05-08-1560

LGA Package
76-Lead (15mm × 11.25mm × 4.32mm)
(Reference LTC DWG # 05-08-1560 Rev A)
DETAIL A
SEE NOTES
7
4.22 – 4.42
8
aaa Z
7
6
5
4
3
2
1
PAD 1
A
PAD “A1”
CORNER
B
4
C
D
E
15.00
BSC
12.70
BSC
MOLD
CAP
F
G
SUBSTRATE
H
0.270 – 0.370
3.95 – 4.05
J
Z
bbb Z
DETAIL B
K
L
X
aaa Z
11.25
BSC
Y
8.89
BSC
DETAIL B
PACKAGE TOP VIEW
4.445
3.175
1.905
0.635
0.635
1.905
3
0.635 ±0.025 75SQ
eee S X Y
eee S X Y
3.175
PADS
SEE NOTES
PACKAGE BOTTOM VIEW
0.635 ±0.025 75SQ
4.445
1.27
BSC
DETAIL C
DETAIL A
DETAIL C
6.350
5.080
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.810
2. ALL DIMENSIONS ARE IN MILLIMETERS
2.540
3
LAND DESIGNATION PER JESD MO-222
1.270
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
0.000
1.270
5. PRIMARY DATUM -Z- IS SEATING PLANE
2.540
6. THE TOTAL NUMBER OF PADS: 76
3.810
7
5.080
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 76 1212 REV A
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