05-08-1800

LGA Package
104-Lead (15mm × 15mm × 2.82mm)
6
7
17
16
6.9865
5.7142
3.1742
4.4442
1.9042
0.0000
0.6342
5
4
18
4.0075
8
12
2.7375
1.4675
25
32
0.3175
0.3175
1.2700
2.5400
5.7650
9
10
11
4.4950
13
14
15
aaa Z
2.72 – 2.92
15
BSC
X
Y
19
20
1
5.2775
0.0000
3
2
0.6358
6.9888
6.5475
3.1758
5.7158
6.9421
4.4458
1.9058
(Reference LTM DWG # 05-08-1800 Rev C)
4
21
PAD 1
CORNER
22
2.3600
26
27
28
29
30
31
1.0900
33
34
35
36
37
38
23
15
BSC
24
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
MOLD
CAP
SUBSTRATE
0.27 – 0.37
2.45 – 2.55
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
79
80
82
81
aaa Z
TOP VIEW
DETAIL B
5.0800
2.5400
6.3500
3.8100
1.2700
0.3175
0.3175
78
0.0000
2.5400
5.0800
77
76
1.2700
75
Z
83
74
6.3500
6.9850
73
3.8100
5.7150
72
bbb Z
DETAIL B
4.4450
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
SUGGESTED SOLDER PAD LAYOUT
TOP VIEW
0.11 – 0.27
12.70
BSC
95
94
96
97
98
99
100
101
102
103
2. ALL DIMENSIONS ARE IN MILLIMETERS
PADS
SEE NOTES
T
3
104
83
84
85
86
87
88
89
90
91
92
93
R
72
73
74
75
76
77
78
79
80
81
82
P
61
62
63
64
65
66
67
68
69
70
71
N
50
51
52
53
54
55
56
57
58
59
60
M
39
40
41
42
43
44
45
46
47
48
49
L
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER IS A MARKED FEATURE OR A
NOTCHED BEVELED PAD
5. PRIMARY DATUM -Z- IS SEATING PLANE
13.97
BSC
32
25
33
34
35
36
37
38
26
27
28
29
30
31
12
14
15
9
10
11
23
G
21
1
20
3
2
1
J
22
13
8
C(0.30)
PAD 1
24
2
3
4
5
4
6
7
5
8
9
6
10
11
7
12
13
16
14
15
13.93
BSC
BOTTOM VIEW
17
16
17
18
18
19
19
20
21
22
23
E
C
A
6. THE TOTAL NUMBER OF PADS: 104
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
K
H
F
D
B
SEE NOTES
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.15
7
eee M X Y
4600 02-18
LGA 104 1112 REV C
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