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HCP0704 Family
Jun. 10th, 2008
Mechanical Dimensions
MECHANICAL DIMENSIONS
RECOMMENED PCB LAYOUT
6.80 Max
Top View
HCP0704
XXX
wwllyy R
7.60
6.80 Max
2.50(2x)
4.00(2x)
Front View
4.20 Max
SCHEMATIC
Bottom View
1
1.23 Ref.
3.60 Ref.
1. All dimensions are in millimeters unless otherwise noted.
2. Stamping:
The first 10 characters is the part number of the part
wwllyy = (Date Code) R= (Revision Level)
3. RoHS Compliance
2
High Current Power Inductor
2 Pads, SMT
HCP0704-R Family
X1
HCP0704-R
2
Electrical Characteristic
$
4Ω
# $
4
Ω
5 1
% " °$
3, 4
" '
( * + , -
" & &
/
" / / * + , -
" / )
0" ) -
"
'
2 * + , -
" '
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. )
(
* + , -
) .
$1 ' / ," ( ,
" ( " ( 0" ) -
' )
)
) * + , -
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( ( ( ( 0" ) -
2 & )
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'
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/ ' / ' 0" ) -
) . )
( " ) * + , -
& & '
1 9 6 4µ $1 ' / ,
/ ,
/ $1 ' / ,
2 ,
= $> 4µ % " °$
6 < 7 4
48 : :
6 7 8 49 48 : % " ) ;$
/ 0" ) -
' 2 ) 0" ) -
$1 ' / , ,
$1 ' / , . ,
! " # $
% " °$
General Specifications:
a. Temp. Rise: 40 C Max @ Irms rating.
b. L(ISAT1)/L(0A)= 20% typical.
c. Storage Temp.: -40 C~ +155 C
d. Operating Temp.: -40 C~ +155 C
e. K-factor: Used to determine Bp-p for core loss(see graph). Bp-p=K8L* I
Bp-p:(Gauss), K-facotr:(From table), L: (Inductance in uH), I :(Peak to peak ripple current in Amps).
f. Resistance to Solder Heat: 260 C for 10 secs.
g. Insulation Resistance winding to core, 2 second: 100Vdc 10 Mohms min.
HCP0704-R
3
% of OCL vs. % of Isat
• Test Conditions: 100kHz, 0.1Vrms @25C Degree
• Test Equipments: WK3260 & 3265
HCP0704-R
4
Temperature Rise vs. Total Loss
60
Temperature Rise ( )
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Total Loss (W)
• Ambient Temperature: 25
HCP0704-R
5
!"
#$
HCP0704-R
% & ' '
) *+
( & ' '
Core Loss vs.
B
6
Packaging Information
1.5 Dia.
+0.1/-0.0
Direction of feed
4.0
2.0
A
1.75
7.5
See note 6
1
Bo
6.8
HCP0704
XXX
wwllyy R
HCP0704
XXX
wwllyy R
HCP0704
XXX
wwllyy R
16.0
+/-0.3
2
Ao
A
12.0
0.30
+/-0.05
0.5Rad
typ.
Ao= 6.9mm
Bo= 7.5mm
Ko= 4.0mm
0.3Rad
max.
Ko
• 1000 parts per reel
HCP0704-R
7
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