127DW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP32 6.35x3.68
CASE 127DW
ISSUE O
DATE 12 APR 2016
SCALE 2:1
D
PIN 1
INDICATOR
0.13 C
0.13 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BUMPS.
4. DIMENSIONS b, b1, L AND L2 ARE MEASURED
AT THE MAXIMUM BUMP DIMENSION PARALLEL
TO DATUM C. THE POSITIONAL TOLERANCE
APPLIES TO ALL OF THE SOLDER BUMPS.
A
B
E
ÈÈÈ
ÈÈÈ
DIM
A
A1
A2
b
b1
D
D2
D3
E
e
e1
e2
L
L2
TOP VIEW
0.13 C
A2 A
0.05 C
A1
NOTE 3
C
SIDE VIEW
6X
MILLIMETERS
MIN
MAX
−−−
1.960
0.076
0.180
−−−
1.780
0.478
0.538
0.275
0.335
6.350 BSC
0.203 BSC
1.067 BSC
3.683 BSC
0.914 BSC
0.696 BSC
0.699 BSC
0.580
0.640
1.177
1.237
SEATING
PLANE
b1
e1
L2
20
12
6X
b1
26X
e
e/2
L
0.05 C A B
0.03 C
9
NOTE 4
RECOMMENDED
SOLDERING FOOTPRINT*
1
e2
25X
D2
D3
BOTTOM VIEW
b
0.05 C A B
0.03 C
0.203
1.067
6X
0.699
PITCH
NOTE 4
0.370
1
PACKAGE
OUTLINE
6X
0.370
0.914
PITCH
26X
0.650
25X
0.540
1.239
0.696
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON08399G
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SIP32 6.35X3.68
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON08399G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. STEFFLER.
DATE
12 APR 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2016
April, 2016 − Rev. O
Case Outline Number:
127DW
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