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SD3114 Series
Low Profile Power Inductors
Description
RoHS
2002/95/EC
• 125°C maximum total temperature operation
• 3.1mm x 3.1mm x 1.4mm shielded drum core
• Ferrite core material
• Inductance range from 1.0uH to 330uH
• Current range from 2.59 Amps to 0.106 Amps
• Frequency range up to 4MHz
Applications
• Cellular phones, Digital cameras, CD players, PDA’s
• Small LCD displays
• LED driver and LED flash circuits
• Hard disk drives
• Backlighting
• EL panel
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(range is application specific)
• Solder reflow temperature: +260°C max. for 10 seconds
maximum
Part Number
SD3114-1R0-R
SD3114-1R5-R
SD3114-2R2-R
SD3114-3R3-R
SD3114-4R7-R
SD3114-6R8-R
SD3114-8R2-R
SD3114-100-R
SD3114-150-R
SD3114-220-R
SD3114-330-R
SD3114-470-R
SD3114-680-R
SD3114-820-R
SD3114-101-R
SD3114-151-R
SD3114-221-R
SD3114-331-R
Rated
Inductance
(µH)
1.0
1.5
2.2
3.3
4.7
6.8
8.2
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100.0
150.0
220.0
330.0
OCL (1)
(µH)
1.16+/-30%
1.44+/-30%
2.12+/-30%
3.36+/-30%
4.90+/-30%
6.72+/-30%
8.10+/-30%
10.4+/-30%
14.9+/-20%
22.5+/-20%
33.1+/-20%
47.5+/-20%
68.6+/-20%
81.8+/-20%
101.1+/-20%
149.0+/-20%
220.9+/-20%
329.5+/-20%
Part
Marking
Designator
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
(1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
(2) Irms: DC current for an approximate DT of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise. It
is recommended that the temperature of the part not exceed 125°C under worst
case operating conditions verified in the end application.
Packaging
• Supplied in tape and reel packaging, 4100 per reel
Irms (2)
Amperes
Isat (3)
Amperes
1.60
1.39
1.17
0.95
0.77
0.71
0.68
0.57
0.48
0.43
0.35
0.280
0.239
0.227
0.213
0.172
0.140
0.113
2.35
2.11
1.74
1.38
1.14
0.98
0.89
0.78
0.66
0.53
0.44
0.37
0.305
0.280
0.252
0.207
0.170
0.139
DCR (Ω)
typ. @
20°C
0.058
0.077
0.110
0.167
0.251
0.296
0.329
0.458
0.650
0.821
1.23
1.86
2.62
2.91
3.30
5.07
7.67
11.78
K-factor
(4)
98
79
67
54
45
37
34
30
25
21
17
14
12
11
10
8
6
5
(3) Isat Amperes peak for approximately 30% rolloff (@20°C)
(4) K-factor: Used to determine B p-p for core loss (see graph).
B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH),
∆I (Peak to peak ripple current in Amps).
SD3114 Series
Low Profile Power Inductors
Mechanical Diagrams
BOTTOM VIEW
TOP VIEW
RECOMMENDED PCB LAYOUT
2.40
Pin #1 indicator
3.1 max.
1.40
Marking
3.7 max
XX X
0.70
3.1 max.
1.2 typical
SCHEMATI C
1
SIDE VIEW
1.4 max
2
Dimensions are in millimeters.
Part Marking:
3 Digit Marking: (1st digit: Indicates inductance value per letter in Part Marking Designator); (2nd digit: Bi-weekly production date code); (3rd digit: Last digit of the year produced).
Packaging Information
4. 0 0
1.2 Dia
min.
1.5 Dia.
+0.1/-0.0
2.00 ¡À0 . 0 5
A
1
1.75
B1
10.25
B o
12.0
+/-0.3
5.50
2
3.2
Ko
3.2
A
A1
SECTION A -A
Ao
8.0
Ao = 3.9 mm
A1 = 0.93 mm
Bo = 3.60 mm
B1 = 1.25 mm
Ko = 1.60 mm
Parts packaged on 13" Diameter reel,
4,100 parts per reel.
Direction of feed
Temp. Rise (°C)
DC Current vs. Temperature
90
80
70
60
50
40
30
20
10
0
0
0. 05
0. 1
0. 15
0. 2
0. 25
Total Loss(W)
0. 3
0. 35
0. 4
0. 45
SD3114 Series
Low Profile Power Inductors
Core Loss
10
1 MH z
1
50 0kH z
3 00 k H z
20 0kH z
0 .1
Core Loss (W)
10 0kH z
5 0kH z
0 .01
0.0 01
0 .00 01
0 .000 01
0.0 00001
1
10
10 0
10 0 0
B p-p (mT )
Inductance Characteristics
OCL vs. Isat
120%
110%
100%
90%
% of L initial
80%
70%
-40°C
60%
50%
25°C
40%
30%
85°C
20%
10%
0%
0%
PM-4128 3/07
© Cooper Electronic
Technologies 2007
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Electronic Technologies also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been
selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Electronic Technologies does not authorize the use of any of its products for use in life support devices or systems without the
express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
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