05-08-1845

UHH Package
48-Lead Plastic QFN (5mm × 9mm)
(Reference LTC DWG # 05-08-1845 Rev Ø)
0.70 ± 0.05
5.50 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
3.50 REF
(2 SIDES)
3.63 ±0.05
7.62 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
7.50 REF (2 SIDES)
8.10 ± 0.05 (2 SIDES)
9.50 ± 0.05 (2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
3.50 REF
47
0.00 – 0.05
48
0.40 ±0.10
PIN 1
TOP MARK
(SEE NOTE 6)
1
2
9.00 ± 0.10
(2 SIDES)
7.50 REF
7.62 ±0.10
3.63 ±0.10
(UHH) QFN 0409 REV Ø
0.200 REF
0.200 REF
0.00 – 0.05
0.75 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.25 ± 0.05
R = 0.125
TYP
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE