05-08-1853

UKJ Package
Variation: UKJ64MA
64-Lead Plastic QFN (7mm × 11mm)
(Reference LTC DWG # 05-08-1853 Rev Ø)
0.70 ± 0.05
7.50 ± 0.05
2.20 ±0.05
0.55 REF
6.10 ± 0.05
5.50 REF
5.20 ±0.05
2.05 ±0.05
4.75 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
9.50 REF
10.10 ± 0.05
11.50 ± 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
7.00 ± 0.10
0.75 ± 0.05
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
5.50 REF
63
0.00 – 0.05
64
0.40 ±0.10
PIN 1
TOP MARK
(SEE NOTE 6)
1
2
2.20 ±0.10
0.55 REF
2.05 ±0.10
11.00 ± 0.10
9.50 REF
4.75 ±0.10
5.20 ±0.10
R = 0.125
TYP
(UKJ64MA) QFN 0609 REV Ø
0.200 REF
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
R = 0.10
TYP