KD Package 10-Lead Plastic UTDFN (3mm × 3mm) (Reference LTC DWG #05-08-1739 Rev Ø) 2.00 REF 0.675 ± 0.05 3.50 ± 0.05 2.15 ± 0.05 2.38 ±0.05 1.65 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.40 ± 0.10 2.00 REF 3.00 ± 0.10 R = 0.05 TYP 3.00 ± 0.10 6 10 2.38 ±0.10 1.65 ± 0.10 PIN 1 TOP MARK (SEE NOTE 6) 0.125 REF 0.55 ± 0.05 0.00 – 0.05 5 R = 0.115 TYP 1 (KD10) UTDFN 1106 REV Ø 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI). 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE