05-08-1832

LXE Package
48-Lead Plastic Exposed Pad LQFP (7mm × 7mm)
(Reference LTC DWG #05-08-1832 Rev C)
7.15 – 7.25
5.50 REF
1
48
37
36
0.50 BSC
C0.30
5.50 REF
7.15 – 7.25
0.20 – 0.30
3.60 ±0.05
3.60 ±0.05
PACKAGE OUTLINE
24
XXYY
LTCXXXX
LX-ES
Q_ _ _ _ _ _
e3
12
13
25
COMPONENT
PIN “A1”
1.30 MIN
TRAY PIN 1
BEVEL
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PACKAGE IN TRAY LOADING ORIENTATION
9.00 BSC
7.00 BSC
48
3.60 ±0.10
37
SEE NOTE: 3
1
48
37
36
36
1
C0.30
9.00 BSC
7.00 BSC
3.60 ±0.10
A
A
12
25
25
12
C0.30 – 0.50
13
24
13
BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA)
24
11° – 13°
R0.08 – 0.20
1.60
1.35 – 1.45 MAX
GAUGE PLANE
0.25
0° – 7°
LXE48 LQFP 0113 REV C
11° – 13°
0.09 – 0.20
1.00 REF
0.50
BSC
0.17 – 0.27
0.05 – 0.15
SIDE VIEW
0.45 – 0.75
SECTION A – A
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
4. DRAWING IS NOT TO SCALE
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