05-08-1855

UD Package
12-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1855 Rev Ø)
0.70 ±0.05
3.50 ± 0.05
1.65 ± 0.05
2.10 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.75 ± 0.05
11
12
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
1.65 ± 0.10
(4-SIDES)
2
0.200 REF
0.25 ± 0.05
(UD12) QFN 0709 REV Ø
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC