MIC4609 Evaluation Board User's Guide

MIC4609
Evaluation Board
User’s Guide
 2016 Microchip Technology Inc.
DS50002478A
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applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
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The Microchip name and logo, the Microchip logo, AnyRate,
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registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
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WiperLock, Wireless DNA, and ZENA are trademarks of
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SQTP is a service mark of Microchip Technology Incorporated
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Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002478A-page 2
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0437-8
 2016 Microchip Technology Inc.
Object of Declaration: MIC4609 Evaluation Board
 2016 Microchip Technology Inc.
DS50002478A-page 3
NOTES:
DS50002478A-page 4
 2016 Microchip Technology Inc.
MIC4609 EVALUATION
BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in This Guide........................................................................... 8
Recommended Reading........................................................................................ 8
The Microchip Website.......................................................................................... 9
Customer Support ................................................................................................. 9
Revision History .................................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 MIC4609 Short Overview ............................................................................. 11
1.3 What is the MIC4609 Evaluation Board? ..................................................... 11
1.4 MIC4609 Evaluation Board Kit Contents ...................................................... 11
Chapter 2. Installation and Operation
2.1 System and Configuration Requirements ..................................................... 13
2.2 Circuit Description ........................................................................................ 13
2.2.1 Overcurrent and Fault circuitry .................................................................. 14
2.2.2 Enable Pin (EN) ......................................................................................... 14
2.2.3 Input Pins (xHI/xLI) .................................................................................... 14
2.2.4 Power and Motor Connections .................................................................. 14
2.2.5 Power Stage and Motor Connections ........................................................ 15
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 17
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Layer ....................................................................................... 19
A.4 Board – Top Copper .................................................................................... 20
A.5 Board – Mid Layer 1 ..................................................................................... 21
A.6 Board – Mid Layer 2 ..................................................................................... 22
A.7 Board – Bottom Copper ............................................................................... 23
A.8 Board – Bottom Layer .................................................................................. 24
Appendix B. Bill of Materials (BOM)........................................................................... 25
Worldwide Sales and Service .................................................................................... 28
 2016 Microchip Technology Inc.
DS50002478A-page 5
MIC4609 Evaluation Board User’s Guide
NOTES:
DS50002478A-page 6
 2016 Microchip Technology Inc.
MIC4609 EVALUATION BOARD
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MIC4609 Evaluation Board. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in This Guide
Recommended Reading
The Microchip Web Site
Customer Support
Revision History
DOCUMENT LAYOUT
This document describes how to install the MIC4609 Evaluation Board. It also
describes how to operate the Evaluation Board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MIC4609
Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with the MIC4609 Evaluation Board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the MIC4609 Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
MIC4609 Evaluation Board.
 2016 Microchip Technology Inc.
DS50002478A-page 7
Preface
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, Italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Examples
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
RECOMMENDED READING
This user's guide describes how to use MIC4609 Evaluation Board. Another useful
document is listed below. The following Microchip document is available and
recommended as supplemental reference resource:
• MIC4609 Data Sheet – “600V 3-Phase MOSFET/IGBT Driver” (DS20005531A)
 2016 Microchip Technology Inc.
DS50002478A-page 8
Preface
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website
is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.
REVISION HISTORY
Revision A (March 2016)
• Original release of this document.
 2016 Microchip Technology Inc.
DS50002478A-page 9
Preface
NOTES:
 2016 Microchip Technology Inc.
DS50002478A-page 10
MIC4609 EVALUATION BOARD
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MIC4609 Evaluation Board and covers the
following topics:
• MIC4609 Short Overview
• What is the MIC4609 Evaluation Board?
• MIC4609 Evaluation Board Kit Contents
1.2
MIC4609 SHORT OVERVIEW
The MIC4609 Evaluation Board is a 600V, 3-Phase driver that can be used with either
IGBTs or MOSFETs. The MIC4609 features a 300 ns typical input filtering time to prevent unwanted pulses and a 550 ns of propagation delay. The board is available in an
28-pin wide SOIC package, with an operating junction temperature range of –40°C to
+125°C.
1.3
WHAT IS THE MIC4609 EVALUATION BOARD?
The board is comprised of the MIC4609 3-phase driver, 6 IGBTs and provisions for
current/voltage sensing. Right angle header J1 provides an interface to a controller
board for input drive signals, control signals and VDD/AVDD supply voltages. The input
drive signals may also be accessed with jumpers J2, J3, J5, J6, J10 and J11. TP4 and
J16 are connected to the VDD supply voltage. The high voltage VBUS, power ground
and the 3-phase motor connections are made through connector J9.
1.4
MIC4609 EVALUATION BOARD KIT CONTENTS
The MIC4609 Evaluation Board includes the following items:
• MIC4609 Evaluation Board (ADM00749)
• Important Information Sheet
 2016 Microchip Technology Inc.
DS50002478A-page 11
MIC4609 Evaluation Board User’s Guide
NOTES:
DS50002478A-page 12
 2016 Microchip Technology Inc.
MIC4609 EVALUATION BOARD
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
SYSTEM AND CONFIGURATION REQUIREMENTS
The MIC4609 Evaluation Board requires a VDD power supply with an output between
10V and 20V, an AVDD supply of 3.3V or 5V and a high voltage VBUS power supply that
is used to driver the Motor or other load. Do not exceed 450V on VBUS unless C17 is
removed.
Note:
2.2
The evaluation board does not have reverse polarity protection. Applying a
negative voltage to the VBUS (J16), VAVDD (J1.12) or VDD (J16 or J1.10)
terminals may damage the device. Do not exceed 450V on VBUS due to the
450V rating of the 10 µF Aluminum Electrolytic capacitor (C17). Remove
C17 if voltages between 450V and 600V are required.
CIRCUIT DESCRIPTION
The MIC4609 driver stage interfaces the incoming PWM signals to the IGBT power
stage. Refer to the MIC4609 data sheet for detailed information on the driver’s
operation. Figure 2-1 is a partial schematic showing the components for phase A.
VDD
C15
D15
VIN
VDD
AHB
R19
C4
AHI Level
shift
D12
AHO
R14
AHS
R22 R59
D17
R20
Phase
A
D7
Q3
R15
ALI
ALO
VSS
COM
Phase
B
Q6
M
Phase
C
R62
R18
Common return
connection for
Phase B and C
R21/
R58
FIGURE 2-1:
Phase A Circuitry
A resistor diode network is connected between the high and low-side driver output and
the IGBT gate. Resistors R14 and R15 limit the driver output current into the gate,
which slows down both the turn-on and turn-off of the IGBTs. The diode resistor
combination in parallel with the series resistors (R19/D12 and R20/D7) allows the turn
off to be faster than the turn-on.
 2016 Microchip Technology Inc.
DS50002478A-page 13
MIC4609 Evaluation Board User’s Guide
Resistor R22 and diode D17 clamp the HS pin to prevent it from going too negative.
This can occur when the high-side IGBT turns off and the motor current freewheels
through the low-side IGBT (Q3).
Resistors R59 and R62 prevent charge from building up on the gates (and causing
shoot-through current if both IGBTs turn-on) when VIN is present but VDD is not.
Current sense resistors in Phase A (R18) and Phase B (R35, not shown) provide a
current signal to the controller for FOC or similar control architectures. Phase C does
not have a sense resistor.
Parallel resistors R21 and R58 sense the current from all three phases and are used
for overcurrent detection. The voltage across these resistors is sensed by the OC
circuitry in the MIC4609, which shuts off the driver outputs if the OC threshold is
exceeded.
2.2.1
Overcurrent and Fault circuitry
The MIC4609 can detect an overcurrent condition by sensing the voltage across a
current sense resistor (R21/R58) and comparing it to an internal reference. If the peak
voltage sensed exceeds the reference, the output drivers are turned off for a period of
time before being allowed to turn back on. The delay is set with capacitor C31. Refer
to the MIC4609 data sheet for additional information on setting the delay.
The FAULT pin goes low during the overcurrent event. This signal can be read by the
controller to indicate a fault condition. The FAULT pin is pulled up to AVDD with a 100 k
resistor. The fault signal can be monitored on TP1 or on pin 7 of jumper J1.
2.2.2
Enable Pin (EN)
A 3-pin header (J8) connected to the enable pin allows it to be set high (ON) or low
(OFF). When the jumper is set high, it is pulled up to AVDD through a 1 k resistor. The
signal is connected to pin 9 of J1. A high level on the EN pin turns ON the internal bias’
in the driver and allows the driver to operate normally. Setting the EN pin low puts the
device into a low IQ state and turns off all six driver outputs.
An external connection may be used to set the EN pin state. When using an external
connection, make sure the EN pin voltage does not exceed VDD.
2.2.3
Input Pins (xHI/xLI)
Connections to the six input pins are made through connector J1 (pins 1-6) or through
individual headers (J2, J3, J5, J6, J10, and J11). The individual headers can be used
to monitor the signals or to set them high or low.
Resistors in series with the inputs (as well as the EN and FAULT pins) can be used to
limit current back to the controller if there is a fault condition or reverse voltage
connection.
2.2.4
Power and Motor connections
There are four voltage dividers on the board that provide sensing feedback to the
controller:
• VBUS_SNS monitors the high voltage BUS
• FB_PHA, FB_PHB and FB_PHC monitor the phase voltages.
RECN is the reconstructed neutral voltage. These signals are filtered and clamped to
AVDD for noise and surge overvoltage protection.
DS50002478A-page 14
 2016 Microchip Technology Inc.
Installation and Operation
The sense voltage is the output of the voltage dividers and can be calculated using the
following equation:
EQUATION 2-1:
R41
VFB_PHA = V PhaseA   --------------------------------------------
R41 + R44 + R48
Similar calculations are made for Phases B, C and the VBUS sense.
The resistor values on the board generate a 2V FB signal for a 300V BUS or phase
voltage. If higher or lower voltage motors are used, the resistor divider values must be
recalculated.
2.2.5
Power Stage and Motor connections
The VBUS and power GND connections as well as the three motor phase connections
are accessed through connector J9. In the existing evaluation board configuration, the
maximum voltage on VBUS is 450V DC. This is limited by the voltage rating of the
electrolytic capacitor, C17. If the capacitor is removed, VBUS can increase to 600V.
Locations for an RC snubber for each of the phase nodes are located on the back of
the board. These are not populated but are available to attenuate ringing if necessary.
 2016 Microchip Technology Inc.
DS50002478A-page 15
MIC4609 Evaluation Board User’s Guide
NOTES:
DS50002478A-page 16
 2016 Microchip Technology Inc.
MIC4609 EVALUATION BOARD
USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MIC4609
Evaluation Board:
•
•
•
•
•
•
•
Board – Schematic
Board – Top Layer
Board – Top Copper
Board – Mid Layer 1
Board – Mid Layer 2
Board – Bottom Copper
Board – Bottom Layer
 2016 Microchip Technology Inc.
DS50002478A-page 17
BOARD – SCHEMATIC
2
D13
VDD
US1M-TP
D14
US1M-TP
1
VDD
1
3
0
0
CHI
FAULT
AVDD
R51
BLI
R4
100k
1
2
AHO
3
BHI
AHS
4
CHI
NC
5
ALI
BHB
BHO
BHS
9
ISNS
3
1NF
AGND
AGND
11 RCIN
12 VSS
NC
CHB
CHO
CHS
NC
20
MIC4609YWM
C24
AGND
VDD
AVDD
 2016 Microchip Technology Inc.
2
4
6
8
10
12
Shunt High Sum Rtn
14
Shunt High 2 Rtn
16
Shunt High 1 Rtn
18
FB_PHC
20
RECN
22
24
AHI
CHI
BLI
FAULT
1
3
5
7
9
11
13
15
17
19
21
23
C6
1UF/25V
17
VBUS_SNS
Shunt High Sum
Shunt High 2
Shunt High 1
FB_PHB
FB_PHA
D19 D16
US1M-TP
US1M-TP
TP2
TP3
C20
10UF/25V
AGND
R9
C18 1k
1nF
C12
R20
0
D7
J9
AGND
Phase B
5
Phase C
Q3
1
Shunt High 1 R10
R29
NF
C10
NF
C19
20k
NF
R3
NF
C1
NF
R44
75K
R45
75K
R46
75K
R48
75K
R56
75K
R57
75K
D8
0
ED2612
FB_PHBR12
332
R25
10k
FB_PHC
R17
332
R30
R31
10k
10k
AVDD
Q2
R63
20k
IRG4BC20KD
R34
0
R35
0.05
Shunt High 2 Rtn R36
1N5819HW
RECN
1
1N5819HW
Shunt High 2
FB_PHA R11
332
R18
0.05
0
R2
R16
NF
Phase A
R62
Shunt High 1 Rtn R24
D9
GND
4
R23
R15
10
VBUS
2
3
IRG4BC20KD
1N5819HW
1
10
R28
R33
TP5
1UF/630V
R13
2
3
1
D1
0
1
10
C23
1UF/630V
Q4
IRG4BC20KD
D17
US1M-TP
0
AVDD
VBUS_SNS
10
R7
Header 12X2
C9
1
0
EN
R8
75K
C7
Q5
IRG4BC20KD
R61
20k
16
10
R49
0
R5
75K
10
1UF/25V
J1
BHI
ALI
CLI
R60
20k
R22
1UF/25V
18
BLO 15
C17
10uF/450V
1UF/630V 1UF/630V
R1
10
C15
19
C5
1
1N5819HW
D10
1N5819HW
R6
0
21
ALO
1UF/630V
Q6
IRG4BC20KD
D11
0
14 CLO
20k
10
22
13 COM
R59
C11
R27
R32
23
BLI
C2
1UF/630V
1
10
24
CLI
FAULT
R14
25
7
8
D12
0
26
VBUS
1N5819HW
R19
27
6
10 EN
C31
J8
ENABLE
AHI
0
TP1
EN
R38
1k
AHB
2
0
R39
0
R54
0
CLI R55
ALI
AVDD
R50
0
R52
28
VDD
1
+
R53
U1
2
1
2
BHI
US1M-TP
AGND
AGND
AHI
C32
1UF/25V
3
AGND
AGND
C14
1NF
2
3
C4
10UF/25V
R64
20k
3
2 J16
2
2 AHI
3
2
ALI
3
J6
1
J2
D15
2
3
TP4
3
3
BLI
2
1
J10 2
BHI
2
J3
3
3
CHI
2
J11
3
2
CLI
1
3
J5
1
AVDD
1
AVDD
Q1
IRG4BC20KD
Diode Schottky Dual AK
R41
1k
Shunt High Sum R37
0
AGND
R26
1UF/25V
C8
10
1nF
R40
0
AGND
R47
Shunt High Sum Rtn
0
R21
0.05
R58
0.05
C28
1nF
3
2
2
3
1
D2
Diode Schottky Dual AK
R42
1k C29
1nF
1
D3
Diode Schottky Dual AK
R43 C30
1k 1nF
MIC4609 Evaluation Board User’s Guide
DS50002478A-page 18
A.2
Schematic and Layouts
A.3
BOARD – TOP LAYER
 2016 Microchip Technology Inc.
DS50002478A-page 19
MIC4609 Evaluation Board User’s Guide
A.4
BOARD – TOP COPPER
DS50002478A-page 20
 2016 Microchip Technology Inc.
Schematic and Layouts
A.5
BOARD – MID LAYER 1
 2016 Microchip Technology Inc.
DS50002478A-page 21
MIC4609 Evaluation Board User’s Guide
A.6
BOARD – MID LAYER 2
DS50002478A-page 22
 2016 Microchip Technology Inc.
Schematic and Layouts
A.7
BOARD – BOTTOM COPPER
 2016 Microchip Technology Inc.
DS50002478A-page 23
MIC4609 Evaluation Board User’s Guide
A.8
BOARD – BOTTOM LAYER
DS50002478A-page 24
 2016 Microchip Technology Inc.
MIC4609 EVALUATION BOARD
USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty.
BILL OF MATERIALS (BOM)
Reference
Description
Manufacturer
Part Number
3
C1, C10, C19
1206 size capacitor
DO NOT POPULATE
6
C2, C5, C7, C9, C11, C12 1 µF/630V
2
C4, C20
10 µF/25V
TDK Corporation C2012X5R1E106K085AC
5
C6, C15, C23, C24, C32
1 µF/25V
TDK Corporation C1608X7R1E105K080AB
7
C8, C14, C18, C28, C29,
C30, C31
1nF/50V
TDK Corporation C1608X7R1H102K080AE
1
C17
10 µF/450V Al. El
Panasonic® ECG
EEU-EE2W100
1
U1
600V, 3-phase driver
Microchip
Technology, Inc.
MIC4609YWM
3
R3, R16, R29
1206 size resistor
DO NOT POPULATE
100K, 1%, 1/4W
TDK Corporation CKG57NX7T2J105M500JH
1
R4
10
R1, R2, R13, R14, R15,
10, 1%, 1/10W
R22, R23, R26, R27, R28
Panasonic- ECG ERJ-3EKF10R0V
5
'R9, R38, R41, R42, R43
1k, 1%, 1/10W
Panasonic- ECG ERJ-3EKF1001V
3
R25, R30, R31
10K, 1%, 1/10W
Panasonic- ECG ERJ-3EKF1002V
8
R5, R8, R44, R45, R46,
R48, R56, R57
75K, 1%, 1/4W
Panasonic- ECG ERJ-8ENF7502V
21
R6, R7, R10, R19, R20,
0, 1%, 1/10W
R24, R32, R33, R34, R36,
R37, R39, R40, R47, R49,
R50, R51, R52, R53, R54,
R55
Panasonic- ECG ERJ-3GEY0R00V
3
R11, R12, R17
332,1%, 1/10W
Panasonic- ECG ERJ-3EKF3320V
4
R18, R21, R35, R58
0.05, 1W 1%
Panasonic- ECG ERJ-M1WSF50MU
6
R59, R60, R61, R62, R63, 20K, 1%, 1/10W
R64
Note 1:
Panasonic- ECG ERJ-3EKF1003V
Panasonic- ECG ERJ-3EKF2002V
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
 2016 Microchip Technology Inc.
DS50002478A-page 25
MIC4609 Evaluation Board User’s Guide
TABLE B-2:
Qty
BILL OF MATERIALS (BOM) - MECHANICAL PARTS
Reference
Description
Manufacturer
Incorporated®
Part Number
3
D1, D2, D3
Diode Schottky Dual AK 40V/200mA Diodes
6
D7, D8, D9, D10,
D11, D12
Schottky, 1A/40V
Diodes Incorporated
1N5819HW
6
D13, D14, D15,
D16, D17, D19
100V/1A Ultra fast diode
Diodes Incorporated
US1M-TP
1
J1
68021-224HLF
8
J2, J3, J5, J6, J8,
J10, J11, J16
Header, 12-Pin, dual row, right angle FCI
FCI
Header, 3-pin
1
J9
5 position terminal block
ED2612
6
Q1, Q2, Q3, Q4,
Q5, Q6 (Note 2)
IGBT
Infineon Technologies AG
IRG4BC20KD
IGBT
Infineon Technologies AG
IKB06N60T
IGBT
Fairchild Semiconductor®
SGW10N60RUFD
IGBT
STMicroelectronics
STGB10NC60KD
Note 1:
2:
BAS40-04
68000-103HLF
On-Shore Technology, Inc.
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
Note that only one set of six IGBTs are used at a time. You can choose the IGBT produced by
one of the three listed manufacturers.
DS50002478A-page 26
 2016 Microchip Technology Inc.
Bill of Materials (BOM)
NOTES:
 2016 Microchip Technology Inc.
DS50002478A-page 27
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DS50002478A-page 28
 2016 Microchip Technology Inc.