05-08-1749

KC Package
8-Lead Plastic UTDFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1749 Rev Ø)
1.37 ± 0.05
0.70 ± 0.05
2.55 ± 0.05
0.64 ± 0.05
1.15 ± 0.05
PACKAGE
OUTLINE
1.35 REF
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
TYP 5
R = 0.05
TYP
2.00 ± 0.10
2.00 ± 0.10
1.37 ± 0.10
8
0.40 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
0.64 ± 0.10
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
(KC8) UTDFN 0107 REVØ
4
0.125 REF
0.55 ± 0.05
0.00 – 0.05
1
0.23 ± 0.05
0.45 BSC
1.35 REF
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
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