MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP32 6.35x3.68 CASE 127DW ISSUE O DATE 12 APR 2016 SCALE 2:1 D PIN 1 INDICATOR 0.13 C 0.13 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BUMPS. 4. DIMENSIONS b, b1, L AND L2 ARE MEASURED AT THE MAXIMUM BUMP DIMENSION PARALLEL TO DATUM C. THE POSITIONAL TOLERANCE APPLIES TO ALL OF THE SOLDER BUMPS. A B E ÈÈÈ ÈÈÈ DIM A A1 A2 b b1 D D2 D3 E e e1 e2 L L2 TOP VIEW 0.13 C A2 A 0.05 C A1 NOTE 3 C SIDE VIEW 6X MILLIMETERS MIN MAX −−− 1.960 0.076 0.180 −−− 1.780 0.478 0.538 0.275 0.335 6.350 BSC 0.203 BSC 1.067 BSC 3.683 BSC 0.914 BSC 0.696 BSC 0.699 BSC 0.580 0.640 1.177 1.237 SEATING PLANE b1 e1 L2 20 12 6X b1 26X e e/2 L 0.05 C A B 0.03 C 9 NOTE 4 RECOMMENDED SOLDERING FOOTPRINT* 1 e2 25X D2 D3 BOTTOM VIEW b 0.05 C A B 0.03 C 0.203 1.067 6X 0.699 PITCH NOTE 4 0.370 1 PACKAGE OUTLINE 6X 0.370 0.914 PITCH 26X 0.650 25X 0.540 1.239 0.696 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON08399G ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SIP32 6.35X3.68 http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON08399G PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY J. STEFFLER. DATE 12 APR 2016 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2016 April, 2016 − Rev. O Case Outline Number: 127DW