Data Sheet

74HC273-Q100; 74HCT273-Q100
Octal D-type flip-flop with reset; positive-edge trigger
Rev. 1 — 19 June 2013
Product data sheet
1. General description
The 74HC273-Q100; 74HCT273-Q100 is an octal positive-edge triggered D-type flip-flop.
The device features clock (CP) and master reset (MR) inputs. The outputs Qn assume the
state of their corresponding Dn inputs that meet the set-up and hold time requirements on
the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW
independently of clock and data inputs. Inputs include clamp diodes which enable the use
of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Input levels:
 For 74HC273-Q100: CMOS level
 For 74HCT273-Q100: TTL level
 Common clock and master reset
 Eight positive edge-triggered D-type flip-flops
 Complies with JEDEC standard no. 7A
 ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V.
 Multiple package options
3. Ordering information
Table 1.
Ordering information
Type number
74HC273D-Q100
Package
Temperature range Name
Description
Version
40 C to +125 C
SO20
plastic small outline package; 20 leads; body width
7.5 mm
SOT163-1
40 C to +125 C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
40 C to +125 C
DHVQFN20 plastic dual in-line compatible thermal enhanced
very thin quad flat package; no leads; 20 terminals;
body 2.5  4.5  0.85 mm
74HCT273D-Q100
74HC273PW-Q100
74HCT273PW-Q100
74HC273BQ-Q100
74HCT273BQ-Q100
SOT764-1
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
4. Functional diagram
CP
MR
11
1
C1
R
11
3
4
7
8
13
14
17
18
1
11
D0
D1
D2
D3
D4
D5
D6
D7
FF1
TO
FF8
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
2
5
6
9
12
15
16
19
3
4
7
8
13
14
17
MR
18
CP
Functional diagram
74HC_HCT273_Q100
Product data sheet
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
2
5
1
Fig 2.
D1
6
D2
9
D3
12
15
16
19
MR
001aae055
Fig 1.
D0
CP
D4
D5
D6
D7
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
2
1D
4
5
7
6
8
9
13
12
14
15
17
16
18
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
mna764
mna763
Logic symbol
3
Fig 3.
IEC logic symbol
© NXP B.V. 2013. All rights reserved.
2 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
D0
D1
D
Q
D2
D
Q
D3
D
Q
D
Q
CP
FF1
CP
FF2
CP
FF3
CP
FF4
RD
RD
RD
RD
CP
MR
Q0
D4
Q1
D5
D
Q
Q2
D6
D
Q
Q3
D7
D
Q
D
Q
CP
FF5
CP
FF6
CP
FF7
CP
FF8
RD
RD
RD
RD
Q4
Q5
Q6
Q7
001aae056
Fig 4.
Logic diagram
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
3 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
5. Pinning information
5.1 Pinning
05
WHUPLQDO
LQGH[DUHD
+&4
+&74
9&&
+&4
+&74
4
4
'
'
'
'
05
9&&
4
4
'
'
4
4
4
'
4
4
'
4
4
'
'
'
'
4
4
*1' &3
'
4
*1' '
4
'
*1' &3 '
4
DDD
7UDQVSDUHQWWRSYLHZ
DDD
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5.
Pin configuration SO20 and TSSOP20
Fig 6.
Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
MR
1
master reset input (active LOW)
Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7
2, 5, 6, 9, 12, 15, 16, 19
flip-flop output
D0, D1, D2, D3, D4, D5, D6, D7
3, 4, 7, 8, 13, 14, 17, 18
data input
GND
10
ground (0 V)
CP
11
clock input (LOW-to-HIGH, edge-triggered)
VCC
20
supply voltage
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
4 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
6. Functional description
Table 3.
Function table[1]
Operating modes
Inputs
Outputs
MR
CP
Dn
Qn
reset (clear)
L
X
X
L
load “1”
H

h
H
load “0”
H

l
L
[1]
H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition;
X = don’t care;
 = LOW-to-HIGH clock transition.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V)
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+7
V
-
20
mA
-
20
mA
-
25
mA
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
[1]
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
supply current
-
50
mA
IGND
ground current
50
-
mA
Tstg
storage temperature
65
+150
C
-
500
mW
total power dissipation
Ptot
[1]
[2]
Tamb = 40 C to +125 C
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For SO20 package: above 70 C the value of Ptot derates linearly with 8 mW/K.
For TSSOP20 package: above 60 C the value of Ptot derates linearly with 5.5 mW/K.
For DHVQFN20 package: Ptot derates linearly with 4.5 mW/K above 60 C.
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
5 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter
Conditions
74HC273-Q100
Min
Typ
74HCT273-Q100
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
40
-
+125
40
-
+125
C
t/V
input transition rise and fall rate
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
1.2
-
1.5
-
1.5
-
V
VCC = 4.5 V
3.15
2.4
-
3.15
-
3.15
-
V
VCC = 6.0 V
4.2
3.2
-
4.2
-
4.2
-
V
VCC = 2.0 V
-
0.8
0.5
-
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
1.35
-
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
1.8
-
1.8
-
1.8
V
IO = 20 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 20 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 20 A; VCC = 6.0 V
5.9
6.0
-
5.9
-
5.9
-
V
IO = 4.0 mA; VCC = 4.5 V
3.98
4.32
-
3.84
-
3.7
-
V
IO = 5.2 mA; VCC = 6.0 V
5.48
5.81
-
5.34
-
5.2
-
V
IO = 20 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 6.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
-
0.16
0.26
-
0.33
-
0.4
V
74HC273-Q100
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
HIGH-level
output voltage
LOW-level
output voltage
VI = VIH or VIL
VI = VIH or VIL
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
0.1
-
1
-
1
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
8.0
-
80
-
160
A
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
6 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
CI
25 C
Conditions
input
capacitance
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
-
3.5
-
-
-
-
-
pF
74HCT273-Q100
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA
3.98
4.32
-
3.84
-
3.7
-
V
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 5.2 mA; VCC = 5.5 V
-
0.15
0.26
-
0.33
-
0.4
V
VOL
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
-
0.1
-
1
-
1
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
8.0
-
80
-
160
A
ICC
additional
supply current
per input pin;
VI = VCC  2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
CI
MR input
-
100
360
-
450
-
490
A
CP input
-
175
630
-
787.5
-
857.5
A
Dn input
-
15
54
-
67.5
-
73.5
A
-
3.5
-
-
-
-
-
pF
input
capacitance
10. Dynamic characteristics
Table 7.
Dynamic characteristics
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
-
41
150
-
185
-
225
ns
VCC = 4.5 V
-
15
30
-
37
-
45
ns
VCC = 5.0 V; CL = 15 pF
-
15
-
-
-
-
-
ns
VCC = 6.0 V
-
13
26
-
31
-
38
ns
74HC273-Q100
tpd
propagation
delay
74HC_HCT273_Q100
Product data sheet
[1]
CP to Qn; see Figure 7
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
7 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
Table 7.
Dynamic characteristics …continued
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
tPHL
HIGH to LOW
propagation
delay
25 C
Conditions
tW
transition time
pulse width
Min
Typ
Max
Min
Max
Min
Max
MR to Qn; see Figure 8
VCC = 2.0 V
-
44
150
-
185
-
225
ns
VCC = 4.5 V
-
16
30
-
37
-
45
ns
VCC = 5.0 V; CL = 15 pF
-
15
-
-
-
-
-
ns
-
14
26
-
31
-
38
ns
VCC = 2.0 V
-
19
75
-
95
-
110
ns
VCC = 4.5 V
-
7
15
-
19
-
22
ns
VCC = 6.0 V
-
6
13
-
15
-
19
ns
VCC = 2.0 V
80
14
-
100
-
120
-
ns
VCC = 4.5 V
16
5
-
20
-
24
-
ns
VCC = 6.0 V
14
4
-
17
-
20
-
ns
VCC = 2.0 V
60
17
-
75
-
90
-
ns
VCC = 4.5 V
12
6
-
15
-
18
-
ns
VCC = 6.0 V
10
5
-
13
-
15
-
ns
VCC = 2.0 V
50
6
-
65
-
75
-
ns
VCC = 4.5 V
10
2
-
13
-
15
-
ns
VCC = 6.0 V
9
2
-
11
-
13
-
ns
VCC = 2.0 V
60
11
-
75
-
90
-
ns
VCC = 4.5 V
12
4
-
15
-
18
-
ns
VCC = 6.0 V
10
3
-
13
-
15
-
ns
VCC = 2.0 V
3
6
-
3
-
3
-
ns
VCC = 4.5 V
3
2
-
3
-
3
-
ns
VCC = 6.0 V
3
2
-
3
-
3
-
ns
VCC = 2.0 V
6
20.6
-
4.8
-
4
-
MHz
VCC = 4.5 V
30
103
-
24
-
20
-
MHz
-
66
-
-
-
-
-
MHz
35
122
-
28
-
24
-
MHz
-
20
-
-
-
-
-
pF
VCC = 6.0 V
tt
40 C to +85 C 40 C to +125 C Unit
Qn output; see Figure 7
[2]
CP input HIGH or LOW;
see Figure 7
MR input LOW;
see Figure 8
trec
tsu
th
fmax
recovery time
set-up time
hold time
maximum
frequency
MR to CP; see Figure 8
Dn to CP; see Figure 9
Dn to CP; see Figure 9
CP input; see Figure 7
VCC = 5.0 V; CL = 15 pF
VCC = 6.0 V
CPD
power
dissipation
capacitance
74HC_HCT273_Q100
Product data sheet
per package;
VI = GND to VCC
[3]
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
8 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
Table 7.
Dynamic characteristics …continued
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 4.5 V
-
16
30
-
38
-
45
ns
VCC = 5.0 V; CL = 15 pF
-
15
-
-
-
-
-
ns
74HCT273-Q100
tpd
tPHL
tt
propagation
delay
HIGH to LOW
propagation
delay
transition time
[1]
CP to Qn; see Figure 7
MR to Qn; see Figure 8
VCC = 4.5 V
-
23
34
-
43
-
51
ns
VCC = 5.0 V; CL = 15 pF
-
20
-
-
-
-
-
ns
-
7
15
-
19
-
22
ns
16
9
-
20
-
24
-
ns
16
8
-
20
-
24
-
ns
10
2
-
13
-
15
-
ns
12
5
-
15
-
18
-
ns
3
4
-
3
-
3
-
ns
Qn output; see Figure 7
[2]
VCC = 4.5 V
tW
pulse width
CP input; see Figure 7
VCC = 4.5 V
MR input LOW;
see Figure 8
VCC = 4.5 V
trec
recovery time
MR to CP; see Figure 8
VCC = 4.5 V
tsu
set-up time
Dn to CP; see Figure 9
th
hold time
Dn to CP; see Figure 9
VCC = 4.5 V
VCC = 4.5 V
fmax
maximum
frequency
CP input; see Figure 7
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
CPD
[1]
power
dissipation
capacitance
per package;
VI = GND to VCC  1.5 V
[3]
30
56
-
24
-
20
-
MHz
-
36
-
-
-
-
-
MHz
-
23
-
-
-
-
-
pF
tpd is the same as tPHL and tPLH.
[2]
tt is the same as tTHL and tTLH.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
 (CL  VCC2  fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in V.
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
9 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
11. Waveforms
1/fmax
VI
CP input
VM
VM
GND
tW
tW
t PHL
t PLH
VOH
90%
VM
10%
Qn output
VOL
tTHL
tTLH
001aae062
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Propagation delay clock input (CP) to output (Qn), clock (CP) pulse width, output transition time and the
maximum clock pulse frequency
VI
VM
MR input
GND
tW
trec
VI
CP input
VM
GND
tPHL
VOH
VM
Qn output
VOL
mna464
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Propagation delay master reset (MR) to output (Qn), pulse width master reset (MR) and recovery time
master reset (MR) to clock (CP)
74HC_HCT273_Q100
Product data sheet
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Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
10 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
VI
VM
CP input
GND
t su
t su
th
th
VI
VM
Dn input
GND
VOH
VM
Qn output
VOL
mna767
Measurement points are given in Table 8.
The shaded areas indicate when the input is permitted to change for predictable output performance.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9.
Table 8.
Data set-up and hold times data input (Dn)
Measurement points
Type
Input
Output
VI
VM
VM
74HC273-Q100
VCC
0.5VCC
0.5VCC
74HCT273-Q100
3V
1.3 V
1.3 V
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
11 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
G
VI
VO
RL
S1
open
DUT
CL
RT
001aad983
Test data is given in Table 9.
Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch
Fig 10. Test circuit for measuring switching times
Table 9.
Test data
Type
Input
VI
tr, tf
CL
RL
tPHL, tPLH
74HC273-Q100
VCC
6 ns
15 pF, 50 pF
1 k
open
74HCT273-Q100
3V
6 ns
15 pF, 50 pF
1 k
open
74HC_HCT273_Q100
Product data sheet
Load
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
S1 position
© NXP B.V. 2013. All rights reserved.
12 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT163-1 (SO20)
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
13 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
Fig 12. Package outline SOT360-1 (TSSOP20)
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
14 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT764-1
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
9
y
y1 C
v M C A B
w M C
b
L
1
10
Eh
e
20
11
19
12
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.6
4.4
3.15
2.85
2.6
2.4
1.15
0.85
0.5
3.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT764-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 13. Package outline SOT764-1 (DHVQFN20)
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
15 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MIL
Military
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT273_Q100 v.1
20130619
Product data sheet
-
-
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
16 of 19
74HC273-Q100; 74HCT273-Q100
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT273_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
17 of 19
NXP Semiconductors
74HC273-Q100; 74HCT273-Q100
Octal D-type flip-flop with reset; positive-edge trigger
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT273_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2013
© NXP B.V. 2013. All rights reserved.
18 of 19
NXP Semiconductors
74HC273-Q100; 74HCT273-Q100
Octal D-type flip-flop with reset; positive-edge trigger
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 June 2013
Document identifier: 74HC_HCT273_Q100