05-08-1809

aaa Z
LGA Package
81-Lead (11.25mm × 11.25mm × 2.32mm)
(Reference LTC DWG# 05-08-1809 Rev B)
11.250
BSC
X
0.25 × 45
CHAMFER
×3
2.17 – 2.47
Y
SEE NOTES
DETAIL A
J
H
G
F
E
D
C
B
7
A
PAD 1
1
PAD 1
CORNER
2
4
3
4
11.250
BSC
MOLD
CAP
SUBSTRATE
0.27 – 0.37
6
7
Z
bbb Z
1.90 – 2.10
5
10.160
BSC
DETAIL B
8
1.27
BSC
9
aaa Z
0.630 ±0.025 SQ. 80x
DETAIL B
PACKAGE SIDE VIEW
PADS
SEE NOTES
10.160
BSC
3
PACKAGE BOTTOM VIEW
5.080
3.810
2.540
1.270
eee S X Y
0.000
1.5875
1.270
0.9525
2.540
3.810
5.080
PACKAGE TOP VIEW
5.080
DETAIL A
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2.540
1.270
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.5875
0.9525
0.000
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
1.270
5. PRIMARY DATUM -Z- IS SEATING PLANE
2.540
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
6. THE TOTAL NUMBER OF PADS: 81
7
3.810
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 81 0113 REV B
5.080
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
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