LXE Package 48-Lead Plastic Exposed Pad LQFP (7mm × 7mm) (Reference LTC DWG #05-08-1832 Rev C) 7.15 – 7.25 5.50 REF 1 48 37 36 0.50 BSC C0.30 5.50 REF 7.15 – 7.25 0.20 – 0.30 3.60 ±0.05 3.60 ±0.05 PACKAGE OUTLINE 24 XXYY LTCXXXX LX-ES Q_ _ _ _ _ _ e3 12 13 25 COMPONENT PIN “A1” 1.30 MIN TRAY PIN 1 BEVEL RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PACKAGE IN TRAY LOADING ORIENTATION 9.00 BSC 7.00 BSC 48 3.60 ±0.10 37 SEE NOTE: 3 1 48 37 36 36 1 C0.30 9.00 BSC 7.00 BSC 3.60 ±0.10 A A 12 25 25 12 C0.30 – 0.50 13 24 13 BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA) 24 11° – 13° R0.08 – 0.20 1.60 1.35 – 1.45 MAX GAUGE PLANE 0.25 0° – 7° LXE48 LQFP 0113 REV C 11° – 13° 0.09 – 0.20 1.00 REF 0.50 BSC 0.17 – 0.27 0.05 – 0.15 SIDE VIEW 0.45 – 0.75 SECTION A – A NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER 4. DRAWING IS NOT TO SCALE