for an approximate temperature rise of 40°C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed 125°C under worst case operating conditions verified in the end
application.
4. Isat: Peak current for approximately 20% rolloff at +25°C.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I.
Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM0703-yyy-R
- HCM0703 = Product code and size
- yyy= Inductance value in μH, R = decimal point,
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
Dimensions - mm
Part marking: xxx= Inductance value in uH, R= decimal point, If no R is present then last
digit is # of zeroes
wly= Date code, R= Revision level
All soldering surfaces to be coplanar within 0.10 millimeters
Tolerances are ±0.3 millimeters unless stated otherwise.
Color: Grey
2
www.eaton.com/elx
163
HCM0703 Series
High current, power inductors
Technical Data 4085
Effective June 2014
Packaging information - mm
Supplied in tape and reel packaging, 1500 parts per 13” diameter reel.
Temperature rise vs. total loss
50.0
Temperature Rise (˚C)
40.0
30.0
20.0
10.0
0.0
0.0
0.2
0.4
0.6
Total Loss (W)
0.8
1.0
1.2
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3
164
Technical Data 4085
Effective June 2014
HCM0703 Series
High current, power inductors
Core loss
Core Loss vs. Bp-p
10000
1MHz
500KHz
300KHz
200KHz
100KHz
Core Loss (mW)
1000
100
10
1
0.1
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
HCM0703-R15
110%
90%
90%
% of OCL
100%
% of OCL
100%
80%
70%
60%
70%
50%
0
10
20
30
40
Idc (Amps)
4
80%
60%
50%
40%
HCM0703-R22-R
110%
50
60
70
40%
0
10
20
30
40
Idc (Amps)
50
60
70
www.eaton.com/elx
165
HCM0703 Series
High current, power inductors
Technical Data 4085
Effective June 2014
Inductance characteristics
HCM0703-R47-R
110%
90%
90%
% of OCL
100%
% of OCL
100%
80%
70%
80%
70%
60%
60%
50%
50%
40%
0
5
10
15
20
25
30
35
Idc (Amps)
40
45
40%
50
HCM0703-R82-R
110%
90%
90%
% of OCL
100%
% of OCL
0
80%
70%
15
20
25
Idc (Amps)
30
35
40
45
HCM0703-1R0-R
80%
70%
50%
50%
40%
0
5
10
15
20
25
Idc (Amps)
30
35
40
45
HCM0703-1R5-R
110%
0
90%
90%
% of OCL
100%
80%
70%
50%
50%
10
15
20
Idc (Amps)
25
30
35
15
20
Idc (Amps)
25
30
35
40
HCM0703-2R2-R
70%
60%
5
10
80%
60%
0
5
110%
100%
% of OCL
10
60%
60%
40%
5
110%
100%
40%
HCM0703-R68-R
110%
40%
0
5
10
15
Idc (Amps)
20
www.eaton.com/elx
25
30
5
166
Technical Data 4085
Effective June 2014
HCM0703 Series
High current, power inductors
Inductance characteristics
HCM0703-3R3-R
110%
90%
90%
% of OCL
100%
% of OCL
100%
80%
70%
70%
60%
50%
50%
0
2
4
6
8
10
12
Idc (Amps)
14
16
18
40%
20
HCM0703-6R8-R
110%
90%
4
6
8
10
12
14
Idc (Amps)
16
18
20
HCM0703-8R2-R
80%
80%
70%
70%
60%
60%
50%
50%
0
2
4
6
8
Idc (Amps)
10
12
40%
14
HCM0703-100-R
110%
90%
90%
% of OCL
100%
80%
70%
50%
50%
4
6
8
Idc (Amps)
4
10
12
14
6
8
10
Idc (Amps)
12
14
HCM0703-330-R
70%
60%
2
2
80%
60%
0
0
110%
100%
% of OCL
2
% of OCL
90%
% of OCL
100%
40%
0
110%
100%
40%
6
80%
60%
40%
HCM0703-4R7-R
110%
40%
0
1
2
3
Idc (Amps)
4
5
6
www.eaton.com/elx
167
HCM0703 Series
High current, power inductors
Technical Data 4085
Effective June 2014
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
25°C
Preheat
A
Volume
mm3
<350
235°C
220°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
_
>350
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Eaton’s Electrical Group
Electronics Division
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Eaton’s Electrical Group
Electronics Division
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Eaton’s Electrical Group
Electronics Division
Burton-on-the-Wolds
Leicestershire, LE 12 5th UK
Phone: +44 (0) 1509 882 600
Fax: +44 (0) 1509 882 786
Eaton’s Electrical Group
Electronics Division
Avda Santa Eulalia, 290
Terrassa, Barcelona 08223 Spain
Phone: +34-93-736-2813
Fax: +34-93-783-5055
Asia Pacific
Eaton’s Electrical Group
Electronics Division
No.2, #06-01
Serangoon North Avenue 5
Singapore 554911
Tel: +65 6645 9888
Fax: +65 6728 3155
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Eaton’s Electrical Group
Electronics Division
114 Old State Road
Ellisville, MO 63021
United States
www.eaton.com/elx
© 2014 Eaton
All Rights Reserved
Publication No. 4085 — BU-SB14460
June 2014
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
www.eaton.com/elx
7
168
High Current, High Frequency Power Inductors
HALOGEN
HF
Pb
FREE
HCM1103 Series
Applications
• Voltage Regulator Module (VRM)
• Multi-phase regulators
• Point-of-load modules
• Desktop and server VRMs and EVRDs
• Base station equipment
• Notebook regulators
• Battery power systems
• Graphics cards
Description
• Data networking and storage systems
• Halogen free, lead free, RoHS compliant
Environmental Data
• 125°C maximum total temperature operation
• Storage temperature range: -55°C to +125 °C
• 11.5 x 10.3 x 3.0mm maximum surface mount package
• Powder Iron core material
• Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
• Magnetically shielded, low EMI
• Solder reflow temperature: J-STD-020D compliant
• High current carrying capacity, low core losses
Packaging
• Inductance range from 0.12µH to 22.0µH
• Supplied in tape-and reel packaging, 1000 parts per 13”
diameter reel
• Current range from 3.0 to 75 amps
Product Specifications
Part
Number6
HCM1103-R12-R
HCM1103-R36-R
HCM1103-R47-R
HCM1103-R68-R
HCM1103-1R0-R
HCM1103-2R2-R
HCM1103-3R3-R
HCM1103-4R7-R
HCM1103-8R2-R
HCM1103-100-R
HCM1103-150-R
HCM1103-220-R
OCL1
±20% (µH)
0.12
0.36
0.47
0.68
1.0
2.2
3.3
4.7
8.2
10.0
15.0
22.0
FLL min.2
(µH)
0.07
0.26
0.33
0.38
0.56
1.2
1.9
2.6
4.6
5.6
8.4
12.3
Irms3
(Amps)
30
23
20
21
15
13
9.0
7.0
5.0
5.0
4.0
3.0
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc @
25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ 25°C.
3. Irms: DC current for an approximate temperature rise of 40°C without core loss.
Derating is necessary for AC currents. PCB layout, trace thickness and width,
air-flow and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not
exceed 125°C under worst case operating conditions verified in the end
application.
0612
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Page 1 of 9
Isat4 @ 25°C
(Amps)
75
28
26
23
21
16
14
13
8.5
7.5
6.0
5.0
DCR (mΩ) @ 20°C DCR (mΩ) @ 20°C
Typical
Maximum
0.55
0.61
1.10
1.30
1.50
2.00
2.90
3.40
5.50
6.00
8.40
9.00
14.5
16.0
20.5
22.5
35.0
38.5
40.0
44.0
59.0
65.0
90.0
99.0
K-Factor5
1200
711
515
510
377
264
230
205
153
141
114
91
4. Isat: Peak current for approximately 30% rolloff at +25°C
5. K-factor: Used to determine Bp-p for core loss (see graph).
Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table),
L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps).
6. Part Number Definition: HCM1103-xxx-R
HCM1103 = Product code and size
xxx= Inductance value in µH, R = decimal point,
if no R is present then third character = number of zeros.
-R suffix = RoHS compliant
Data Sheet: 4449
169
Dimensions - mm
Top View
HCM1103-R36-R &
HCM1103-R47-R
Top View
HCM1103-R12-R &
HCM1103-R68-R to
HCM1103-220R
Side View
Bottom View
Recommended Pad Layout
Schematic
Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros.
wwyy = (Date code), R = Revision Level
All soldering surfaces to be coplanar within 0.10 millimeters.
Tolerances are ±0.3 millimeters unless stated otherwise.
HCM1103-R36-R and HCM1103-R47-R Color: Black
HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey
Packaging Information - mm
1000 Pieces supplied in tape and reel packaging, on a 13” diameter reel.
0612
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Data Sheet: 4449
170
Temperature Rise vs. Total Loss
6 0 .0
Temperature Rise (°C)
5 0 .0
4 0 .0
HCM1103-R12-R
HCM1103-R36-R
HCM1103-R47-R
3 0 .0
HCM1103-R68-R
HCM1103-1R0-R
HCM1103-2R2-R
HCM1103-3R3-R
2 0 .0
HCM1103-4R7-R
HCM1103-8R2-R
HCM1103-100-R
HCM1103-150-R
1 0 .0
HCM1103-220-R
0 .0
0 .0
0 .2
0 .4
0 .6
0 .8
1 .0
1 .2
1 .4
1 .6
Total Loss (W)
0612
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Data Sheet: 4449
171
Core Loss
HCM1103-; R36-R and R47-R
Core Loss vs Bp-p
10000
300K
1000
200K
100K
Core Loss (mW)
50K
100
25K
10
1
0.1
10
100
1000
10000
Bp-p (Gauss)
HCM1103-; R12-R, R68-R through 220-R
Core Loss vs Bp-p
10000.0
500K
300K
200K
1000.0
100K
Core Loss (mW)
50K
25K
100.0
10.0
1.0
0.1
10
100
1000
10000
Bp-p (Gauss)
0612
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Data Sheet: 4449
172
Inductance Characteristics
HCM1103- R12-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
40%
30%
0
10
20
30
40
50
60
70
80
Idc (Amps)
HCM1103-; R36-R, R47-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
HCM1103-R36-R
40%
30%
HCM1103-R47-R
0
5
10
15
20
25
30
35
40
45
Idc (Amps)
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Data Sheet: 4449
173
Inductance Characteristics
HCM1103-; R68-R, 1R0-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
HCM1103-R68-R
40%
HCM1103-1R0-R
30%
0
5
10
15
20
25
30
Idc (Amps)
35
40
HCM1103-; 2R2-R, 3R3-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
HCM1103-2R2-R
40%
HCM1103-3R3-R
30%
0
2
4
6
8
10
12
14
16
18
20
22
24
26
Idc (Amps)
0612
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Page 6 of 9
Data Sheet: 4449
174
Inductance Characteristics
HCM1103-4R7-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
40%
30%
0
2
4
6
8
10
12
14
16
18
Idc (Amps)
HCM1103-; 8R2-R, 100-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
HCM1103-8R2-R
40%
30%
HCM1103-100-R
0
2
4
6
8
10
12
14
Idc (Amps)
0612
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Page 7 of 9
Data Sheet: 4449
175
Inductance Characteristics
HCM1103-;150-R, 220-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
HCM1103-150-R
40%
30%
HCM1103-220-R
0
2
4
6
8
10
12
Idc (Amps)
0612
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Page 8 of 9
Data Sheet: 4449
176
Solder Reflow Profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Temperature
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
25°C
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Lead (Pb) Free Solder
150°C
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document
are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user
with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit
distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once
a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
© 2012 Cooper Bussmann
w w w. c o o p e r b u s s m a n n . c o m
0612
BU-SB12434
Page 9 of 9
Data Sheet: 4449
177
High Current Power Inductors
HALOGEN
HF
Pb
FREE
HCM1104 Series
Applications
SMD Device
•
•
•
•
•
•
•
•
•
Description
•
•
•
•
•
•
•
•
•
Halogen free, lead free, RoHS compliant
125°C maximum total operating temperature
11.5x 10.3 x 4.0mm maximum surface mount package
Powder Iron core material
Magnetically shielded, low EMI
High current carrying capacity, low core losses
Inductance range 0.20µH to 10.0µH
Current range from 7.5 to 45 Amps
Frequency range up to 5MHz
Voltage Regulator Module (VRM)
Multi-phase regulators
Point-of-load modules
Desktop and server VRMs and EVRDs
Base station equipment
Notebook regulators
Battery power systems
Graphics cards
Data networking and storage systems
Environmental Data
• Storage temperature range: -55°C to +125°C
• Operating temperature range: -55°C to +125°C
(ambient plus self temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 850 parts per 13” reel
Product Specifications
Part
Number7
HCM1104-R20-R
HCM1104-R36-R
HCM1104-R45-R
HCM1104-R56-R
HCM1104-R90-R
HCM1104-1R0-R
HCM1104-1R5-R
HCM1104-2R2-R
HCM1104-3R3-R
HCM1104-4R7-R
HCM1104-100-R
1.
2.
3.
OCL1
± 20% (mH)
0.20
0.36
0.45
0.56
0.90
1.0
1.5
2.2
3.3
4.7
10.0
FLL2 Min
(mH)
0.13
0.23
0.29
0.36
0.58
0.56
0.84
1.23
1.85
2.63
5.60
Irms3
(Amps)
32
30
29
25
22
18
16
12
10
8.5
7.5
Isat4, 5
@25°C (Amps)
45
42
36
32
28
28
32
18
16
15
8.5
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc @ 25°C.
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ 25°C.
Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
0312
BU-SB12258
Page 1 of 6
DCR (mW)
@20°C Nominal
0.63
1.04
1.07
1.56
2.17
3.00
3.80
6.00
10.8
17.0
27.0
DCR (mW)
@20°C Maximum
0.72
1.20
1.23
1.80
2.50
3.30
4.20
7.00
11.8
20.0
30.0
K-factor6
411
269
219
230
236
378
310
253
220
175
116
4.
5.
6.
Isat: Peak current for approx. 20% rolloff at +25°C - HCM1104-R20-R to HCM1104-R90-R.
Isat: Peak current for approx. 30% rolloff at +25°C - HCM1104-1R0-R to HCM 1104-100-R.
K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * DI. Bp-p:
(Gauss), K: (K-factor from table), L: (Inductance in mH), DI (Peak-to-peak ripple current in Amps).
7. Part Number Definition: HCM1104-xxx-R
- HCM1104 = Product code and size
- xxx= Inductance value in mH, R = decimal point
- “-R” suffix = RoHS compliant
Data Sheet: 4370
178
Dimensions - mm
Part marking: xxx = Inductance value in µH, R = decimal point, if no R is present, third character = # of zeros. wwyy = (date Code) R = (Revision Level)
All soldering surfaces to be coplanar within 0.10 millimeters.
Tolerances are ±0.3 millimeters unless stated otherwise.
HCM1104-R20-R to HCM1104-R90-R Color: Black
HCM1104-1R0-R to HCM1104-100-R Color: Grey
Packaging Information - mm
A
Supplied in tape and reel packaging, 850 parts per 13” diameter reel.
Temperature Rise vs. Total Loss
6 0 .0
HCM1104-1R0-R
HCM1104-3R3-R
5 0 .0
HCM1104-100-R
Temperature Rise ( °C )
HCM1104-R20 thru R90-R
4 0 .0
3 0 .0
2 0 .0
1 0 .0
0 .0
0 .0
0 .2
0 .4
0 .6
0 .8
1 .0
1 .2
1 .4
1 .6
1 .8
2 .0
Total Loss (W)
0312
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Data Sheet: 4370
179
Core Loss - HCM1104-R20-R Through HCM1104-R90-R
Core Loss vs. Bp-p
Core Loss - HCM1104-1R0-R Through HCM1104-100-R
Core Loss vs Bp-p
10000
500K
300K
200K
100K
1000
Core Loss (mW)
50K
25K
100
10
1
0 .1
10
100
1000
10000
Bp-p(Gauss)
0312
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Data Sheet: 4370
180
Inductance Characteristics
HCM1104-R36-R
HCM1104-R20-R
100%
100%
90%
80%
80%
% of OCL
% of OCL
90%
70%
70%
60%
60%
50%
50%
40%
40%
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
IDC (Amps)
50
60
70
80
90
100
IDC (Amps)
HCM1104-R45-R
100%
40
HCM1104-R56-R
100%
90%
80%
80%
% of OCL
% of OCL
90%
70%
70%
60%
60%
50%
50%
40%
40%
0
10
20
30
40
50
60
70
0
80
10
20
IDC (Amps)
30
40
IDC (Amps)
50
60
70
HCM1104-R90-R
100%
90%
% of OCL
80%
70%
60%
50%
40%
0
10
20
30
40
50
60
IDC (Amps)
0312
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Page 4 of 6
Data Sheet: 4370
181
Inductance Characteristics
HCM1104-1R5-R
HCM1104-1R0-R
90%
90%
80%
80%
% of OCL
100%
% of OCL
100%
70%
70%
60%
60%
50%
50%
40%
0
5
10
15
20
25
30
35
40%
40
0
5
10
15
HCM1104-2R2-R
90%
80%
80%
% of OCL
90%
% of OCL
100%
70%
60%
50%
50%
2
4
6
8
10
12
14
16
18
20
22
24
26
40%
28
Idc (Amps)
0
2
4
6
HCM1104-4R7-R
80%
80%
% of OCL
90%
% of OCL
90%
70%
60%
50%
50%
4
6
8
10
12
14
16
18
40%
0
Idc (Amps)
0312
BU-SB12258
10
12
14
16
18
70%
60%
2
8
HCM1104-100-R
100%
0
35
Idc (Amps)
100%
40%
30
70%
60%
0
25
HCM1104-4R7-R
100%
40%
20
Idc (Amps)
Idc (Amps)
2
4
6
8
10
12
14
16
Idc (Amps)
Page 5 of 6
Data Sheet: 4370
182
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TC -5°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Temperature
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
25°C
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
Cooper Bussmann
1225 Broken Sound Parkway NWP.O. Box 14460
Suite F
St. Louis, MO 63178?4460
Boca Raton, FL 33487?3533Tel: 1?636?394?2877
Tel: 1?561?998?4100
Fax: 1?636?527?1607
Fax: 1?561?241?6640
Toll Free: 1?888?414?2645
Asia Pacific
Europe
Cooper Electronic Technologies
Cooper Electronic Technologies
Cooper Electronic Technologies
Cooper (UK) Limited
Avda. Santa Eulalia, 290 1 Jalan Kilang Timor
#06?01 Pacific Tech Centre
Burton?on?the?Wolds
08223
Singapore 159303
Leicestershire ¥ LE12 5THTerrassa,
UK
(Barcelona), Spain
Tel: +65 278 6151
Tel: +44 (0) 1509 882 737Tel:+34 937 362 812
Fax: +65 270 4160
Fax: +44 (0) 1509 882 786
+34 937 362 813
Fax:+34 937 362 719
The only controlled copy of this Data Sheet is the electronic read?only version located on the Cooper Bussmann Network Drive. All other copies o
document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical informati
that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design
? or construction of an
ucts and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update,
? without notice, any
nical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the ex
written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose ?
failure to perform, whe
erly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the us
© 2012 Cooper Bussmann
w w w. c o o p e r b u s s m a n n . c o m
0312
BU-SB12258
Page 6 of 6
Data Sheet: 4370
183
Technical Data 4371
Effective June 2014
Supersedes October 2010
Coiltronics HCM1305 Series
High current power inductors
Applications
•
Voltage Regulator Module (VRM)
•
Multi-phase regulators
•
Point-of-load modules
•
Desktop and server VRMs and EVRDs
•
Base station equipment
•
Notebook regulators
•
Battery power systems
•
Graphics cards
•
Data networking and storage systems
Environmental data
Product description
•
High current carrying capacity
•
Low core losses
•
Magnetically shielded, low EMI
•
Frequency range up to 5MHz
•
Inductance range from 0.10 μH to 33μH
•
Current range from 5.2A to 118A
•
13.8x12.5mm footprint surface mount
package in a 5.0mm height
•
Powder iron core material
•
Halogen free, lead free, RoHS compliant
•
Storage temperature range (Component):
-55°C to +125°C
•
Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
HALOGEN
Pb HF
FREE
The Coiltronics brand of
magnetics (formerly of
the Bussmann Division of
Cooper Industries)
is now part of
Eaton’s Electrical Group,
Electronics Division.
Coiltronics is now
part of Eaton
Same great
products plus
even more.
184
Technical Data 4371
Effective June 2014
HCM1305 Series
High current, power inductors
Product specifications
OCL1
(μH) ± 20%
FLL2 Min.
(μH)
Irms3
(amps)
Isat4
(amps)
DCR (mΩ)
@ 20°C ±
nominal
DCR (mΩ)
@ 20°C
maximum
K-factor5
HCM1305-R10-R
0.10
0.064
55
118
0.52
0.59
848
HCM1305-R22-R
0.22
0.14
51
110
0.63
0.72
843
HCM1305-R33-R
0.33
0.21
42
80
0.80
0.92
506
HCM1305-R47-R
0.47
0.30
38
65
0.80
0.92
506
HCM1305-R56-R
0.56
0.36
36
55
1.15
1.33
500
HCM1305-R68-R
0.68
0.44
34
54
1.15
1.33
500
HCM1305-R82-R
0.82
0.52
31
53
1.40
1.61
358
HCM1305-1R0-R
1.00
0.64
29
50
2.10
2.42
275
HCM1305-1R5-R
1.50
0.96
23
48
2.75
3.16
225
HCM1305-1R8-R
1.80
1.15
21
40
4.00
4.60
216
HCM1305-2R2-R
2.20
1.41
20
32
4.60
5.29
191
HCM1305-3R3-R
3.30
2.11
15
32
7.70
9.20
170
HCM1305-4R7-R
4.70
3.01
12
27
11.0
12.7
161
HCM1305-5R6-R
5.60
3.58
11.5
22
12.0
13.8
142
HCM1305-6R8-R
6.80
4.35
11
21
13.0
15.0
129
HCM1305-7R8-R
7.80
4.99
10
18.5
16.8
19.4
117
HCM1305-8R2-R
8.20
5.25
9.5
18
17.5
20.1
117
HCM1305-100-R
10.0
6.40
9.0
16
19.0
21.9
90
HCM1305-150-R
15.0
9.60
7.7
13
29.0
33.4
74
HCM1305-220-R
22.0
14.1
6.2
10
45.0
51.8
63
HCM1305-330-R
33.0
21.1
5.2
8
74.5
85.5
48
Part Number6
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc,
+25°C.
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat, @ +25°C.
3. Irms: DC current for an approximate temperature rise of 40°C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed 125°C under worst case operating conditions verified in the end
application.
2
4. Isat: Peak current for approximately 20% rolloff at +25°C.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I.
Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM1305-yyy-R
- HCM1305 = Product code and size
- yyy= Inductance value in μH, R = decimal point,
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
www.eaton.com/elx
185
HCM1305 Series
High current, power inductors
Technical Data 4371
Effective June 2014
Dimensions - mm
Top View
13.3±0.5
Side View
5.0 max.
Bottom View
Recommended Pad Layout
Schematic
2.54±0.3
3.3
12.2±0.3
xxx
wlyy R
4.0±0.5
7.7 typ.
14.2
4.9
8.5 typ.
Part Marking: xxx = Inductance value in µH, R = decimal point, if no R is present, third character = number of zeros, wlyy = (Date Code), R = (Revision Level)
All soldering surfaces to be coplanar within 0.10 millimeters.
Tolerances are ±0.3 millimeters unless stated otherwise.
Color: Grey.
Packaging information - mm
Supplied in tape and reel packaging, 400 parts per 13” diameter reel.
www.eaton.com/elx
3
186
Technical Data 4371
Effective June 2014
HCM1305 Series
High current, power inductors
Temperature rise vs. total loss
50.0
Temperature Rise (˚C)
40.0
30.0
20.0
10.0
0.0
Core loss
10000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Total Loss (W)
1.4
1.6
1.8
2.0
Core Loss vs. Bp-p
1MHz
500KHz
300KHz
200KHz
100KHz
Core Loss (mW)
1000
100
10
1
100
1000
10000
Bp-p (Gauss)
4
www.eaton.com/elx
187
HCM1305 Series
High current, power inductors
Technical Data 4371
Effective June 2014
Inductance characteristics
HCM1305-R33-R
110%
100%
90%
90%
% of OCL
100%
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
20
40
60
80
Idc (Amps)
100
120
0
140
HCM1305-R56-R
110%
20
40
90%
90%
% of OCL
100%
80%
70%
60
80
Idc (Amps)
100
120
HCM1305-R68-R
110%
100%
% of OCL
80%
70%
60%
60%
50%
50%
40%
40%
0
20
40
60
Idc (Amps)
80
100
0
120
10
20
30
40
50
60
70
80
Idc (Amps)
HCM1305-R82-R
HCM1305-1R0-R
110%
100%
100%
90%
90%
% of OCL
110%
% of OCL
% of OCL
HCM1305-R47-R
110%
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
0
10
20
30
40
Idc (Amps)
50
60
70
80
10
20
30
40
Idc (Amps)
50
www.eaton.com/elx
60
70
5
188
Technical Data 4371
Effective June 2014
HCM1305 Series
High current, power inductors
Inductance characteristics
HCM1305-1R5-R
110%
90%
90%
% of OCL
100%
% of OCL
100%
80%
70%
40%
40%
0
5
10
15
20
25
30
35
40
Idc (Amps)
45
50
55
0
60
5
10
15
20
100%
90%
90%
% of OCL
100%
70%
30
35
40
45
50
55
60
HCM1305-3R3-R
110%
80%
25
Idc (Amps)
HCM1305-2R2-R
110%
% of OCL
70%
50%
50%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
30
Idc (Amps)
35
40
45
0
50
5
10
15
20
25
30
35
40
45
50
Idc (Amps)
HCM1305-5R6-R
HCM1305-4R7-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
80%
60%
60%
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
6
HCM1305-1R8-R
110%
5
10
15
20
Idc (Amps)
25
30
35
0
5
10
15
Idc (Amps)
20
25
30
www.eaton.com/elx
189
HCM1305 Series
High current, power inductors
Technical Data 4371
Effective June 2014
Inductance characteristics
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1305-6R8-R
110%
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
20
Idc (Amps)
25
0
30
2
4
6
8
10
100%
100%
90%
90%
80%
70%
14
16
18
20
22
24
26
80%
70%
60%
60%
50%
50%
40%
12
Idc (Amps)
HCM1305-100-R
110%
% of OCL
% of OCL
15
HCM1305-8R2-R
110%
40%
0
2
4
6
8
10
12
14
16
Idc (Amps)
18
20
22
24
26
0
HCM1305-150-R
110%
2
4
6
100%
100%
90%
90%
80%
70%
8
10 12 14 16 18 20 22
Idc (Amps)
24 26
HCM1305-220-R
110%
% of OCL
% of OCL
HCM1305-7R8-R
80%
70%
60%
60%
50%
50%
40%
40%
0
2
4
6
8
10
12
Idc (Amps)
14
16
18
20
22
0
2
4
6
8
10
Idc (Amps)
12
14
www.eaton.com/elx
16
18
7
190
Technical Data 4371
Effective June 2014
HCM1305 Series
High current, power inductors
Inductance characteristics
HCM1305-330-R
110%
100%
% of OCL
90%
80%
70%
60%
50%
40%
0
2
4
6
8
10
12
14
16
18
Idc (Amps)
8
www.eaton.com/elx
191
HCM1305 Series
High current, power inductors
Technical Data 4371
Effective June 2014
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
25°C
Preheat
A
Volume
mm3
<350
235°C
220°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Eaton’s Electrical Group
Electronics Division
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Eaton’s Electrical Group
Electronics Division
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Eaton’s Electrical Group
Electronics Division
Burton-on-the-Wolds
Leicestershire, LE 12 5th UK
Phone: +44 (0) 1509 882 600
Fax: +44 (0) 1509 882 786
Eaton’s Electrical Group
Electronics Division
Avda Santa Eulalia, 290
Terrassa, Barcelona 08223 Spain
Phone: +34-93-736-2813
Fax: +34-93-783-5055
Asia Pacific
Eaton’s Electrical Group
Electronics Division
No.2, #06-01
Serangoon North Avenue 5
Singapore 554911
Tel: +65 6645 9888
Fax: +65 6728 3155
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Eaton’s Electrical Group
Electronics Division
114 Old State Road
Ellisville, MO 63021
United States
www.eaton.com/elx
© 2014 Eaton
All Rights Reserved
Publication No. 4371 — BU-SB14459
June 2014
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
www.eaton.com/elx
9
192
Technical Data 10295
Effective August 2014
Coiltronics HCM1707 Series
High current power inductors
Applications
•
Voltage Regulator Module (VRM)
•
Multi-phase regulators
•
Point-of-load modules
•
Desktop and server VRMs and EVRDs
•
Data networking and storage systems
•
Base station equipment
•
Battery power systems
Environmental data
•
Storage temperature range (Component):
-55°C to +125°C
•
Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
Product description
•
High current carrying capacity
•
Magnetically shielded, low EMI
•
Frequency range up to 1MHz
•
Inductance range from 1.5μH to 68.0μH
•
Current range from 5.2 to 40.0 amps
•
17.5x17.2mm footprint surface mount
package in a 7.0mm height
•
Powder iron core material
•
Halogen free, lead free, RoHS compliant
HALOGEN
Pb HF
FREE
The Coiltronics brand of
magnetics (formerly of
the Bussmann Division of
Cooper Industries)
is now part of
Eaton’s Electrical Group,
Electronics Division.
Coiltronics is now
part of Eaton
Same great
products plus
even more.
193
Technical Data 10295
Effective August 2014
HCM1707 Series
High current power inductors
Product specifications
Part Number6
OCL1
±20%
(μH)
FLL min.2
(μH)
Irms3
(amps)
Isat4
(amps)
DCR (mΩ)
@ 20°C
(typical)
DCR (mΩ)
@ 20°C
(maximum)
K-factor5
HCM1707-1R5-R
1.5
0.96
40
40
1.85
2.15
124
HCM1707-2R2-R
2.2
1.41
37
34
2.15
2.50
103
HCM1707-4R7-R
4.7
3.01
27
24
4.12
4.72
76
HCM1707-6R8-R
6.8
4.35
20
22
6.55
7.55
60
HCM1707-8R2-R
8.2
5.25
16
20
8.10
8.70
55
HCM1707-100-R
10
6.40
14
18
9.30
10
47
HCM1707-150-R
15
9.60
12
13
14.5
15.5
43
HCM1707-220-R
22
14.1
9.5
11
21
23
37
HCM1707-330-R
33
21.1
9.0
10
35
37
28
HCM1707-470-R
47
30.1
6.8
7.5
41
47
25
HCM1707-680-R
68
43.5
5.2
6.5
74
85
20
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc,
+25°C.
2. Full Load Inductance (FLL): Test parameters: 100kHz, 0.25Vrms, Isat, +25°C.
3. Irms: DC current for an approximate temperature rise of 40°C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part
not exceed +125°C under worst case operating conditions verified in the end
application.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I.
Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM1707-yyy-R
- HCM1707 = Product code and size
- yyy= Inductance value in uH, R = decimal point,
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
4. Isat: Peak current for approximately 20% rolloff at +25°C.
Dimensions - mm
a
b
All soldering surfaces coplanar within 0.10 millimeters.
Part marking: HCM1707; XXX = initial inductance in µH, R = decimal point;
if no R is present, last digit equals number of zeros.
wwllyy = date code, R = revision level
Color: Grey.
DCR measured between point “a” and point “b”
2
www.eaton.com/elx
194
HCM1707 Series
High current power inductors
Technical Data 10295
Effective August 2014
Packaging information - mm
Supplied in tape and reel packaging, 350 parts per 13” diameter reel.
Temperature rise vs. total loss
50
Temperature Rise (˚C)
40
30
20
10
0
0.0
0.5
1.0
1.5
Total Loss ( W)
2.0
2.5
www.eaton.com/elx
3
195
Technical Data 10295
Effective August 2014
HCM1707 Series
High current power inductors
Core loss
Core Loss vs Bp-p
10000.0
500K
300K
200K
100K
50K
25K
Core Loss (mW)
1000.0
100.0
10.0
1.0
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
HCM1707-2R2-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-1R5-R
80%
70%
60%
70%
60%
50%
50%
40%
40%
0
10
20
30
40
Idc (Amps)
4
80%
50
60
70
0
10
20
30
40
50
60
70
Idc (Amps)
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196
HCM1707 Series
High current power inductors
Technical Data 10295
Effective August 2014
Inductance characteristics
HCM1707-6R8-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-4R7-R
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
30
0
35
5
10
25
30
20
25
30
HCM1707-100-R
HCM1707-8R2-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
20
Idc (Amps)
Idc (Amps)
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
0
30
5
10
15
Idc (Amps)
Idc (Amps)
HCM1707-220-R
HCM1707-150-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
15
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
2
4
6
8
10
12
Idc (Amps)
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Idc (Amps)
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197
Technical Data 10295
Effective August 2014
HCM1707 Series
High current power inductors
Inductance characteristics
HCM1707-470-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-330-R
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
2
4
6
8
10
12
14
16
18
0
2
4
6
8
10
12
14
Idc (Amps)
Idc (Amps)
HCM1707-680-R
110%
100%
% of OCL
90%
80%
70%
60%
50%
40%
0
2
4
6
8
10
12
14
Idc (Amps)
6
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198
HCM1707 Series
High current power inductors
Technical Data 10295
Effective August 2014
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
25°C
Preheat
A
Volume
mm3
<350
235°C
220°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
_
>350
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
ts
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Eaton’s Electrical Group
Electronics Division
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Eaton’s Electrical Group
Electronics Division
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Eaton’s Electrical Group
Electronics Division
Burton-on-the-Wolds
Leicestershire, LE 12 5th UK
Phone: +44 (0) 1509 882 600
Fax: +44 (0) 1509 882 786
Eaton’s Electrical Group
Electronics Division
Avda Santa Eulalia, 290
Terrassa, Barcelona 08223 Spain
Phone: +34-93-736-2813
Fax: +34-93-783-5055
Asia Pacific
Eaton’s Electrical Group
Electronics Division
No.2, #06-01
Serangoon North Avenue 5
Singapore 554911
Tel: +65 6645 9888
Fax: +65 6728 3155
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Eaton’s Electrical Group
Electronics Division
114 Old State Road
Ellisville, MO 63021
United States
www.eaton.com/elx
© 2014 Eaton
All Rights Reserved
Publication No. 10295 — BU-SB14600
August 2014
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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7
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