UKG Package 52-Lead Plastic QFN (7mm × 8mm) (Reference LTC DWG # 05-08-1729 Rev Ø) 7.50 ±0.05 6.10 ±0.05 5.50 REF (2 SIDES) 0.70 ±0.05 6.45 ±0.05 6.50 REF 7.10 ±0.05 8.50 ±0.05 (2 SIDES) 5.41 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 ± 0.10 (2 SIDES) 0.75 ± 0.05 0.00 – 0.05 R = 0.115 TYP 5.50 REF (2 SIDES) 51 52 0.40 ± 0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45°C CHAMFER 6.45 ±0.10 8.00 ± 0.10 (2 SIDES) 6.50 REF (2 SIDES) 5.41 ±0.10 R = 0.10 TYP TOP VIEW 0.200 REF 0.00 – 0.05 0.75 ± 0.05 (UKG52) QFN REV Ø 0306 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD SIDE VIEW NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE