KC Package 8-Lead Plastic UTDFN (2mm × 2mm) (Reference LTC DWG # 05-08-1749 Rev Ø) 1.37 ± 0.05 0.70 ± 0.05 2.55 ± 0.05 0.64 ± 0.05 1.15 ± 0.05 PACKAGE OUTLINE 1.35 REF 0.25 ± 0.05 0.45 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP 5 R = 0.05 TYP 2.00 ± 0.10 2.00 ± 0.10 1.37 ± 0.10 8 0.40 ± 0.10 PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER 0.64 ± 0.10 PIN 1 BAR TOP MARK (SEE NOTE 6) (KC8) UTDFN 0107 REVØ 4 0.125 REF 0.55 ± 0.05 0.00 – 0.05 1 0.23 ± 0.05 0.45 BSC 1.35 REF BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE