05-08-1823

LGA Package
71-Lead (15mm × 9mm × 2.82mm)
(Reference LTC DWG # 05-08-1823 Rev A)
SEE NOTES
7
2.670 – 2.970
7
aaa Z
6
5
4
3
2
1
PAD 1
Ø (0.635)
A
PAD 1
CORNER
B
4
C
D
E
15.00
BSC
12.700
BSC
F
G
H
MOLD
CAP
SUBSTRATE
J
0.27 – 0.37
DETAIL A
PADS
SEE NOTES
X
9.00
BSC
Y
DETAIL A
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
aaa Z
K
1.270
BSC
Z
bbb Z
2.40 – 2.60
3
L
1.27
BSC
7.620
BSC
DETAIL A
PACKAGE BOTTOM VIEW
0.635 ±0.025 SQ. 71x
3.810
2.540
1.270
0.000
1.270
2.540
3.810
eee S X Y
6.350
5.080
3.810
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
2.540
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
1.270
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
0.000
1.270
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 71
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
LTMXXXXXX
µModule
COMPONENT
PIN 1
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 71 1212 REV A
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