05-08-1756

LGA Package
113-Lead (15mm × 15mm × 4.32mm)
(Reference LTC DWG # 05-08-1756 Rev A)
aaa Z
15
BSC
X
4.22 – 4.42
Y
SEE NOTES
DETAIL A
11
10
9
8
7
6
5
4
3
2
7
1
A
C(0.30)
PAD 1
B
C
PAD 1
CORNER
D
4
E
15
BSC
MOLD
CAP
12.70
BSC
SUBSTRATE
F
G
0.27 – 0.37
H
Z
// bbb Z
3.95 – 4.05
J
1.27
BSC
K
DETAIL B
L
aaa Z
PADS
SEE NOTES
PACKAGE TOP VIEW
3
0.635 ±0.025 SQ. 113x
DETAIL A
6.350
5.080
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.810
2. ALL DIMENSIONS ARE IN MILLIMETERS
2.540
3
LAND DESIGNATION PER JESD MO-222, SPP-010
1.270
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
0.000
1.270
6. THE TOTAL NUMBER OF PADS: 113
3.810
7
6.350
LTMXXXXXX
µModule
5. PRIMARY DATUM -Z- IS SEATING PLANE
2.540
5.080
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
DETAIL B
6.350
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
eee S X Y
12.70
BSC
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 113 1212 REV A
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