05-08-1739

KD Package
10-Lead Plastic UTDFN (3mm × 3mm)
(Reference LTC DWG #05-08-1739 Rev Ø)
2.00 REF
0.675 ± 0.05
3.50 ± 0.05
2.15 ± 0.05
2.38 ±0.05
1.65 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.40 ± 0.10
2.00 REF
3.00 ± 0.10
R = 0.05
TYP
3.00 ± 0.10
6
10
2.38 ±0.10
1.65 ± 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
0.125 REF
0.55 ± 0.05
0.00 – 0.05
5
R = 0.115
TYP
1
(KD10) UTDFN 1106 REV Ø
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
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